LCMXO1200C-3BN256I

IC FPGA 211 I/O 256CABGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 211 9421 1200 256-LFBGA, CSPBGA

Quantity 1,176 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LFBGA, CSPBGANumber of I/O211Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs150Number of Logic Elements/Cells1200
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits9421

Overview of LCMXO1200C-3BN256I – MachXO Field Programmable Gate Array (FPGA), 1200 logic elements, 211 I/Os, 256-LFBGA

The LCMXO1200C-3BN256I is a MachXO family FPGA IC that combines non-volatile configuration with FPGA-style logic and memory resources. It provides 1200 logic elements and up to 211 general-purpose I/Os in a 256-ball LFBGA/CSPBGA package, aimed at industrial embedded control, interface bridging, and glue-logic roles where instant-on behavior and flexible I/O are important.

Designed for system integration and reliability, the device supports a wide supply-voltage window and an industrial operating temperature range, making it suitable for a broad set of embedded system applications requiring reconfigurability and low BOM complexity.

Key Features

  • Non-volatile, Instant-on Configuration Single-chip non-volatile architecture provides instant-on operation and eliminates the need for external configuration memory.
  • Logic Capacity 1200 logic elements suitable for glue logic, bus interfacing, control tasks, and small to medium control functions.
  • Flexible Memory On-chip memory includes approximately 9.2 Kbits of embedded block RAM (EBR) plus approximately 6.4 Kbits of distributed RAM for FIFO, buffering, and small data storage.
  • I/O and Interfaces Up to 211 I/Os with programmable sysIO buffer support for LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus‑LVDS, LVPECL, and RSDS interface standards.
  • Clocking Includes one sysCLOCK PLL to support clock multiply/divide and phase-shifting needs within system designs.
  • Low-Power Modes Sleep mode capability enables significant static-current reduction for power-sensitive applications.
  • Voltage and Temperature Operates across a 1.71 V to 3.465 V supply range and an industrial temperature range of −40 °C to 100 °C.
  • Packaging & Mounting Supplied in a 256-ball LFBGA / CSPBGA package (supplier device package: 256‑CABGA, 14×14 mm); surface-mount mounting type.
  • Compliance RoHS-compliant packaging for regulatory and manufacturing compatibility.

Typical Applications

  • Glue Logic & System Control Implement startup sequencing, reset control, and small control-state machines where instant-on and non-volatile configuration simplify system behavior.
  • Bus Bridging & Interfacing Bridge legacy and modern interfaces or perform protocol translation using flexible I/O standards and abundant I/Os.
  • Power-Up Control Manage power sequencing and supervisory functions with fast, deterministic startup characteristics.
  • Peripheral & Sensor Interfaces Aggregate and preprocess sensor or peripheral signals using distributed RAM and programmable I/O buffers.

Unique Advantages

  • Instant-on, Single-Chip Solution: Non-volatile configuration eliminates external memory and delivers immediate availability at power-up, reducing system complexity.
  • In-field Reconfiguration: Supports background and in-field reprogramming to update logic while minimizing system downtime.
  • High I/O Density: 211 available I/Os enable broad connectivity without external multiplexers or I/O expanders, simplifying board design.
  • Flexible I/O Standards: Programmable sysIO buffers support multiple interface standards, enabling reuse across different board-level designs.
  • Industrial Robustness: Rated for −40 °C to 100 °C operation and surface-mount packaging suited to industrial embedded systems.
  • Reduced BOM and Footprint: Embedded block RAM and distributed memory reduce the need for external RAM components and simplify routing.

Why Choose LCMXO1200C-3BN256I?

The LCMXO1200C-3BN256I positions itself as a compact, non-volatile FPGA option for engineers who need instant-on behavior, flexible I/O, and reliable operation across an industrial temperature range. With 1200 logic elements, dedicated block RAM, a sysCLOCK PLL, and up to 211 I/Os in a 256-ball LFBGA package, it balances integration and configurability for control, bridging, and interface tasks.

This device fits designs that demand reduced BOM, deterministic power-up, and the ability to update logic in the field while preserving system uptime. Its programmable I/O and wide supply range make it adaptable across multiple system domains while RoHS compliance supports streamlined manufacturing.

Request a quote or submit an inquiry to receive pricing, lead time, and availability for the LCMXO1200C-3BN256I.

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