LCMXO2-2000ZE-3MG132C

The LCMXO2-2000ZE-3MG132C is a MachXO2 non-volatile field programmable gate array (FPGA) in a 132‑ball CSPBGA package. It provides mid-range logic integration with 2112 logic elements, on-chip embedded RAM, and flexible I/O for system control, interface bridging, and field reconfiguration.

Designed for low-power, compact system designs, this commercial‑grade surface‑mount device supports a 1.14 V–1.26 V core supply and operates over a 0 °C to 85 °C range, offering a balance of integration and power efficiency for embedded applications.

Key Features

• Logic Capacity  2112 logic elements (cells) suitable for mid-density logic and glue‑logic integration.
• Embedded Memory  Approximately 75,776 total RAM bits provide on-chip storage for buffering and control-state logic.
• I/O Flexibility  104 I/Os available in the 132‑LFBGA package, supporting a broad range of system interfacing needs.
• On‑Chip Nonvolatile Configuration  MachXO2 family features include on‑chip user flash memory and instant‑on nonvolatile operation for single‑chip, secure configuration.
• Low Power Architecture  Family-level low‑power design options with micro‑power standby modes help minimize system power consumption; this device requires a 1.14 V–1.26 V supply.
• Flexible Clocking and PLLs  MachXO2 family provides flexible on‑chip clocking and PLL support for system timing requirements.
• Package & Mounting  132‑LFBGA (132‑CSPBGA, 8×8) surface‑mount package for compact board integration; commercial grade, RoHS compliant.
• Operating Range  Commercial operating temperature from 0 °C to 85 °C for standard embedded environments.

Typical Applications

• Interface Bridging  Use the device’s flexible I/O and embedded memory to implement protocol translation and interface glue logic between subsystems.
• Control and System Glue Logic  Mid-density logic capacity and on‑chip RAM make it suitable for control functions, sequencers, and custom peripheral logic.
• Field Upgradeable Systems  Nonvolatile configuration and family TransFR reconfiguration capability enable in‑field logic updates while systems remain operational.
• Low‑Power Embedded Devices  Compact package and family low‑power features support battery‑sensitive or energy‑constrained designs.

Unique Advantages

• Integrated Nonvolatile Configuration: Instant‑on, single‑chip nonvolatile programming reduces the need for external configuration memory and simplifies system startup.
• Compact, High‑I/O Package: 132‑ball CSPBGA provides 104 I/Os in a small footprint, reducing board area while preserving connectivity.
• Balanced Logic and Memory: 2112 logic elements combined with approximately 75.8 kbits of RAM enables a variety of mid‑range functions without external SRAM in many designs.
• Low Voltage Operation: Narrow core supply window (1.14 V–1.26 V) supports optimized power budgeting in modern low‑voltage systems.
• Commercial Grade and RoHS Compliant: Commercial temperature range and RoHS compliance simplify qualification for mainstream embedded products.

Why Choose LCMXO2-2000ZE-3MG132C?

The LCMXO2-2000ZE-3MG132C delivers mid-density logic integration with on‑chip memory and a high I/O count in a compact 132‑LFBGA package. Its MachXO2 family capabilities—nonvolatile instant‑on configuration, flexible I/O, and low‑power options—make it a practical choice for designers implementing interface bridging, system control, and field‑upgradeable logic without extensive external components.

This device is well suited to engineering teams seeking a scalable, reliable FPGA building block that reduces BOM complexity while providing the configuration flexibility and embedded resources needed for many commercial embedded applications.

Request a quote or submit an inquiry to obtain pricing and lead‑time information for the LCMXO2-2000ZE-3MG132C.