LCMXO2-2000ZE-2BG256I

IC FPGA 206 I/O 256CABGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 206 75776 2112 256-LFBGA

Quantity 112 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LFBGANumber of I/O206Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs264Number of Logic Elements/Cells2112
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits75776

Overview of LCMXO2-2000ZE-2BG256I – MachXO2 Field Programmable Gate Array (FPGA) IC 206 75776 2112 256-LFBGA

The LCMXO2-2000ZE-2BG256I is a MachXO2 family FPGA offering 2,112 logic elements, approximately 75.8 kbits of on-chip RAM and 206 general-purpose I/Os in a compact 256-ball BGA package. Designed for low-power, non-volatile system functions, this device targets industrial applications requiring flexible I/O, instant-on configuration and robust temperature capability.

Built on the MachXO2 architecture, the device provides a combination of programmable logic, embedded memory and configurable I/O buffer options to support a range of control, interface and glue-logic tasks in embedded systems.

Key Features

  • Core Logic — 2,112 logic elements (cells) for implementing glue logic, control state machines and moderate-density programmable functions.
  • Embedded Memory — Total on-chip RAM of 75,776 bits (approximately 75.8 kbits) to support distributed memory and small FIFOs for buffering and local data storage.
  • I/O Capacity & Flexibility — 206 I/Os provide broad connectivity; MachXO2 family I/O options support multiple standards and programmable buffer configurations for diverse interface requirements.
  • Low-Voltage Supply — Operates from a VCC range of 1.14 V to 1.26 V, supporting low-voltage system designs.
  • Non-volatile, Instant-On Capability — MachXO2 family architecture provides single-chip, non-volatile configuration with fast power-up and field reconfiguration support.
  • Power Efficiency — Based on an advanced low-power process with family-level low standby power characteristics suitable for energy-conscious designs.
  • Package & Mounting — Surface-mount 256-LFBGA package; supplier device package listed as 256-CABGA (14×14) for compact board-level integration.
  • Industrial Temperature Grade — Rated for operation from −40°C to 100°C, suitable for industrial environments.
  • System-Level Support — Family features include on-chip peripherals and configuration interfaces (JTAG, SPI, I²C) and support for in-system programming and background updates.

Typical Applications

  • Industrial Automation — Implement sensor aggregation, motor control glue logic and deterministic I/O translation in industrial control systems operating across a wide temperature range.
  • Embedded System Glue Logic — Replace discrete glue components by consolidating control logic, protocol bridging and timing functions into a single FPGA device.
  • User Interface & Display Control — Manage front-panel logic, button/debounce circuits and display interfaces leveraging available I/O and embedded memory for buffering.
  • Security & Configuration Storage — Use non-volatile configuration and background programming capability for secure boot and field firmware updates.

Unique Advantages

  • Compact, High I/O Count: 206 I/Os in a 256-ball BGA provide many external connections in a small footprint, reducing the need for external I/O expanders.
  • Integrated Memory and Logic: Approximately 75.8 kbits of on-chip RAM combined with 2,112 logic elements lets you implement local buffering and control logic without extra external RAM.
  • Low-Voltage Operation: A narrow supply range (1.14 V to 1.26 V) supports low-voltage system rails and helps simplify power-supply design.
  • Industrial Reliability: Industrial grade specification and −40°C to 100°C operating range make the device appropriate for demanding environmental conditions.
  • Non-volatile Instant-On: Single-chip non-volatile configuration reduces system complexity and enables fast start-up and safe in-field updates.
  • Surface-Mount BGA Packaging: 256-ball BGA provides a dense, manufacturable package for space-constrained PCBs.

Why Choose LCMXO2-2000ZE-2BG256I?

The LCMXO2-2000ZE-2BG256I delivers a balanced combination of logic capacity, on-chip memory and a high I/O count in a low-voltage, industrial-temperature package. It is well-suited for engineers seeking a compact, non-volatile FPGA to consolidate glue logic, interface translation and control functions while minimizing board-level components.

With MachXO2 family system-level features—such as configurable I/O buffers, non-volatile configuration and provisions for in-field reconfiguration—this device provides a scalable platform for long-term designs that require reliable, low-power programmable logic and robust I/O connectivity.

Request a quote or submit an inquiry to get pricing and availability for the LCMXO2-2000ZE-2BG256I and to discuss how this device can fit into your next design.

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