LAXP2-17E-5FTN256E

The LAXP2-17E-5FTN256E is a flash-based FPGA from Lattice’s LA‑LatticeXP2 family that combines LUT-based logic fabric with on-chip non-volatile flash configuration. Designed for high-integration embedded and automotive designs, this device delivers 17,000 logic elements, approximately 282.6 kbits of embedded RAM, and up to 201 I/Os in a compact 256-ball ftBGA package.

Key value propositions include instant-on flash architecture, live update and secure configuration features, and automotive-grade qualification (AEC‑Q100), making it suitable for designs requiring reconfigurability, on-board security and extended temperature operation.

Key Features

• flexiFLASH™ Architecture  Instant-on, single-chip flash-based configuration with FlashBAK™ and Serial TAG memory for on-chip non-volatile storage and design security.
• Live Update & Security  TransFR™ live update capability with secure update support and 128‑bit AES encryption, plus dual-boot support with external SPI.
• Logic & DSP  17,000 logic elements with dedicated sysDSP™ blocks (LA‑XP2‑17 devices include five sysDSP blocks) and up to twenty 18×18 multipliers for high-performance multiply-accumulate workloads.
• Embedded Memory  Approximately 282.6 kbits of on-chip RAM (total RAM bits: 282,624) plus distributed RAM resources for control and buffering.
• Flexible I/O  Up to 201 I/Os with sysIO™ buffer support for a broad range of standards; pre-engineered source-synchronous interfaces such as DDR/DDR2 and LVDS family links are supported by the device family.
• Clocking  Multiple analog PLLs (up to four per device in the family) for clock multiply, divide and phase shifting.
• Automotive Qualification & Temperature Range  AEC‑Q100 tested and qualified with operating temperature from −40 °C to 125 °C.
• Power & Packaging  Low-voltage operation (1.14–1.26 V supply) in a 256-ball ftBGA (17×17 mm) surface-mount package—compact footprint for space-constrained boards.
• Standards & Development Support  Series-level support for system-level features such as IEEE 1149.1 and IEEE 1532, and compatibility with the LA‑LatticeXP2 family design flow.

Typical Applications

• Automotive Systems  Use in automotive control and safety subsystems where AEC‑Q100 qualification and −40 °C to 125 °C operation are required.
• Signal Processing & Motor Control  sysDSP blocks and multiple 18×18 multipliers enable efficient implementation of sensor fusion, motor control algorithms and other real-time DSP tasks.
• Display & Memory Interfaces  Pre‑engineered source-synchronous interfaces (e.g., DDR/DDR2 and multi-lane LVDS) support graphics, display timing and external memory interfacing.
• Secure Embedded Systems  On-chip flash configuration and 128‑bit AES secure update features suit products that require secure firmware updates and protected IP storage.

Unique Advantages

• Highly integrated single-chip solution: 17,000 logic elements plus on-chip flash and embedded RAM reduce external components and simplify BOM.
• Automotive-ready reliability: AEC‑Q100 qualification and wide operating temperature range support deployment in automotive environments.
• Secure live updates: TransFR™ live update with AES encryption and dual-boot capabilities allow field updates with protection for onboard designs.
• Performance for DSP workloads: Dedicated sysDSP blocks and 18×18 multipliers accelerate multiply-accumulate operations used in control and signal processing.
• Flexible low-voltage operation: 1.14–1.26 V supply range supports modern low-voltage power domains and system-level power optimization.
• Compact, board-friendly package: 256-ball ftBGA (17×17 mm) surface-mount package delivers high I/O count (201) in a small footprint.

Why Choose LAXP2-17E-5FTN256E?

The LAXP2-17E-5FTN256E positions itself as a robust, flash-configured FPGA for embedded and automotive applications that require reconfigurability, on-chip security and DSP performance. With 17,000 logic elements, dedicated sysDSP resources, secure live-update capabilities and AEC‑Q100 qualification, it addresses use cases that demand integration, reliability and runtime flexibility.

Design teams building complex, space-constrained systems will benefit from the device’s compact 256-ball ftBGA package, broad I/O count and compatibility with the LA‑LatticeXP2 family design ecosystem, enabling scalable development and long-term support.

Request a quote or submit a pricing inquiry to learn about availability, lead times and volume options for LAXP2-17E-5FTN256E.