LAV-AT-X70-1LFG676C

The LAV-AT-X70-1LFG676C is an Avant™-X platform FPGA IC offering 637,000 logic elements and approximately 4.24 Mbits of on-chip RAM. Packaged in a 676-FCBGA (27 × 27) surface-mount package with 298 user I/Os, this commercial-grade device targets designs that require large programmable logic, substantial embedded memory, and high I/O density.

As part of the Lattice Avant platform, the device includes platform-level capabilities described in the Avant overview—such as advanced clocking, configurable memory modes, DSP resources, DDR memory support, and SERDES/PMA building blocks—enabling a range of embedded and I/O-intensive applications.

Key Features

• Logic Capacity — 637,000 logic elements provide ample programmable resources for complex logic, control, and acceleration functions.
• Embedded Memory — Approximately 4.24 Mbits of total RAM bits for on-chip data storage, FIFO implementations, and memory-coupled logic.
• I/O Count & Packaging — 298 I/Os in a 676-BBGA, FCBGA package (676-FCBGA, 27×27) optimized for high-density board integration and surface-mount assembly.
• Power Supply — Documented voltage supply at 820 mV.
• Temperature & Grade — Commercial grade operation with an ambient range of 0 °C to 85 °C; RoHS compliant.
• Avant Platform Architectural Features — Platform-level features in the Avant overview include a programmable functional unit (PFU) fabric, comprehensive clocking infrastructure (on-chip oscillator, PLLs, global and regional clocks), memory subsystem (sysMEM) with single/dual port and FIFO modes, sysDSP resources, programmable I/O cell (PIC) functions, DDRPHY support, and SERDES/PCS building blocks for high-speed links.
• Device Configuration & Reliability — Platform documentation references enhanced configuration options, JTAG, and SEU handling mechanisms as part of the Avant architecture.

Typical Applications

• High-Density I/O Control — Use the 298 I/Os for complex board-level control, sensor aggregation, and multi-protocol interfacing.
• Embedded Memory-Heavy Designs — Built-in sysMEM and approximately 4.24 Mbits of RAM support buffering, FIFOs, and on-chip data storage for streaming or packetized data flows.
• Signal Processing & Acceleration — The Avant platform’s sysDSP and large logic fabric enable implemention of DSP chains and hardware acceleration blocks.
• High-Speed Serial & DDR Interfaces — Platform-level SERDES/PMA and DDRPHY capabilities support high-speed serial links and external memory interfaces as described in the Avant overview.

Unique Advantages

• Large Programmable Fabric — 637,000 logic elements let you implement extensive custom logic and system integration on a single device, reducing external component count.
• Substantial On-Chip Memory — Approximately 4.24 Mbits of embedded RAM enables on-chip buffering and memory-intensive functions without relying solely on off-chip memory.
• High I/O Density in a Compact Package — 298 I/Os in a 676-FCBGA (27×27) package provide a balance of connectivity and board-space efficiency for dense designs.
• Platform-Level Flexibility — Avant platform capabilities (clocking, sysMEM modes, sysDSP, DDRPHY, SERDES/PCS) offer design flexibility to address varied interface, timing, and processing requirements.
• Commercial-Grade, RoHS Compliant — Documented commercial temperature range (0 °C to 85 °C) and RoHS compliance support standard commercial product lifecycles and regulatory expectations.

Why Choose LAV-AT-X70-1LFG676C?

The LAV-AT-X70-1LFG676C delivers a high-capacity Avant™-X FPGA option for teams needing extensive programmable logic, significant embedded memory, and a large I/O complement in a compact FCBGA package. Its alignment with the Avant platform’s architecture—covering programmable functional units, advanced clocking, memory modes, DSP resources, and high-speed interface building blocks—makes it suitable for complex embedded systems that integrate control, processing, and high-speed I/O.

This device is well-suited to engineering and procurement teams designing commercial products that require scalability, on-chip resources to reduce external BOM, and the architectural building blocks described in the Avant platform overview. The documented specifications provide a clear basis for system-level planning and evaluation.

Request a quote or submit an inquiry to get pricing and lead-time information for LAV-AT-X70-1LFG676C and begin your evaluation.