LCMXO2-2000ZE-3MG132I

The LCMXO2-2000ZE-3MG132I is a MachXO2 family field programmable gate array (FPGA) from Lattice Semiconductor. It provides flexible programmable logic with 2,112 logic elements and approximately 75,776 bits of embedded RAM, delivering compact, reconfigurable logic for embedded and industrial applications.

Designed for industrial-grade deployment, the device features 104 I/Os, a low-voltage supply range (1.14 V to 1.26 V), and a 132-ball CSPBGA (8×8) package with surface-mount mounting. As part of the MachXO2 family, it leverages family-level features such as instant-on configuration and reconfiguration capabilities to support system-level integration and in-field updates.

Key Features

• Core Logic  2,112 logic elements provide the programmable resources for glue logic, control, and custom processing functions.
• Embedded Memory  Approximately 75,776 bits of on-chip RAM for FIFOs, buffering, and small data storage close to logic.
• I/O Count & Flexibility  104 I/Os accommodate a wide range of digital interfaces and system connections from a compact package footprint.
• Power Supply  Single-core operating range from 1.14 V to 1.26 V, enabling compatibility with low-voltage system rails.
• Package & Mounting  132-LFBGA (CSPBGA, 8×8) surface-mount package balances I/O density and board-area efficiency.
• Industrial Temperature Range  Rated for operation from −40°C to 100°C to meet industrial-environment requirements.
• Non-volatile, Field-Reconfigurable Family Features  As part of the MachXO2 family, the device supports instant-on behavior and in-field reconfiguration for background updates and system flexibility.
• Standards & Packaging  Halogen-free advanced packaging options available across the MachXO2 family; this part is supplied in a 132-ball CSPBGA format.

Typical Applications

• System Control and Glue Logic  Use the device’s 2,112 logic elements and 104 I/Os to implement control, timing, and glue logic between SoCs, ASICs, and peripherals in industrial equipment.
• Peripheral and Interface Bridging  Embedded RAM and flexible I/O count make this device suitable for buffering, protocol conversion, and interface adaptation tasks.
• In-field Reconfigurable Systems  Leveraging MachXO2 family reconfiguration features, deployable systems can receive logic updates while operating, supporting field upgrades and feature changes.

Unique Advantages

• Compact, High-Density Package:  132-ball CSPBGA (8×8) delivers 104 I/Os and 2,112 logic elements in a small footprint for space-constrained designs.
• Industrial Temperature Rating:  Operation from −40°C to 100°C enables deployment in industrial environments that demand extended temperature capability.
• Low-Voltage Operation:  1.14 V to 1.26 V supply range supports low-power system designs and modern low-voltage logic domains.
• On-Chip RAM for Local Data Handling:  Approximately 75,776 bits of embedded RAM reduce external memory requirements for buffering and small data stores.
• Field Update and Instant-On Capability:  Part of the MachXO2 family features that enable fast power-up and in-field reconfiguration, simplifying firmware updates and product iterations.
• Industrial-Grade Build:  Manufactured and supplied in a surface-mount CSPBGA package suitable for production assembly in industrial applications.

Why Choose LCMXO2-2000ZE-3MG132I?

This MachXO2 device balances programmable logic capacity, embedded memory, and I/O density in a compact industrial-grade CSPBGA package. Its low-voltage operation and extended temperature rating make it appropriate for embedded control, interface bridging, and systems that require in-field configurability.

Engineers looking for a reconfigurable, non-volatile FPGA resource with on-chip RAM and a robust industrial thermal range will find the LCMXO2-2000ZE-3MG132I suited for designs that need reliable logic integration, system flexibility, and footprint efficiency.

Request a quote or contact sales to discuss pricing, lead times, and availability for LCMXO2-2000ZE-3MG132I.