LAV-AT-X70-3LFG676I
| Part Description |
Avant™-X Field Programmable Gate Array (FPGA) IC 298 4239360 637000 676-BBGA, FCBGA |
|---|---|
| Quantity | 845 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FCBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BBGA, FCBGA | Number of I/O | 298 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 637000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 4239360 |
Overview of LAV-AT-X70-3LFG676I – Avant™-X Field Programmable Gate Array (FPGA) IC
The LAV-AT-X70-3LFG676I is an Avant™-X Field Programmable Gate Array (FPGA) packaged in a 676-BBGA / 676-FCBGA (27×27) surface-mount package. The device provides 637,000 logic element cells, approximately 4.24 Mbits of embedded memory, and 298 I/Os, and is specified for industrial operation from −40 °C to 100 °C.
Built on the Lattice Avant platform architecture, the device targets high-density, high-I/O embedded designs that require integrated memory, DSP capabilities, programmable I/O and advanced clocking and SERDES/PHY features for industrial applications.
Key Features
- Core Logic 637,000 logic element cells for implementing complex digital logic and custom accelerators.
- Embedded Memory Approximately 4.24 Mbits of on-chip RAM with support for single, dual and pseudo-dual port modes and FIFO configurations as described in the Avant platform memory architecture.
- Programmable I/O 298 programmable I/O pins with a programmable I/O cell (PIC) architecture and banking scheme described in the Avant platform.
- Clocking and Timing On-chip oscillator, PLLs, global and regional clocking resources, dynamic clock select/control and DLL delay features provided by the Avant clocking structure.
- DSP and Memory Subsystems sysDSP blocks and sysMEM architecture for DSP and memory-centric functions as defined by the Avant platform.
- High-Speed Interfaces Integrated SERDES/PMA blocks and Multi-Protocol PCS/PHY integration with DDR PHY support and DQS grouping for DDR memory interfaces.
- Configuration & Reliability Enhanced device configuration options including JTAG and Single Event Upset (SEU) handling features described in the platform overview.
- Package & Mounting 676-FCBGA (27×27) package, surface mount; supplier device package listed as 676-FCBGA (27x27).
- Electrical & Environmental Supply voltage specified as 820 mV and RoHS compliant; industrial-grade operating temperature range −40 °C to 100 °C.
Typical Applications
- Industrial Control Implement real-time control logic, motor control interfaces and complex I/O aggregation using the device’s large logic capacity and extensive I/O.
- High-Speed Memory Interfaces Deploy DDR memory controllers and PHYs leveraging on-chip DDRPHY support and sysMEM features for memory-intensive designs.
- Signal Processing and Acceleration Use sysDSP blocks and abundant logic cells to implement filtering, data aggregation, and custom accelerators in embedded signal-processing systems.
- Networking & Connectivity Integrate SERDES and multi-protocol PCS/PHY blocks to support high-speed serial links and protocol adaptation in industrial networking equipment.
Unique Advantages
- High Logic Density: 637,000 logic element cells enable complex functions and large-scale custom logic without immediate need for external ASICs or coprocessors.
- Integrated Memory: Approximately 4.24 Mbits of embedded RAM with flexible port and FIFO modes reduces reliance on external memory and simplifies data-path design.
- Comprehensive I/O and PHY Support: 298 I/Os plus SERDES, DDRPHY and multi-protocol PHY options simplify integration of diverse interfaces and high-speed links.
- Industrial Temperature Range: Specified operation from −40 °C to 100 °C suits a range of industrial environments and deployments.
- Platform-Level Capabilities: Avant platform features—programmable functional units, clocking architecture, sysDSP and sysMEM—provide a cohesive architecture for scalable designs.
- Regulatory & Assembly Readiness: Surface-mount 676-FCBGA package and RoHS compliance support modern PCB assembly and environmental regulations.
Why Choose LAV-AT-X70-3LFG676I?
The LAV-AT-X70-3LFG676I combines high logic capacity, substantial on-chip memory, extensive I/O and platform-level building blocks from the Lattice Avant architecture in a compact 676-FCBGA surface-mount package. Its industrial temperature rating and integrated SERDES/DDRPHY capabilities make it suitable for demanding embedded and industrial designs that require a high degree of integration.
This device is appropriate for engineers designing systems that need scalable logic resources, flexible memory configurations and a variety of high-speed and general-purpose I/O options while remaining within industrial operating conditions.
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Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016