LAV-AT-X70-3LFG676I

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-X Field Programmable Gate Array (FPGA) IC 298 4239360 637000 676-BBGA, FCBGA

Quantity 845 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case676-BBGA, FCBGANumber of I/O298Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells637000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits4239360

Overview of LAV-AT-X70-3LFG676I – Avant™-X Field Programmable Gate Array (FPGA) IC

The LAV-AT-X70-3LFG676I is an Avant™-X Field Programmable Gate Array (FPGA) packaged in a 676-BBGA / 676-FCBGA (27×27) surface-mount package. The device provides 637,000 logic element cells, approximately 4.24 Mbits of embedded memory, and 298 I/Os, and is specified for industrial operation from −40 °C to 100 °C.

Built on the Lattice Avant platform architecture, the device targets high-density, high-I/O embedded designs that require integrated memory, DSP capabilities, programmable I/O and advanced clocking and SERDES/PHY features for industrial applications.

Key Features

  • Core Logic  637,000 logic element cells for implementing complex digital logic and custom accelerators.
  • Embedded Memory  Approximately 4.24 Mbits of on-chip RAM with support for single, dual and pseudo-dual port modes and FIFO configurations as described in the Avant platform memory architecture.
  • Programmable I/O  298 programmable I/O pins with a programmable I/O cell (PIC) architecture and banking scheme described in the Avant platform.
  • Clocking and Timing  On-chip oscillator, PLLs, global and regional clocking resources, dynamic clock select/control and DLL delay features provided by the Avant clocking structure.
  • DSP and Memory Subsystems  sysDSP blocks and sysMEM architecture for DSP and memory-centric functions as defined by the Avant platform.
  • High-Speed Interfaces  Integrated SERDES/PMA blocks and Multi-Protocol PCS/PHY integration with DDR PHY support and DQS grouping for DDR memory interfaces.
  • Configuration & Reliability  Enhanced device configuration options including JTAG and Single Event Upset (SEU) handling features described in the platform overview.
  • Package & Mounting  676-FCBGA (27×27) package, surface mount; supplier device package listed as 676-FCBGA (27x27).
  • Electrical & Environmental  Supply voltage specified as 820 mV and RoHS compliant; industrial-grade operating temperature range −40 °C to 100 °C.

Typical Applications

  • Industrial Control  Implement real-time control logic, motor control interfaces and complex I/O aggregation using the device’s large logic capacity and extensive I/O.
  • High-Speed Memory Interfaces  Deploy DDR memory controllers and PHYs leveraging on-chip DDRPHY support and sysMEM features for memory-intensive designs.
  • Signal Processing and Acceleration  Use sysDSP blocks and abundant logic cells to implement filtering, data aggregation, and custom accelerators in embedded signal-processing systems.
  • Networking & Connectivity  Integrate SERDES and multi-protocol PCS/PHY blocks to support high-speed serial links and protocol adaptation in industrial networking equipment.

Unique Advantages

  • High Logic Density:  637,000 logic element cells enable complex functions and large-scale custom logic without immediate need for external ASICs or coprocessors.
  • Integrated Memory:  Approximately 4.24 Mbits of embedded RAM with flexible port and FIFO modes reduces reliance on external memory and simplifies data-path design.
  • Comprehensive I/O and PHY Support:  298 I/Os plus SERDES, DDRPHY and multi-protocol PHY options simplify integration of diverse interfaces and high-speed links.
  • Industrial Temperature Range:  Specified operation from −40 °C to 100 °C suits a range of industrial environments and deployments.
  • Platform-Level Capabilities:  Avant platform features—programmable functional units, clocking architecture, sysDSP and sysMEM—provide a cohesive architecture for scalable designs.
  • Regulatory & Assembly Readiness:  Surface-mount 676-FCBGA package and RoHS compliance support modern PCB assembly and environmental regulations.

Why Choose LAV-AT-X70-3LFG676I?

The LAV-AT-X70-3LFG676I combines high logic capacity, substantial on-chip memory, extensive I/O and platform-level building blocks from the Lattice Avant architecture in a compact 676-FCBGA surface-mount package. Its industrial temperature rating and integrated SERDES/DDRPHY capabilities make it suitable for demanding embedded and industrial designs that require a high degree of integration.

This device is appropriate for engineers designing systems that need scalable logic resources, flexible memory configurations and a variety of high-speed and general-purpose I/O options while remaining within industrial operating conditions.

Request a quote or submit an inquiry for LAV-AT-X70-3LFG676I to receive pricing and availability information. Provide your requirements and quantity to get a tailored response.

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