LAV-AT-X50-2LFG676C

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-X Field Programmable Gate Array (FPGA) IC 298 2723840 409000 676-BBGA, FCBGA

Quantity 1,043 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BBGA, FCBGANumber of I/O298Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells409000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits2723840

Overview of LAV-AT-X50-2LFG676C – Avant™-X FPGA, 409,000 logic elements, 676‑FCBGA

The LAV-AT-X50-2LFG676C is an Avant™-X Field Programmable Gate Array (FPGA) from Lattice Semiconductor. It provides a high-density, reconfigurable fabric with 409,000 logic elements and approximately 2.72 Mbits of embedded memory, delivered in a 676‑FCBGA (27 × 27) surface-mount package. The device supports a large I/O count and a modern clocking and memory subsystem suitable for complex embedded and communications-focused designs.

Key Features

  • Core Capacity — 409,000 logic elements for implementing large-scale programmable logic and custom hardware functions.
  • Embedded Memory — Approximately 2.72 Mbits of on-chip RAM (total RAM bits: 2,723,840) supporting single/dual/pseudo-dual port modes and FIFO configurations as described in the Avant platform architecture.
  • I/O Density — 298 programmable I/O pins, with a flexible programmable I/O cell (PIC) architecture and support for multiple I/O standards.
  • Clocking and Timing — Integrated clock architecture including on-chip oscillator, PLLs, global/regional/edge clocks, and dynamic clock controls to support complex timing domains and memory PHY clocks.
  • Memory and DSP Subsystems — sysMEM and sysDSP building blocks documented in the Avant platform for memory cascading, bus-size matching, RAM initialization, DSP functions and FIFO modes.
  • High‑Speed Interfaces — SERDES and PCS blocks and DDR memory support included in the Avant platform overview to enable high-bandwidth serial and parallel memory interfaces.
  • Configuration and Reliability — Enhanced configuration options, JTAG support, and Single Event Upset (SEU) handling are included at the platform level.
  • Package and Mechanical — 676‑BBGA (676‑FCBGA) package, 27 × 27mm supplier device package, surface-mount mounting type.
  • Electrical and Environmental — Voltage supply specified at 820 mV; RoHS compliant; commercial-grade operating range from 0 °C to 85 °C.

Typical Applications

  • Communications Equipment — Implement protocol processing, SERDES-based links, and PHY integration using the device’s high I/O count and SERDES/PCS capabilities.
  • Embedded Compute and Acceleration — Offload compute kernels and implement custom DSP pipelines with the combination of sysDSP blocks and large logic capacity.
  • Memory-Intensive Designs — Support for DDR memory interfaces and flexible sysMEM features make the device suitable for applications requiring high-bandwidth buffering and complex memory architectures.
  • Advanced Prototyping and System Integration — Use the large logic element count and extensive I/O to prototype multi‑component systems or consolidate functions into a single programmable device.

Unique Advantages

  • High Logic Density: 409,000 logic elements enable large, complex designs without immediate migration to multi‑device systems.
  • Substantial Embedded Memory: Approximately 2.72 Mbits of on-chip RAM supports FIFOs, ROM initialization, and multi-port memory configurations described in the Avant architecture.
  • Flexible Clocking: On-chip oscillator, PLLs, global/regional/edge clock domains, and dynamic clock controls facilitate precise timing partitioning across subsystems.
  • Extensive I/O and Packaging: 298 I/Os in a compact 676‑FCBGA surface-mount package provide connectivity density for board-level integration while meeting RoHS requirements.
  • Platform-Level Integration: Features documented in the Lattice Avant platform—such as sysMEM, sysDSP, DDRPHY, SERDES, and configuration options—mean the device fits into a coherent architecture for scalable designs.

Why Choose LAV-AT-X50-2LFG676C?

The LAV-AT-X50-2LFG676C positions itself as a high-density, platform-oriented FPGA for teams needing significant programmable logic, embedded memory, and extensive I/O in a single commercial-grade device. Its architecture elements—documented in the Avant platform overview—provide the building blocks for clocking, memory, DSP and high-speed serial interfaces that support complex embedded and communications designs.

This device is suited to designers and system integrators who require a scalable, reconfigurable solution with substantial on-chip resources and a modern package form factor. The combination of large logic capacity, multi-megabit embedded memory, and platform-level features enables longer-term design flexibility and integration of multiple system functions into one FPGA.

Request a quote or submit an inquiry to learn more about availability, lead times, and volume pricing for the LAV-AT-X50-2LFG676C.

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