LCMXO2-2000ZE-3TG100I

The LCMXO2-2000ZE-3TG100I is a MachXO2 family Field Programmable Gate Array (FPGA) in a 100‑pin LQFP package. It combines a flexible LUT4-based logic architecture with on-chip non-volatile configuration and a broad, programmable I/O capability to address system control, interface bridging and glue-logic tasks in industrial designs.

This device offers a balance of integration and low-power operation, with device-level features for embedded memory, configurable I/Os, and instant-on non-volatile configuration that simplify board-level design and system boot behavior.

Key Features

• Logic — 2112 logic elements implemented in the MachXO2 LUT4 architecture, offering flexible combinatorial and register resources for control and glue logic.
• Memory — 75,776 bits of on-chip RAM (approximately 0.076 Mbits) for distributed and block memory needs within user logic.
• I/O — 79 programmable I/O pins with the MachXO2 family’s sysIO buffer capabilities for a wide range of interfaces and programmable input/output behavior.
• Power — Single core voltage supply range of 1.14 V to 1.26 V and family-level low-power design options for reduced standby consumption.
• Configuration and Non-Volatility — Instant-on, single-chip non-volatile configuration with support for in-field updates and background programming via standard interfaces.
• Clocking — Flexible on-chip clocking with family support for multiple primary clocks and analog PLLs to support varied timing requirements.
• Package and Mounting — 100‑LQFP (14×14 mm) surface-mount package (supplier package: 100‑TQFP) for straightforward PCB integration.
• Operating Range and Grade — Industrial grade device with an operating temperature range of −40 °C to 100 °C and RoHS compliance for environmental conformity.
• System-Level Functions — Family-level hardened functions such as SPI, I2C and timer/counter primitives plus IEEE 1149.1 boundary-scan and in-system programming support.

Typical Applications

• Interface Bridging — Use the programmable I/O and flexible logic to implement protocol translation, bus bridging and signal conditioning between system components.
• Control and Glue Logic — Implement system control state machines, reset and power-sequencing logic, and peripheral aggregation inside a single device to reduce BOM.
• Display and Memory Interfaces — Leverage the family’s source-synchronous and DDR/DDRx gearing features to implement display or memory interface logic where timing and I/O flexibility are required.
• Embedded System Management — On-chip non-volatile configuration and user flash features enable instant-on control, boot management and in-field updates without external configuration memory.

Unique Advantages

• Instant-on non-volatile configuration: Simplifies system boot and eliminates the need for an external configuration ROM for many designs.
• Integrated memory and logic density: 2112 logic elements with approximately 0.076 Mbits of on-chip RAM reduce the need for external SRAM in control and buffering tasks.
• Broad programmable I/O: 79 I/Os with configurable buffer standards let you consolidate multiple interface functions into one device.
• Industrial temperature rating: −40 °C to 100 °C operating range supports deployment in industrial environments.
• Compact, industry-standard package: 100‑LQFP surface-mount package provides a compact footprint for board-level integration and manufacturing.
• RoHS compliant: Meets common environmental requirements for modern electronic products.

Why Choose LCMXO2-2000ZE-3TG100I?

The LCMXO2-2000ZE-3TG100I positions itself as a flexible, non-volatile FPGA solution for industrial control and interface-centric designs. With 2112 logic elements, approximately 0.076 Mbits of on-chip RAM, and 79 programmable I/Os in a 100‑LQFP package, it is suited to consolidate glue logic, manage system boot, and implement timing-sensitive interfaces while minimizing external components.

Designed for applications that require instant-on configuration, configurable I/O and robust operating range, this MachXO2 device offers scalable integration and system-level features that help simplify design, reduce BOM and support long-term deployment.

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