LCMXO2-2000ZE-2TG144C

IC FPGA 111 I/O 144TQFP
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 111 75776 2112 144-LQFP

Quantity 193 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O111Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs264Number of Logic Elements/Cells2112
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits75776

Overview of LCMXO2-2000ZE-2TG144C – MachXO2 Field Programmable Gate Array (FPGA), 144-LQFP

The LCMXO2-2000ZE-2TG144C is a MachXO2 family FPGA offering a flexible, low-power logic fabric optimized for system control, interface bridging and display/memory interfacing. With 2,112 logic elements and a broad on-chip feature set, it targets commercial designs that require instant-on, in-field reconfiguration and integrated peripheral support.

Key Features

  • Core Logic — 2,112 logic elements and 264 CLBs provide a compact, flexible fabric for glue logic, peripheral control and finite-state applications.
  • Embedded Memory — Approximately 75,776 bits (about 74 kbits) of embedded SRAM (EBR) for buffering and small data structures; family devices include additional distributed RAM options.
  • On‑Chip User Flash — Family supports on-chip user flash memory for non-volatile configuration and storage; the XO2-2000 device option provides 80 kbits of UFM and supports up to 100,000 write cycles and background programming.
  • I/O Density and Flexibility — 111 I/Os with programmable sysIO buffer support across a wide range of interfaces and signaling standards, enabling diverse peripheral and display connections.
  • Low Voltage Operation — Single core supply range from 1.14 V to 1.26 V for the device core, enabling low-power system designs.
  • Low Power Options — Family-level low-power architecture with standby modes (family documentation cites standby power as low as 22 μW) and programmable power-saving options.
  • Clocking and PLLs — Eight primary clocks and up to two analog PLLs per device (family capability) with fractional‑n synthesis for flexible clock generation.
  • High‑Level System Support — Instant-on, single-chip non-volatile reconfigurability with JTAG, SPI and I²C programming interfaces, TransFR in-field reconfiguration and optional dual-boot with external SPI memory.
  • Package and Mounting — Surface-mount 144-pin package (144-LQFP / 144-TQFP, 20 × 20 mm) suitable for compact board layouts.
  • Commercial Grade — Rated for operation from 0 °C to 85 °C for commercial applications; RoHS compliant.

Typical Applications

  • Display and Video Interfaces — Pre‑engineered source-synchronous I/O and dedicated gearing support display interface implementations and timing-critical signaling.
  • Memory Interface Control — Family-level DDR/DDR2/LPDDR support and dedicated FIFO control logic enable use as a memory interface bridge or buffering element.
  • System Glue Logic — Compact logic density and rich I/O enable peripheral aggregation, protocol translation and board-level signal management.
  • Peripheral and Sensor Control — Hardened functions (SPI, I²C, timers) and programmable I/Os simplify integration of sensors and external devices.

Unique Advantages

  • Instant-on, Non-Volatile Operation: Single-chip, flash-based configuration enables immediate start-up and simplified system boot behavior.
  • In-Field Reconfiguration: TransFR and background programming support allow safe, in-system logic updates without full system downtime.
  • Integrated Peripheral Support: On-chip SPI, I²C and timers reduce external component count and simplify firmware and hardware integration.
  • Flexible I/O Signaling: Programmable sysIO buffers and wide protocol support let a single device interface with a broad set of external standards.
  • Low-Power Operation: Narrow core supply range and family power-saving modes enable low standby consumption for energy-conscious designs.
  • Compact Packaging: 144-pin surface-mount package provides a balance of I/O count and small PCB footprint for space-constrained applications.

Why Choose LCMXO2-2000ZE-2TG144C?

The LCMXO2-2000ZE-2TG144C combines a mid-range logic capacity (2,112 logic elements and 264 CLBs) with a rich set of on-chip resources—embedded SRAM, user flash, flexible clocking and programmable I/O—to address interface glue logic, memory bridging and control tasks in commercial systems. Its low-voltage core and family-level low-power features make it suitable for designs that need instant-on behavior and in-field update capability.

This part is well suited for engineers building compact, reconfigurable control and interface subsystems who require reliable vendor-supported silicon with integrated peripheral functions and flexible I/O options. The combination of non-volatile configuration, programmable interfaces and modest logic density provides long-term design scalability within the MachXO2 family.

Request a quote or submit an RFQ today to check pricing and availability for the LCMXO2-2000ZE-2TG144C.

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