LCMXO2-2000ZE-3FTG256C

The LCMXO2-2000ZE-3FTG256C is a MachXO2 field-programmable gate array (FPGA) device optimized for low-power, flexible I/O and embedded-control applications. It implements a MachXO2 family architecture with approximately 2,112 logic elements and a rich I/O fabric to support interface bridging, glue logic, and system control functions.

This surface-mount 256-LBGA device provides a high I/O count (206 pins), on-chip embedded RAM, and family-level features such as low-power operation, programmable I/O standards, and non-volatile configuration options—making it suitable for commercial embedded designs where integration, configurability, and compact packaging matter.

Key Features

• Logic Capacity  Approximately 2,112 logic elements suitable for glue logic, protocol conversion, and medium-density FPGA functions.
• Embedded Memory  Approximately 75,776 bits of on-chip RAM for FIFOs, small buffers, and local state storage.
• I/O Density and Flexibility  206 available I/O pins in a 256-LBGA footprint; programmable I/O supports a wide range of interface standards at the MachXO2 family level.
• Power Supply and Low-Power Operation  Core voltage supply range 1.14 V to 1.26 V; MachXO2 family devices include low-power process options and standby modes (family-level low standby figures are specified in the MachXO2 datasheet).
• Clocking and PLLs  Family-level flexible clocking including multiple primary clocks and analog PLL options for frequency synthesis and high-speed I/O timing.
• Non-volatile Configuration and In-field Reprogramming  MachXO2 family supports on-chip user flash memory and background programming modes for single-chip, instant-on and in-field updates (refer to family datasheet for details).
• Embedded System Functions  Hardened functions available at the family level include SPI, I²C, timer/counter and on-chip oscillator for system integration.
• Package and Mounting  256-LBGA (supplier package: 256-FTBGA, 17 × 17 mm), surface-mount package for compact board designs.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operating temperature range.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Interface Bridging and Glue Logic  Use the device's high I/O count and flexible I/O standards to translate, buffer, or multiplex signals between subsystems.
• Embedded System Control  Implement system control, initialization, and peripheral management using on-chip logic and hardened SPI/I²C functions.
• Memory and Display Support  Leverage the MachXO2 family’s source-synchronous I/O and DDR support (family-level) to implement display gearing, DDR interfaces, and related timing logic.
• Sensor and Peripheral Interfaces  Aggregate and preprocess sensor data or manage peripherals where medium-density logic and local RAM simplify board-level design.

Unique Advantages

• High I/O Count in a Compact Package  206 I/Os in a 256-LBGA (17 × 17 mm supplier package) reduces board area while supporting dense interfacing needs.
• Embedded Memory for Local Storage  Approximately 75,776 bits of on-chip RAM enable local buffering and state retention without external memory.
• Low-Power Family Characteristics  MachXO2 family-level low-power process and standby modes help minimize system power consumption.
• Integrated System Functions  On-chip SPI, I²C and timer/counter circuitry reduce bill-of-materials and simplify MCU/FPGA co-design.
• Non-volatile, Reconfigurable Architecture  Family-level on-chip flash and in-field reconfiguration enable instant-on behavior and firmware-like updates without external configuration devices.
• Commercial Temperature Suitability  Designed for commercial-grade systems with a 0 °C to 85 °C operating range.

Why Choose LCMXO2-2000ZE-3FTG256C?

The LCMXO2-2000ZE-3FTG256C positions itself as a compact, medium-density FPGA solution with a high I/O count and integrated memory—well suited for designers needing flexible interfacing, embedded control, and low-power operation in commercial applications. Its MachXO2 family attributes—programmable I/O standards, system-level hardened functions, and non-volatile configuration—help reduce external components and accelerate system integration.

This device is a fit for teams building compact embedded systems, interface bridges, or display/memory timing logic who require a balance of logic capacity, abundant I/O, and on-chip RAM packaged in a small surface-mount FT-BGA form factor.

Request a quote or submit an RFQ to receive pricing and availability for the LCMXO2-2000ZE-3FTG256C.