LAXP2-5E-5FTN256E

The LAXP2-5E-5FTN256E is an LA-XP2 family FPGA from Lattice Semiconductor combining a LUT-based FPGA fabric with non-volatile flash configuration in a flexiFLASH architecture. It delivers approximately 5,000 logic elements, roughly 170 kbits of on-chip RAM, and up to 172 user I/Os in a 256-ball ftBGA (17 × 17 mm) package, optimized for applications that require deterministic boot, flexible I/O and on-chip DSP acceleration.

Targeted for systems requiring automotive qualification and extended temperature operation, this device supports secure, reconfigurable designs and on-chip DSP blocks for signal-processing tasks while operating from a nominal 1.2 V supply range.

Key Features

• Core Logic  Approximately 5,000 logic elements suitable for mid-density FPGA designs and custom logic integration.
• Memory  Total on-chip RAM of approximately 169,984 bits (≈170 kbits) to support embedded buffering and state storage.
• sysDSP and Multipliers  Family sysDSP architecture with device-level support (LA-XP2-5) for 3 sysDSP blocks and 12 18 × 18 multipliers to accelerate multiply-accumulate and signal-processing functions.
• Flexible I/O  Up to 172 I/Os in the 256-ball ftBGA footprint with family-level support for LVCMOS, LVTTL, LVDS, SSTL, HSTL, PCI, LVPECL and other standards for broad interface compatibility.
• Configuration & Security  flexiFLASH architecture provides instant-on, infinitely reconfigurable single-chip operation with FlashBAK and Serial TAG memory. Live Update support includes TransFR technology, dual-boot and 128-bit AES secure update mechanisms.
• Power and Voltage  Operates with a supply voltage range of 1.14 V to 1.26 V (nominal 1.2 V), matching low-voltage system requirements.
• Package & Mounting  Surface-mount 256-ball ftBGA (17 × 17 mm) package optimized for space-constrained boards while providing 172 available I/Os.
• Qualification & Reliability  Automotive-grade device qualified to AEC-Q100 and RoHS compliant, rated for operation from −40 °C to 125 °C.
• System Support  Family-level support includes on-chip PLLs, pre-engineered source-synchronous interfaces (DDR/DDR2, LVDS display links, XGMII) and software/IP ecosystem for design implementation.

Typical Applications

• Automotive Electronics  Integration into automotive systems that require AEC-Q100 qualification and extended temperature operation for robust in-vehicle processing and interface tasks.
• Display and Video Interfaces  Support for 7:1 LVDS display links and source-synchronous interfaces makes this device suitable for display controllers and video front-ends.
• Signal Processing and Sensor Fusion  On-chip sysDSP blocks and hardware multipliers accelerate real-time DSP workloads such as sensor conditioning and filtering.
• Memory and Bus Bridging  Pre-engineered DDR/DDR2 interfaces and flexible I/O sets enable memory interface bridging and protocol adaptation in embedded platforms.

Unique Advantages

• Instant-on non-volatile configuration: flexiFLASH architecture enables instant-on operation and in-field reconfiguration without external volatile configuration memory.
• Automotive-qualified reliability: AEC-Q100 qualification and a −40 °C to 125 °C operating range make the device suitable for demanding automotive environments.
• Balanced mid-range density: ~5,000 logic elements and ~170 kbits of on-chip RAM provide a balanced combination of logic and memory for mid-size embedded designs.
• Rich I/O connectivity: 172 I/Os in a compact 256-ball ftBGA package support diverse signalling standards for flexible system integration.
• Built-in DSP acceleration: sysDSP blocks and multiple 18 × 18 multipliers reduce the need for external DSP processors for many signal-processing tasks.
• Secure field updates: Live Update capabilities with 128-bit AES encryption and dual-boot support enable secure firmware and configuration management.

Why Choose LAXP2-5E-5FTN256E?

The LAXP2-5E-5FTN256E positions itself as a compact, automotive-qualified FPGA option for designers who need instant-on non-volatile configuration, a solid mid-range logic and memory footprint, and extensive I/O flexibility. Its combination of on-chip DSP resources, secure update mechanisms and a nominal 1.2 V power domain make it well suited to embedded control, display interface and sensor-processing applications that demand reliability across a wide temperature range.

Backed by the LA-LatticeXP2 family ecosystem and design support, this device offers a path for scalable, reconfigurable implementations where secure updates, deterministic boot behavior and automotive qualification are important selection criteria.

If you would like pricing, availability or to request a quote for the LAXP2-5E-5FTN256E, submit a quote request or contact sales through your preferred procurement channel.