LCMXO2-2000ZE-2MG132I

IC FPGA 104 I/O 132CSBGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 104 75776 2112 132-LFBGA, CSPBGA

Quantity 679 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package132-CSPBGA (8x8)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case132-LFBGA, CSPBGANumber of I/O104Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs264Number of Logic Elements/Cells2112
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits75776

Overview of LCMXO2-2000ZE-2MG132I – MachXO2 Field Programmable Gate Array (132-LFBGA)

The LCMXO2-2000ZE-2MG132I is a MachXO2 family Field Programmable Gate Array (FPGA) in a 132-LFBGA (132-CSPBGA, 8×8) package designed for industrial applications. It provides 2,112 logic elements, 104 general-purpose I/Os, and 75,776 bits of on-chip RAM, delivering a compact, low-power programmable fabric for interface bridging, glue logic and embedded control in temperature-critical systems.

With support for single-supply operation at 1.14 V to 1.26 V, surface-mount packaging and an operating range of −40 °C to 100 °C, this device targets industrial designs that require non-volatile configuration, flexible I/O and low standby power.

Key Features

  • Programmable Core 2,112 logic elements provide a flexible logic fabric suitable for glue logic, protocol conversion and small to mid-density control functions.
  • On-chip Memory 75,776 bits of total RAM on the device for distributed and embedded memory needs; the MachXO2 family also documents embedded block RAM and distributed RAM options across the family.
  • I/O and Interface Flexibility 104 I/Os in a compact 132-LFBGA package support a wide range of interfaces. The family-level documentation describes programmable sysIO buffers and support for LVCMOS, LVTTL, LVDS and other signaling styles.
  • Non-Volatile, Reconfigurable MachXO2 family features include on-chip user Flash memory and instant-on behavior with single-chip, in-field reconfiguration options and background programming capability.
  • Low-Power Operation Family-level ultra low-power design characteristics are documented, including standby modes and low standby power options suitable for energy-conscious systems.
  • Clocking and Timing The family includes flexible on-chip clocking with multiple primary clocks and analog PLL support for a wide input frequency range, enabling a variety of synchronous interfaces.
  • Package and Mounting Surface-mount 132-LFBGA (132-CSPBGA, 8×8) package for dense board-level integration; supplier device package listed as 132-CSPBGA (8×8).
  • Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet industrial environmental requirements.
  • Compliance RoHS-compliant to support environmental and manufacturing requirements.

Typical Applications

  • Industrial Automation — Interface bridging, control logic and sensor aggregation where the −40 °C to 100 °C range and 104 I/Os support robust system integration.
  • Embedded Control and Glue Logic — Compact FPGA fabric (2,112 logic elements) for consolidating discrete logic, protocol translation and board-level integration tasks.
  • Communications and Interface Management — Flexible I/O signaling options and on-chip memory for buffering and handling varied signal standards in communication subsystems.
  • Non-volatile Configuration Needs — Devices requiring instant-on operation and in-field reprogramming benefit from the MachXO2 family’s on-chip user Flash and reconfiguration features.

Unique Advantages

  • Highly adaptable logic density: 2,112 logic elements give designers the ability to implement moderate-complexity logic and control functions without external glue components.
  • Compact system integration: 132-LFBGA package and surface-mount mounting enable dense PCB layouts and simplify BOM compared to multi-chip solutions.
  • Industrial-grade thermal performance: −40 °C to 100 °C operating range aligns with industrial deployment requirements for harsher environments.
  • Non-volatile, reconfigurable operation: MachXO2 family features on-chip user Flash and background programming for secure, single-chip configuration and in-field updates.
  • Flexible, multi-protocol I/O support: Family-level programmable sysIO buffers and I/O signaling options allow adaptation to numerous interface standards without external transceivers.
  • Low standby power options: Documented ultra low-power family characteristics help reduce system idle power consumption.

Why Choose LCMXO2-2000ZE-2MG132I?

The LCMXO2-2000ZE-2MG132I positions itself as a compact, industrial-grade MachXO2 FPGA option for designers needing moderate logic capacity, significant on-chip RAM and a large I/O count in a space-efficient package. Its single-supply operation at 1.14 V to 1.26 V, RoHS compliance and wide operating temperature range make it suitable for rugged embedded systems and control applications.

Choosing this device provides designers with the MachXO2 family’s non-volatile, reconfigurable architecture, flexible I/O capabilities and low-power options—enabling scalable designs that can be updated in-field and integrated into long-life industrial systems.

Request a quote or submit a sales inquiry to obtain pricing, lead time and availability for the LCMXO2-2000ZE-2MG132I.

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