LAV-AT-X70-1LFG1156I

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-X Field Programmable Gate Array (FPGA) IC 554 4239360 637000 1156-BBGA, FCBGA

Quantity 308 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package1156-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1156-BBGA, FCBGANumber of I/O554Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells637000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits4239360

Overview of LAV-AT-X70-1LFG1156I – Avant™-X Field Programmable Gate Array, 1156-FCBGA

The LAV-AT-X70-1LFG1156I is an Avant™-X FPGA device from Lattice Semiconductor, implemented in a 1156-ball FCBGA package. It leverages the Avant platform architecture, which includes programmable functional unit blocks, on-chip memory and DSP resources, and a comprehensive clocking and I/O structure described in the platform datasheet.

Targeted for industrial applications, this FPGA combines a large programmable fabric with substantial embedded memory and a high I/O count to address designs that require integration of logic, memory interfaces and high-speed I/O within a compact surface-mount package.

Key Features

  • Programmable Logic — Approximately 637,000 logic elements enable complex logic integration and large-scale custom processing blocks.
  • Embedded Memory — Approximately 4.24 Mbits of on-chip RAM (4,239,360 total RAM bits) supporting single, dual and pseudo-dual port modes, FIFO modes and memory cascading as described in the Avant platform documentation.
  • High I/O Density — 554 user I/O pins provide extensive external connectivity for peripheral interfaces and high-pin-count designs.
  • Clocking and Timing — Platform-level clock architecture includes on-chip oscillator, PLL, global and regional clocks, edge clocks, PHYCLK, clock synchronizers/dividers, dynamic clock select/control and DLL delay functionality.
  • High-speed Interfaces — Avant platform documentation details SERDES/PMA blocks, multi-protocol PCS and PHY integration as well as DDR PHY support for external memory interfaces.
  • Programmable I/O and Memory Peripherals — Programmable I/O cell (PIC) features, sysI/O banking and sysMEM capabilities (including RAM initialization, ROM operation and memory output reset) are provided by the platform.
  • Device Configuration and Reliability — Device configuration options include JTAG and platform-level SEU handling and trace ID features as outlined in the datasheet.
  • Industrial Grade and Environmental — Industrial-grade device with an operating temperature range of −40 °C to 100 °C and RoHS compliance.
  • Package and Mounting — Surface-mount 1156-BBGA / 1156-FCBGA package (supplier device package: 1156-FCBGA, 35 × 35 mm) for compact board-level integration.
  • Voltage Supply — Listed voltage supply value: 820 mV (specified range: 820 mV to 820 mV).

Typical Applications

  • Industrial Control and Automation — Programmable logic density and industrial temperature rating support control systems, machine automation and I/O-intensive sensor aggregation.
  • High-speed Data Interfaces — SERDES, DDR PHY and multi-protocol PHY/PCS capabilities make the device suitable for designs that require robust external memory interfaces and high-speed serial links.
  • Embedded Processing and Signal Conditioning — Large logic capacity and on-chip DSP/memory resources enable data path acceleration, protocol handling and embedded pre-processing tasks.

Unique Advantages

  • Large Programmable Fabric: ~637,000 logic elements provide headroom for complex designs and multiple concurrent functions on a single device.
  • Substantial On-Chip Memory: Approximately 4.24 Mbits of embedded RAM supports lookup tables, buffering and FIFO implementations without relying exclusively on external memory.
  • High I/O Count: 554 I/Os reduce the need for external I/O expanders and simplify board-level routing for dense peripheral interfaces.
  • Comprehensive Clocking Architecture: Built-in oscillators, PLLs and dynamic clock controls from the Avant platform enable flexible timing domains and clock management inside the FPGA.
  • Industrial-ready Thermal Range: −40 °C to 100 °C operating range supports deployment in demanding environments.
  • Compact Surface-Mount Package: 1156-FCBGA (35 × 35 mm) delivers high integration density in a board-friendly surface-mount form factor.

Why Choose LAV-AT-X70-1LFG1156I?

LAV-AT-X70-1LFG1156I positions itself as an industrial-grade FPGA option within the Lattice Avant platform, offering a balance of large logic capacity, meaningful on-chip memory and a high I/O count in a compact FCBGA package. The device’s documented platform features—including advanced clocking, DDR support, SERDES and programmable I/O—provide a structured architecture for integrating complex, I/O‑heavy and timing-sensitive functions.

This FPGA is well suited for engineering teams building industrial systems, high-speed interfaces or embedded processing solutions that require a high degree of integration, deterministic operating temperature support and the architectural capabilities described in the Avant platform documentation.

Request a quote or submit an RFQ today to evaluate LAV-AT-X70-1LFG1156I for your next design requirement.

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