LCMXO2-2000ZE-2BG256C

IC FPGA 206 I/O 256CABGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 206 75776 2112 256-LFBGA

Quantity 1,030 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGANumber of I/O206Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs264Number of Logic Elements/Cells2112
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits75776

Overview of LCMXO2-2000ZE-2BG256C – MachXO2 FPGA, 2112 Logic Elements, 206 I/Os, 256-LFBGA

The LCMXO2-2000ZE-2BG256C is a MachXO2 family field programmable gate array (FPGA) offered in a 256-ball LFBGA package with 206 user I/Os. It provides approximately 2,112 logic elements and on-chip RAM for flexible glue-logic, control and interface functions in commercial-grade applications.

Built on the MachXO2 architecture, the device combines non-volatile instant-on configuration, embedded RAM and a broad set of I/O and system features to simplify design integration and enable low-power, reconfigurable system functions.

Key Features

  • Logic Capacity — Approximately 2,112 logic elements for implementing glue logic, state machines and moderate-complexity programmable functions.
  • Embedded Memory — Total on-chip RAM of 75,776 bits (approximately 74 kbits) to support distributed RAM and small buffering needs.
  • I/O Density and Flexibility — 206 user I/Os in a 256-LFBGA package; programmable sysIO buffer options and pre‑engineered source-synchronous I/O for high-speed interfaces and display gearing.
  • Power — Low-power MachXO2 family features, with standby power as low as cited in family data; device supply range specified at 1.14 V to 1.26 V for core operation.
  • Non-volatile Configuration — On-chip user flash and instant-on architecture from the MachXO2 family allow single-chip, secure configuration and in-field updates (TransFR reconfiguration).
  • Clocking and PLLs — Flexible on-chip clocking including analog PLL support and fractional‑N synthesis as described for the MachXO2 family.
  • Hardened System Functions — On-chip peripherals such as SPI, I2C and timer/counter blocks are included in the family feature set to simplify system design.
  • Package and Mounting — 256-LFBGA (supplier package: 256-CABGA 14×14) for surface-mount applications; RoHS compliant.
  • Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for commercial applications.

Typical Applications

  • Interface and Glue Logic — Use the device to consolidate board-level glue logic, protocol translation and control functions where moderate logic density and many I/Os are required.
  • Display and Source-Synchronous I/O — Pre‑engineered display gearing and source-synchronous I/O features support display interfaces and other high-speed signaling needs.
  • Memory and DDR Interfaces — Family-level DDR/DDR2/LPDDR support and dedicated gearing can be used for memory interfacing and buffering roles.
  • Embedded Control and Peripherals — Hardened I2C, SPI and timer/counter blocks are well suited for system control, configuration and monitoring tasks.

Unique Advantages

  • Compact, High-I/O Integration: 206 I/Os in a 256-ball LFBGA package reduce external interface components and simplify PCB routing.
  • Non-Volatile Instant-On: MachXO2 family instant-on configuration and on-chip flash enable fast startup and in-field updates without external configuration memory.
  • Flexible I/O Standards: Programmable sysIO and on-chip termination options support a wide range of signaling standards for versatile interface design.
  • Built-In System Blocks: On-chip SPI, I2C and timers reduce BOM by replacing discrete controllers for common system functions.
  • Low-Power Operation: Family-level low-power options and optimized processes help minimize standby and operational power in battery-sensitive or low-power designs.
  • Commercial Temperature Range: Rated 0 °C to 85 °C to meet requirements for a wide range of commercial electronic products.

Why Choose LCMXO2-2000ZE-2BG256C?

The LCMXO2-2000ZE-2BG256C positions itself as a flexible, non-volatile FPGA for commercial designs that need moderate logic capacity, a high number of I/Os and embedded memory in a compact BGA package. Its MachXO2 family features—instant-on configuration, flexible I/O, built-in peripheral blocks and low-power operation—help streamline system design and reduce component count.

This device is well suited to designers seeking a reliable, reconfigurable solution for interface bridging, control logic, display and memory-related functions where commercial temperature operation and surface-mount packaging are required.

Request a quote or submit an RFQ to receive availability and pricing information for the LCMXO2-2000ZE-2BG256C.

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