LAXP2-5E-5TN144E
| Part Description |
LA-XP2 Field Programmable Gate Array (FPGA) IC 100 169984 5000 144-LQFP |
|---|---|
| Quantity | 1,259 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 100 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 625 | Number of Logic Elements/Cells | 5000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 169984 |
Overview of LAXP2-5E-5TN144E – LA-XP2 FPGA, 5K logic elements, 100 I/Os, 144‑LQFP
The LAXP2-5E-5TN144E is a LA‑LatticeXP2 field programmable gate array from Lattice Semiconductor, featuring the flexiFLASH architecture with on‑chip non‑volatile Flash for instant‑on and infinite reconfiguration. This device targets embedded applications that require moderate logic capacity with on‑chip memory, DSP resources and flexible I/O in a 144‑pin LQFP package.
With approximately 5,000 logic elements, about 170 kbits of embedded RAM (total RAM bits: 169,984), three sysDSP blocks and up to 100 I/Os, the part is positioned for markets that need integration, secure reconfiguration and extended temperature operation (‑40 °C to 125 °C). It is qualified to AEC‑Q100.
Key Features
- Core Architecture (flexiFLASH) Instant‑on, single‑chip FPGA fabric with on‑chip FlashBAK and serial TAG memory enabling infinitely reconfigurable designs and on‑chip non‑volatile configuration.
- Logic Capacity Approximately 5,000 logic elements and 625 logic blocks provide a compact LUT‑based fabric for mid‑density logic implementations.
- Embedded and Distributed Memory Approximately 170 kbits of embedded SRAM (total RAM bits: 169,984) for on‑chip data storage and fast buffering.
- sysDSP and Multipliers Includes three sysDSP blocks and 12 18×18 multipliers (LA‑XP2‑5 family) for hardware accelerated multiply‑accumulate operations.
- Flexible I/O and Interfaces Up to 100 I/Os in the 144‑pin package with sysIO support for LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, Bus‑LVDS, MLVDS, LVPECL and RSDS; pre‑engineered source synchronous interfaces including DDR/DDR2 and multi‑lane LVDS display support are available.
- Configuration, Security and Live Update flexiFLASH supports secure updates with TransFR live update technology and 128‑bit AES encryption, plus dual‑boot capability via external SPI.
- Clocking On‑chip sysCLOCK PLLs (up to two analog PLLs for the LA‑XP2‑5 device) allow clock multiplication, division and phase shifting.
- Package, Voltage and Temperature 144‑pin LQFP/TQFP (20 × 20 mm), VCC supply range 1.14 V to 1.26 V, and operating temperature from ‑40 °C to 125 °C. The device is AEC‑Q100 qualified for automotive applications.
- Standards and Tools Family support in Lattice design flow with pre‑engineered IP blocks and industry standard configuration interfaces; IEEE 1149.1 and IEEE 1532 compliance for system level support.
Typical Applications
- Automotive Body and Safety Electronics AEC‑Q100 qualification and extended temperature range make the device suitable for automotive subsystems requiring on‑chip configuration and secure updates.
- In‑vehicle Displays and Infotainment Interfaces Multi‑lane LVDS support and pre‑engineered source synchronous interfaces enable display bridging, panel interfaces and timing control functions.
- Industrial Control and Motor Drives Moderate logic and embedded memory, combined with DSPmultiply capabilities and flexible I/O, support control loops, sensor interfacing and deterministic I/O.
- Data Buffering and Memory Interfaces On‑chip EBR and source synchronous DDR/DDR2 interface support allow use as protocol bridge, buffering and custom memory interface logic.
Unique Advantages
- Instant‑on, Non‑volatile Reconfiguration: flexiFLASH architecture delivers on‑chip Flash configuration for fast startup and field reconfiguration without external programming steps.
- Secure Live Updates: TransFR live update technology with 128‑bit AES encryption and dual‑boot support allows secure in‑field firmware updates.
- Balanced Integration: Combines ~5k logic elements, substantial embedded RAM and sysDSP resources in a single 144‑pin package to reduce BOM and board area.
- Robust Operating Range: 1.14–1.26 V supply and ‑40 °C to 125 °C operating range support deployment in temperature‑challenging environments, with AEC‑Q100 qualification for automotive use.
- Flexible I/O Standards: Wide range of supported I/O standards simplifies interfacing to sensors, memories and high‑speed links without external translators.
Why Choose LAXP2-5E-5TN144E?
The LAXP2-5E-5TN144E offers a compact, mid‑density FPGA solution that combines non‑volatile flexiFLASH configuration, DSP acceleration and flexible high‑performance I/O in a 144‑pin package. Its mix of approximately 5,000 logic elements, ~170 kbits of embedded memory and dedicated multiplier blocks makes it suitable for embedded designs that require on‑chip reconfigurability, secure update capability and a robust operating range.
This device is a practical choice for OEMs developing automotive and industrial systems who need integration, secure field updates and a known qualification status (AEC‑Q100), supported by Lattice’s design ecosystem and pre‑engineered IP for faster time‑to‑market.
If you would like pricing, availability or a formal quote for the LAXP2-5E-5TN144E, request a quote or submit a pricing inquiry and our team will respond with details.
