LAXP2-5E-5MN132E

The LAXP2-5E-5MN132E is a LA-LatticeXP2 family Field Programmable Gate Array (FPGA) combining LUT-based FPGA fabric with on-chip non-volatile flash configuration. The device targets embedded and automotive applications that require reconfigurable logic, on-chip memory and deterministic I/O in a compact surface-mount 132‑ball csBGA package.

As an AEC‑Q100 qualified, automotive-grade device, it supports operation across a wide temperature range and low-voltage environments, making it suitable for designs that demand reliability and robust environmental performance.

Key Features

• Core architecture (flexiFLASH) Flash-based architecture provides instant-on and infinitely reconfigurable single-chip operation.
• Logic capacity Approximately 5,000 logic elements for mid-density FPGA designs.
• Embedded and distributed memory Approximately 170 kbits of on-chip RAM (EBR/FlashBAK memory) and support for distributed RAM resources for buffering and state storage.
• sysDSP blocks and multipliers Includes dedicated DSP resources (three sysDSP blocks in the LA-XP2-5 family) with up to 12 18 × 18 multipliers for arithmetic-intensive tasks.
• I/O flexibility 86 I/Os with a flexible sysIO buffer that supports multiple signaling standards used in embedded and display interfaces.
• Clocking On-chip PLLs provide clock multiply/divide and phase shifting for system clock management.
• Power and supply Low-voltage operation with specified supply range from 1.14 V to 1.26 V.
• Package and mounting 132-ball csBGA (8 × 8 mm) surface-mount package (132-LFBGA, CSPBGA) for compact board-level integration.
• Automotive qualification and temperature range AEC‑Q100 qualification and rated operation from −40 °C to 125 °C.
• Security and update features Family-level features include secure update technologies and design security enabled by flash-based configuration and encryption support.

Typical Applications

• Automotive control modules Reconfigurable logic and AEC‑Q100 qualification make this device suitable for in-vehicle control and sub-system logic in automotive electronics.
• Infotainment and display interfaces Flexible I/O and pre-engineered source-synchronous interfaces enable display bridging and interface control in infotainment and cluster displays.
• Sensor interfacing and signal preprocessing Dedicated sysDSP blocks and on-chip memory support sensor data conditioning, aggregation and preprocessing tasks.
• Embedded communications and protocol bridging Mid-density logic and versatile I/O allow implementation of custom protocol bridges, interface adapters and control logic.

Unique Advantages

• AEC‑Q100 qualified for automotive applications: Provides qualification for designs that require automotive-grade components and wide temperature operation.
• Flash-based instant-on architecture: flexiFLASH delivers instant start-up and field reconfigurability without external volatile configuration memory.
• Integrated DSP and multiplier resources: On-chip sysDSP blocks with multiple 18 × 18 multipliers accelerate arithmetic and signal-processing tasks without external accelerators.
• Compact, surface-mount package: 132-ball csBGA package with 86 I/Os balances board space and I/O density for space-constrained designs.
• Low-voltage operation and robust thermal range: Operates from 1.14 V to 1.26 V and across −40 °C to 125 °C to match low-voltage system rails and harsh environments.
• Flexible I/O and clocking: Multiple I/O standards and on-chip PLLs simplify timing and interface management for mixed-signal systems.

Why Choose LAXP2-5E-5MN132E?

This LA-LatticeXP2 device offers a balanced combination of mid-range logic capacity, on-chip embedded memory and dedicated DSP resources in an automotive‑qualified package. It is positioned for engineers who need reconfigurable logic with flash-based instant-on behavior, compact packaging and robust temperature and qualification credentials.

Because the device is part of the LA-LatticeXP2 family, it integrates technology and design flows that support embedded system development and in-field update strategies. The combination of reconfigurability, security-enabling configuration and automotive qualification delivers long-term design flexibility and system-level robustness.

Request a quote or submit an inquiry for pricing and availability for part number LAXP2-5E-5MN132E to receive lead-time and ordering information.