LAV-AT-X50-3LFG676I
| Part Description |
Avant™-X Field Programmable Gate Array (FPGA) IC 298 2723840 409000 676-BBGA, FCBGA |
|---|---|
| Quantity | 1,530 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FCBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BBGA, FCBGA | Number of I/O | 298 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 409000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 2723840 |
Overview of LAV-AT-X50-3LFG676I – Avant™-X Field Programmable Gate Array (FPGA) IC 298 2723840 409000 676-BBGA, FCBGA
The LAV-AT-X50-3LFG676I is an Avant™-X platform FPGA from Lattice Semiconductor. It integrates programmable logic, on-chip memory, and a flexible I/O fabric based on the Avant architecture described in the product datasheet.
This device provides 409,000 logic elements, approximately 2.72 Mbits of embedded memory, and 298 user I/O pins in a 676-FCBGA (27×27) package. It is specified for industrial use with a rated operating temperature range of −40 °C to 100 °C and RoHS compliance.
Key Features
- Core Programmable Logic — 409,000 logic elements enable complex custom logic implementations consistent with the Avant platform architecture.
- Embedded Memory — Approximately 2.72 Mbits of on-chip RAM with support for single, dual and pseudo-dual port modes, FIFO modes, memory cascading, and RAM initialization as described for the platform.
- High-Density I/O — 298 user I/O pins with the Avant programmable I/O cell (PIC) architecture and sysI/O banking scheme for flexible signaling and register options.
- Clocking and Timing — On-chip oscillator, PLLs, global and regional clock networks, dynamic clock select/control, DLL delay and clock synchronizers referenced in the platform architecture to support complex timing domains.
- High-Speed Interface Support — Platform-level support for DDR memory interfaces (DDRPHY) and SERDES/PMA and multi-protocol PCS/MPPHY integration as described in the Avant datasheet.
- Package and Mounting — Available in a 676-BBGA / 676-FCBGA (27×27) package suitable for surface-mount assembly.
- Industrial Temperature and Supply — Rated for operation from −40 °C to 100 °C; voltage supply specified at 820 mV.
- Configuration and Reliability — Platform-level features include enhanced configuration options, JTAG support, and SEU handling mechanisms as described in the Avant platform overview.
- Compliance — RoHS-compliant device.
Typical Applications
- Industrial Control — Programmable logic and industrial temperature rating support custom motor control, automation I/O aggregation, and protocol bridging in harsh environments.
- High-Bandwidth Memory Interfaces — DDRPHY support and embedded sysMEM capabilities enable designs requiring local buffering and high-throughput memory access.
- Protocol and Interface Bridging — Programmable I/O cells and SERDES/PCS building blocks facilitate implementation of custom interface logic and multi-protocol PHY integration.
- Signal Processing and Acceleration — The combination of a large logic element count and sysDSP/sysMEM resources is suited to on-device acceleration and real-time processing tasks.
Unique Advantages
- High Logic Density: 409,000 logic elements provide substantial on-chip programmable resources for complex designs and feature integration.
- Integrated Embedded Memory: Approximately 2.72 Mbits of RAM with flexible porting and FIFO modes reduces reliance on external memory for many workloads.
- Extensive I/O Resources: 298 I/O pins and a programmable I/O cell architecture support diverse signaling standards and custom interface implementations.
- Comprehensive Clocking Architecture: On-chip oscillator, PLLs, and multiple clock domains support complex timing requirements and dynamic clock control strategies.
- Package and Thermal Suitability: 676-FCBGA packaging with surface-mount mounting and an industrial operating temperature range supports board-level integration for industrial applications.
- Platform-Level Interface Support: Built-in DDRPHY and SERDES/PMA blocks described in the Avant platform simplify high-speed interface design.
Why Choose LAV-AT-X50-3LFG676I?
The LAV-AT-X50-3LFG676I combines the Avant™-X platform architecture with a high logic element count, substantial embedded memory, and extensive I/O resources to deliver a flexible FPGA foundation for industrial designs. Its documented platform features—programmable functional units, sysMEM and sysDSP blocks, robust clocking, and high-speed PHY support—help engineers implement custom logic, high-bandwidth interfaces, and real-time processing on a single device.
This device is well suited for development teams and OEMs seeking a programmable, industrial-grade FPGA with platform-level capabilities and packaging appropriate for surface-mount production. Its combination of integration, configurability, and documented platform features supports scalable designs and long-term maintainability within the Lattice Avant product family.
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