LAXP2-8E-5QN208E

The LAXP2-8E-5QN208E is an LA‑LatticeXP2 family FPGA from Lattice Semiconductor Corporation designed for applications that require instant-on reconfigurability and automotive-grade qualification. Built on the flexiFLASH architecture, this single-chip FPGA combines non-volatile Flash-based configuration, embedded DSP blocks, and a mix of embedded and distributed memory to support high‑functionality embedded designs.

Targeted at markets requiring robust temperature and qualification margins, the device delivers a balance of logic capacity, on‑chip memory, and flexible I/O in a 208‑pin PQFP surface‑mount package.

Key Features

• flexiFLASH architecture  Instant-on, infinitely reconfigurable single-chip Flash-based configuration with FlashBAK and serial TAG memory for on‑chip storage and design security.
• AEC‑Q100 qualified (Automotive)  AEC‑Q100 qualification and an operating temperature range of −40°C to 125°C suitable for automotive applications that require qualified components.
• Logic capacity  Approximately 8,000 logic elements to implement mid-range FPGA functions and custom logic.
• Embedded and distributed memory  Approximately 226,304 bits (≈221 kbits) of embedded RAM and additional distributed RAM to support data buffering and memory‑intensive functions.
• sysDSP blocks and multipliers  sysDSP blocks with multiple high‑precision multipliers (family level: 16× 18×18 multipliers for LA‑XP2‑8) for multiply‑accumulate and DSP tasks.
• Flexible I/O and interface support  146 I/Os in the 208‑pin PQFP package with sysIO support for LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL, SSTL, HSTL, PCI, LVDS, Bus‑LVDS, MLVDS, LVPECL and RSDS signaling.
• Clocking and PLLs  Multiple analog PLLs per device (family support up to four) for clock multiply/divide and phase shifting.
• Low‑voltage operation  Specified supply range of 1.14 V to 1.26 V (devices operate with a nominal 1.2 V supply).
• Package and mounting  208‑pin PQFP (28 × 28 mm) surface‑mount package with 146 available I/Os.
• RoHS compliant  Environmentally compliant for lead‑free manufacturing processes.

Typical Applications

• Automotive infotainment & display systems  Supports display interfaces and source‑synchronous I/O including multi‑lane LVDS for graphics and display bridging.
• Automotive communication and networking  AEC‑Q100 qualification and flexible I/O standards make the device suitable for in‑vehicle communication, gateway and protocol bridging tasks.
• Embedded DSP and signal processing  sysDSP blocks and on‑chip multipliers enable multiply‑accumulate workloads for signal processing and real‑time computation.
• Memory interface bridging  Pre‑engineered DDR/DDR2 interface support for designs requiring local memory controllers and high‑speed data transfer.

Unique Advantages

• Automotive‑grade qualification: AEC‑Q100 tested and specified for −40°C to 125°C, addressing designs that require automotive qualification.
• Instant-on, reconfigurable Flash: flexiFLASH architecture delivers single‑chip instant‑on capability with on‑chip FlashBAK and serial TAG for secure, non‑volatile configuration.
• Balanced logic and memory: Around 8k logic elements paired with ~221 kbits of embedded RAM and distributed RAM for moderate logic density and embedded buffering.
• DSP‑capable fabric: sysDSP blocks and multiple 18×18 multipliers provide hardware‑accelerated arithmetic for signal processing tasks.
• Comprehensive I/O flexibility: Wide support for industry signaling standards and 146 I/Os in the PQFP package simplifies integration with diverse peripherals and interfaces.
• Low‑voltage system compatibility: Narrow supply range around 1.2 V supports modern low‑voltage system designs.

Why Choose LAXP2-8E-5QN208E?

The LAXP2-8E-5QN208E positions itself as a mid‑density, automotive‑qualified FPGA option that combines Flash-based instant-on configuration, DSP resources, and a flexible I/O set in a 208‑pin PQFP. Its specification set — including AEC‑Q100 qualification, a wide operating temperature range, and an on‑chip memory footprint of approximately 221 kbits — makes it suitable for automotive and other high‑reliability embedded systems that require reconfigurability and secure updates.

Designed by Lattice Semiconductor Corporation, this device is appropriate for engineers seeking a qualified FPGA with integrated configuration flash, hardware DSP blocks, and broad interface support for designs where qualification, temperature range, and interface flexibility are primary considerations.

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