LAV-AT-X50-2LFG676C
| Part Description |
Avant™-X Field Programmable Gate Array (FPGA) IC 298 2723840 409000 676-BBGA, FCBGA |
|---|---|
| Quantity | 1,043 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FCBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BBGA, FCBGA | Number of I/O | 298 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 409000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 2723840 |
Overview of LAV-AT-X50-2LFG676C – Avant™-X FPGA, 409,000 logic elements, 676‑FCBGA
The LAV-AT-X50-2LFG676C is an Avant™-X Field Programmable Gate Array (FPGA) from Lattice Semiconductor. It provides a high-density, reconfigurable fabric with 409,000 logic elements and approximately 2.72 Mbits of embedded memory, delivered in a 676‑FCBGA (27 × 27) surface-mount package. The device supports a large I/O count and a modern clocking and memory subsystem suitable for complex embedded and communications-focused designs.
Key Features
- Core Capacity — 409,000 logic elements for implementing large-scale programmable logic and custom hardware functions.
- Embedded Memory — Approximately 2.72 Mbits of on-chip RAM (total RAM bits: 2,723,840) supporting single/dual/pseudo-dual port modes and FIFO configurations as described in the Avant platform architecture.
- I/O Density — 298 programmable I/O pins, with a flexible programmable I/O cell (PIC) architecture and support for multiple I/O standards.
- Clocking and Timing — Integrated clock architecture including on-chip oscillator, PLLs, global/regional/edge clocks, and dynamic clock controls to support complex timing domains and memory PHY clocks.
- Memory and DSP Subsystems — sysMEM and sysDSP building blocks documented in the Avant platform for memory cascading, bus-size matching, RAM initialization, DSP functions and FIFO modes.
- High‑Speed Interfaces — SERDES and PCS blocks and DDR memory support included in the Avant platform overview to enable high-bandwidth serial and parallel memory interfaces.
- Configuration and Reliability — Enhanced configuration options, JTAG support, and Single Event Upset (SEU) handling are included at the platform level.
- Package and Mechanical — 676‑BBGA (676‑FCBGA) package, 27 × 27mm supplier device package, surface-mount mounting type.
- Electrical and Environmental — Voltage supply specified at 820 mV; RoHS compliant; commercial-grade operating range from 0 °C to 85 °C.
Typical Applications
- Communications Equipment — Implement protocol processing, SERDES-based links, and PHY integration using the device’s high I/O count and SERDES/PCS capabilities.
- Embedded Compute and Acceleration — Offload compute kernels and implement custom DSP pipelines with the combination of sysDSP blocks and large logic capacity.
- Memory-Intensive Designs — Support for DDR memory interfaces and flexible sysMEM features make the device suitable for applications requiring high-bandwidth buffering and complex memory architectures.
- Advanced Prototyping and System Integration — Use the large logic element count and extensive I/O to prototype multi‑component systems or consolidate functions into a single programmable device.
Unique Advantages
- High Logic Density: 409,000 logic elements enable large, complex designs without immediate migration to multi‑device systems.
- Substantial Embedded Memory: Approximately 2.72 Mbits of on-chip RAM supports FIFOs, ROM initialization, and multi-port memory configurations described in the Avant architecture.
- Flexible Clocking: On-chip oscillator, PLLs, global/regional/edge clock domains, and dynamic clock controls facilitate precise timing partitioning across subsystems.
- Extensive I/O and Packaging: 298 I/Os in a compact 676‑FCBGA surface-mount package provide connectivity density for board-level integration while meeting RoHS requirements.
- Platform-Level Integration: Features documented in the Lattice Avant platform—such as sysMEM, sysDSP, DDRPHY, SERDES, and configuration options—mean the device fits into a coherent architecture for scalable designs.
Why Choose LAV-AT-X50-2LFG676C?
The LAV-AT-X50-2LFG676C positions itself as a high-density, platform-oriented FPGA for teams needing significant programmable logic, embedded memory, and extensive I/O in a single commercial-grade device. Its architecture elements—documented in the Avant platform overview—provide the building blocks for clocking, memory, DSP and high-speed serial interfaces that support complex embedded and communications designs.
This device is suited to designers and system integrators who require a scalable, reconfigurable solution with substantial on-chip resources and a modern package form factor. The combination of large logic capacity, multi-megabit embedded memory, and platform-level features enables longer-term design flexibility and integration of multiple system functions into one FPGA.
Request a quote or submit an inquiry to learn more about availability, lead times, and volume pricing for the LAV-AT-X50-2LFG676C.

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