LAV-AT-X50-3CSG484C
| Part Description |
Avant™-X Field Programmable Gate Array (FPGA) IC 218 2723840 409000 484-BGA, FCCSPBGA |
|---|---|
| Quantity | 805 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FCCSP (12x12) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA, FCCSPBGA | Number of I/O | 218 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 409000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 2723840 |
Overview of LAV-AT-X50-3CSG484C – Avant™-X Field Programmable Gate Array (FPGA), 484‑BGA FCCSP
The LAV-AT-X50-3CSG484C is an Avant™-X Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It delivers a high-density programmable logic fabric with 409,000 logic elements and approximately 2.72 Mbits of embedded memory, together with 218 I/Os in a 484‑ball FCCSPBGA package.
Designed for commercial-grade surface-mount applications, this device provides a compact, highly integrated FPGA option for designs that require significant on-chip logic capacity, embedded RAM, and a large I/O count within a 12×12 484‑FCCSP package footprint.
Key Features
- Logic Capacity — 409,000 logic elements to implement complex programmable logic, custom accelerators, and high‑density gating functions.
- Embedded Memory — Approximately 2.72 Mbits of on‑chip RAM for buffering, FIFOs, and local data storage.
- I/O Count — 218 I/Os to support extensive external interfacing and multi‑lane connectivity.
- Package & Mounting — 484‑BGA (FCCSPBGA) supplier device package: 484‑FCCSP (12×12), optimized for surface-mount assembly.
- Power — Device listed with a supply of 820 mV (as specified), suitable for designs targeting this supply point.
- Operating Conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Regulatory / Compliance — RoHS compliant.
- Platform Documentation — The Avant platform datasheet includes comprehensive sections on DC and switching characteristics, power and supply sequencing, PLLs and clocking, sysI/O signaling characteristics, and hardened PCIe characteristics for the Avant platform.
Typical Applications
- Custom Hardware Acceleration — Implement compute‑intensive logic and acceleration functions leveraging 409,000 logic elements and on‑chip RAM.
- High‑I/O Systems — Use the 218 I/Os for systems requiring multiple external interfaces, parallel data lanes, or dense sensor and actuator connectivity.
- Embedded Prototyping & Development — Compact 12×12 FCCSP package and surface‑mount mounting make the device suitable for prototype and production boards where board space is constrained.
- Connectivity Subsystems — The Avant platform documentation includes hardened PCIe characteristics and detailed sysI/O signaling tables relevant to designs that require platform‑level connectivity considerations.
Unique Advantages
- High Logic Density: 409,000 logic elements provide large programmable capacity for complex system functions and IP integration.
- Significant On‑Chip Memory: Approximately 2.72 Mbits of embedded RAM reduces external memory dependence for buffering and local data paths.
- Generous I/O Resources: 218 I/Os support broad peripheral and interface integration without immediate need for external multiplexing.
- Compact, Production‑Ready Package: 484‑FCCSP (12×12) BGA minimizes PCB area while supporting surface‑mount assembly processes.
- Documented Platform Characteristics: Extensive Avant platform datasheet coverage (power, DC/switching, PLL, sysI/O, PCIe characteristics) aids design validation and system integration planning.
- RoHS Compliant: Meets RoHS requirements for environmentally conscious product designs.
Why Choose LAV-AT-X50-3CSG484C?
The LAV-AT-X50-3CSG484C positions itself as a high‑density, commercially graded FPGA option within the Lattice Avant platform family. With 409,000 logic elements, substantial embedded RAM, and 218 I/Os in a compact 484‑FCCSP package, it is suited to designs that require sizable programmable logic, local memory, and broad external connectivity while maintaining a small PCB footprint.
Engineers and procurement teams will find value in the device’s documented platform specifications—covering electrical characteristics, clocking resources, and platform‑level connectivity guidelines—helping accelerate validation and system integration for commercial applications.
If you would like pricing information, availability, or to request a formal quote for the LAV-AT-X50-3CSG484C, submit a quote request or contact sales to receive a tailored response.

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