LAV-AT-X50-3LFG676I

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-X Field Programmable Gate Array (FPGA) IC 298 2723840 409000 676-BBGA, FCBGA

Quantity 1,530 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case676-BBGA, FCBGANumber of I/O298Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells409000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits2723840

Overview of LAV-AT-X50-3LFG676I – Avant™-X Field Programmable Gate Array (FPGA) IC 298 2723840 409000 676-BBGA, FCBGA

The LAV-AT-X50-3LFG676I is an Avant™-X platform FPGA from Lattice Semiconductor. It integrates programmable logic, on-chip memory, and a flexible I/O fabric based on the Avant architecture described in the product datasheet.

This device provides 409,000 logic elements, approximately 2.72 Mbits of embedded memory, and 298 user I/O pins in a 676-FCBGA (27×27) package. It is specified for industrial use with a rated operating temperature range of −40 °C to 100 °C and RoHS compliance.

Key Features

  • Core Programmable Logic — 409,000 logic elements enable complex custom logic implementations consistent with the Avant platform architecture.
  • Embedded Memory — Approximately 2.72 Mbits of on-chip RAM with support for single, dual and pseudo-dual port modes, FIFO modes, memory cascading, and RAM initialization as described for the platform.
  • High-Density I/O — 298 user I/O pins with the Avant programmable I/O cell (PIC) architecture and sysI/O banking scheme for flexible signaling and register options.
  • Clocking and Timing — On-chip oscillator, PLLs, global and regional clock networks, dynamic clock select/control, DLL delay and clock synchronizers referenced in the platform architecture to support complex timing domains.
  • High-Speed Interface Support — Platform-level support for DDR memory interfaces (DDRPHY) and SERDES/PMA and multi-protocol PCS/MPPHY integration as described in the Avant datasheet.
  • Package and Mounting — Available in a 676-BBGA / 676-FCBGA (27×27) package suitable for surface-mount assembly.
  • Industrial Temperature and Supply — Rated for operation from −40 °C to 100 °C; voltage supply specified at 820 mV.
  • Configuration and Reliability — Platform-level features include enhanced configuration options, JTAG support, and SEU handling mechanisms as described in the Avant platform overview.
  • Compliance — RoHS-compliant device.

Typical Applications

  • Industrial Control — Programmable logic and industrial temperature rating support custom motor control, automation I/O aggregation, and protocol bridging in harsh environments.
  • High-Bandwidth Memory Interfaces — DDRPHY support and embedded sysMEM capabilities enable designs requiring local buffering and high-throughput memory access.
  • Protocol and Interface Bridging — Programmable I/O cells and SERDES/PCS building blocks facilitate implementation of custom interface logic and multi-protocol PHY integration.
  • Signal Processing and Acceleration — The combination of a large logic element count and sysDSP/sysMEM resources is suited to on-device acceleration and real-time processing tasks.

Unique Advantages

  • High Logic Density: 409,000 logic elements provide substantial on-chip programmable resources for complex designs and feature integration.
  • Integrated Embedded Memory: Approximately 2.72 Mbits of RAM with flexible porting and FIFO modes reduces reliance on external memory for many workloads.
  • Extensive I/O Resources: 298 I/O pins and a programmable I/O cell architecture support diverse signaling standards and custom interface implementations.
  • Comprehensive Clocking Architecture: On-chip oscillator, PLLs, and multiple clock domains support complex timing requirements and dynamic clock control strategies.
  • Package and Thermal Suitability: 676-FCBGA packaging with surface-mount mounting and an industrial operating temperature range supports board-level integration for industrial applications.
  • Platform-Level Interface Support: Built-in DDRPHY and SERDES/PMA blocks described in the Avant platform simplify high-speed interface design.

Why Choose LAV-AT-X50-3LFG676I?

The LAV-AT-X50-3LFG676I combines the Avant™-X platform architecture with a high logic element count, substantial embedded memory, and extensive I/O resources to deliver a flexible FPGA foundation for industrial designs. Its documented platform features—programmable functional units, sysMEM and sysDSP blocks, robust clocking, and high-speed PHY support—help engineers implement custom logic, high-bandwidth interfaces, and real-time processing on a single device.

This device is well suited for development teams and OEMs seeking a programmable, industrial-grade FPGA with platform-level capabilities and packaging appropriate for surface-mount production. Its combination of integration, configurability, and documented platform features supports scalable designs and long-term maintainability within the Lattice Avant product family.

Request a quote or submit a sales inquiry to evaluate the LAV-AT-X50-3LFG676I for your next design. Provide your requirements and quantity needs to receive tailored pricing and availability information.

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