LCMXO1200C-3BN256I
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 211 9421 1200 256-LFBGA, CSPBGA |
|---|---|
| Quantity | 1,176 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA, CSPBGA | Number of I/O | 211 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 150 | Number of Logic Elements/Cells | 1200 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 9421 |
Overview of LCMXO1200C-3BN256I – MachXO Field Programmable Gate Array (FPGA), 1200 logic elements, 211 I/Os, 256-LFBGA
The LCMXO1200C-3BN256I is a MachXO family FPGA IC that combines non-volatile configuration with FPGA-style logic and memory resources. It provides 1200 logic elements and up to 211 general-purpose I/Os in a 256-ball LFBGA/CSPBGA package, aimed at industrial embedded control, interface bridging, and glue-logic roles where instant-on behavior and flexible I/O are important.
Designed for system integration and reliability, the device supports a wide supply-voltage window and an industrial operating temperature range, making it suitable for a broad set of embedded system applications requiring reconfigurability and low BOM complexity.
Key Features
- Non-volatile, Instant-on Configuration Single-chip non-volatile architecture provides instant-on operation and eliminates the need for external configuration memory.
- Logic Capacity 1200 logic elements suitable for glue logic, bus interfacing, control tasks, and small to medium control functions.
- Flexible Memory On-chip memory includes approximately 9.2 Kbits of embedded block RAM (EBR) plus approximately 6.4 Kbits of distributed RAM for FIFO, buffering, and small data storage.
- I/O and Interfaces Up to 211 I/Os with programmable sysIO buffer support for LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus‑LVDS, LVPECL, and RSDS interface standards.
- Clocking Includes one sysCLOCK PLL to support clock multiply/divide and phase-shifting needs within system designs.
- Low-Power Modes Sleep mode capability enables significant static-current reduction for power-sensitive applications.
- Voltage and Temperature Operates across a 1.71 V to 3.465 V supply range and an industrial temperature range of −40 °C to 100 °C.
- Packaging & Mounting Supplied in a 256-ball LFBGA / CSPBGA package (supplier device package: 256‑CABGA, 14×14 mm); surface-mount mounting type.
- Compliance RoHS-compliant packaging for regulatory and manufacturing compatibility.
Typical Applications
- Glue Logic & System Control Implement startup sequencing, reset control, and small control-state machines where instant-on and non-volatile configuration simplify system behavior.
- Bus Bridging & Interfacing Bridge legacy and modern interfaces or perform protocol translation using flexible I/O standards and abundant I/Os.
- Power-Up Control Manage power sequencing and supervisory functions with fast, deterministic startup characteristics.
- Peripheral & Sensor Interfaces Aggregate and preprocess sensor or peripheral signals using distributed RAM and programmable I/O buffers.
Unique Advantages
- Instant-on, Single-Chip Solution: Non-volatile configuration eliminates external memory and delivers immediate availability at power-up, reducing system complexity.
- In-field Reconfiguration: Supports background and in-field reprogramming to update logic while minimizing system downtime.
- High I/O Density: 211 available I/Os enable broad connectivity without external multiplexers or I/O expanders, simplifying board design.
- Flexible I/O Standards: Programmable sysIO buffers support multiple interface standards, enabling reuse across different board-level designs.
- Industrial Robustness: Rated for −40 °C to 100 °C operation and surface-mount packaging suited to industrial embedded systems.
- Reduced BOM and Footprint: Embedded block RAM and distributed memory reduce the need for external RAM components and simplify routing.
Why Choose LCMXO1200C-3BN256I?
The LCMXO1200C-3BN256I positions itself as a compact, non-volatile FPGA option for engineers who need instant-on behavior, flexible I/O, and reliable operation across an industrial temperature range. With 1200 logic elements, dedicated block RAM, a sysCLOCK PLL, and up to 211 I/Os in a 256-ball LFBGA package, it balances integration and configurability for control, bridging, and interface tasks.
This device fits designs that demand reduced BOM, deterministic power-up, and the ability to update logic in the field while preserving system uptime. Its programmable I/O and wide supply range make it adaptable across multiple system domains while RoHS compliance supports streamlined manufacturing.
Request a quote or submit an inquiry to receive pricing, lead time, and availability for the LCMXO1200C-3BN256I.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016