LAXP2-8E-5TN144E

The LAXP2-8E-5TN144E is a member of the LA‑LatticeXP2 family of flash-based FPGAs combining reconfigurable logic with on-chip non-volatile storage. This device pairs approximately 8,000 logic elements with approximately 226 kbits of on-chip RAM, 100 I/Os and a 144‑pin LQFP surface-mount package for compact, board-level integration.

Built with flexiFLASH architecture and family-level features such as instant-on, live-update capabilities and design security, the device is suited to embedded designs that require mid-range logic capacity, signal processing support and automotive-grade qualification (AEC‑Q100).

Key Features

• Core Architecture (flexiFLASH) Flash-based single-chip architecture enables instant-on and infinitely reconfigurable operation with on-chip FlashBAK block memory and serial TAG memory for design storage and security.
• Logic and Memory Approximately 8,000 logic elements and approximately 226,304 bits of embedded RAM provide mid-range programmable capacity for control, glue-logic and moderate data buffering.
• Signal Processing Resources Family-level sysDSP blocks and dedicated multipliers (documented in the LA‑LatticeXP2 family data sheet) support multiply-accumulate operations for DSP and control tasks.
• Flexible I/O 100 general-purpose I/Os in the 144‑LQFP package support a variety of interface standards as defined for the LA‑LatticeXP2 family, enabling connectivity to sensors, memory and high‑speed peripherals.
• Power and Clocking Operates from a 1.14 V to 1.26 V supply and includes on-chip PLLs (family-level up to four PLLs) for clock multiplication, division and phase adjustment.
• Automotive Qualification and Temperature Range AEC‑Q100 tested and qualified with an operating temperature range of −40 °C to 125 °C for designs targeting automotive environments.
• Package and Mounting 144‑LQFP (20 × 20 mm) surface-mount package balances I/O count (100) with a compact footprint for space-constrained boards.
• Standards and Security Family-level features include Live Update (TransFR) and secure update options with 128‑bit AES encryption and dual-boot image support for in-field firmware management and secure updates.
• RoHS Compliant Device is RoHS compliant for regulatory and manufacturing conformity.

Typical Applications

• Automotive Control Systems AEC‑Q100 qualification and wide operating temperature make the device suitable for automotive control subsystems and sensor interfacing where reprogrammability and in-field updates are required.
• Industrial Automation Mid-range logic capacity with DSP blocks and multipliers supports motor control, motion sequencing and industrial I/O aggregation.
• Embedded Signal Processing sysDSP blocks and on-chip RAM enable filtering, aggregation and preprocessing of sensor data in embedded measurement and monitoring nodes.
• Display and Interface Bridging Flexible I/O options and family-level pre‑engineered source synchronous interfaces support display drivers and protocol bridging in human-machine interfaces.

Unique Advantages

• Instant-on, reconfigurable flash architecture: flexiFLASH provides immediate availability at power-up and supports multiple reconfigurations without external configuration ROM.
• Automotive-grade qualification: AEC‑Q100 testing and a −40 °C to 125 °C rating give designers a validated option for automotive applications requiring extended temperature operation.
• Integrated security and live update: Family-level TransFR live update and 128‑bit AES support enable secure, field-deployable firmware updates and dual-boot configurations.
• Balanced mid-range capacity: Approximately 8,000 logic elements and ~226 kbits of on-chip RAM deliver a balance of logic, memory and DSP resources for common embedded processing tasks.
• Compact, board-friendly package: 144‑LQFP surface-mount package with 100 I/Os simplifies PCB routing while keeping the solution space-efficient.
• Low-voltage operation: 1.14–1.26 V supply range supports modern low-voltage system rails.

Why Choose LAXP2-8E-5TN144E?

The LAXP2-8E-5TN144E positions itself as a mid-range, flash-configured FPGA that combines reconfigurable logic, embedded RAM and DSP-friendly resources with automotive qualification. Its flexiFLASH architecture and family-level security and live-update features make it appropriate for designs that require in-field reconfigurability and secure firmware management.

This device is well suited to embedded engineers and system designers building compact, robust applications in automotive and industrial markets who need a balance of logic density, memory and interface flexibility backed by the LA‑LatticeXP2 family feature set.

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