LCMXO2-2000ZE-3BG256I

The LCMXO2-2000ZE-3BG256I is a MachXO2 family FPGA optimized for low-power system control, I/O bridging and on-board logic functions. It delivers 2112 logic elements and 206 I/Os in a compact 256-ball BGA package, making it suitable for industrial designs that require flexible I/O, instant-on non-volatile configuration and embedded memory.

Built on the MachXO2 architecture, this device targets applications that need low standby power, secure single-chip configuration and a balance of logic, embedded RAM and system-level peripherals.

Key Features

• Logic Capacity — 2112 logic elements for implementing glue logic, control state machines and peripheral interfaces.
• On-chip Memory — Total on-chip RAM of 75,776 bits for distributed and block memory needs within the device.
• I/O Density — 206 I/Os supporting a wide range of programmable I/O buffer standards provided by the MachXO2 family.
• Power — Operates from a single supply rail in the range 1.14 V to 1.26 V; MachXO2 family includes ultra low power modes including very low standby power.
• Non-volatile, Instant-on Configuration — MachXO2 family supports single-chip non-volatile configuration modes and background programming for in-field updates.
• Clocking and PLLs — Flexible on-chip clock resources with primary clocks and analog PLL support as provided by the MachXO2 architecture.
• Embedded System Functions — Family-level hardened peripherals such as SPI, I²C and timers/counters, plus an on-chip oscillator for system support.
• Package and Mounting — 256-LFBGA package (supplier device package: 256-CABGA, 14 × 14 mm) with surface-mount mounting type for compact board layouts.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C.
• Compliance — RoHS compliant.

Typical Applications

• Interface Bridging and Glue Logic — Use the device to implement protocol adapters, level translation logic and board-level glue functions where a high I/O count and flexible I/O standards are required.
• System Control and Configuration — Leverage non-volatile instant-on configuration and on-chip peripherals (SPI, I²C, timers) for system supervisors and control tasks.
• Display and Memory I/O — MachXO2 family features for source-synchronous I/O and DDR gearing make this device suitable for managing display interfaces and memory signaling at the board level.
• Field-Updatable Logic — TransFR reconfiguration and background programming enable in-field logic updates without removing the device or interrupting system operation.

Unique Advantages

• Compact, High-I/O Solution: 206 I/Os in a 256-ball BGA footprint lets you consolidate multiple discrete components and simplify board routing.
• Non-volatile Instant-on: Single-chip configuration enables immediate startup without external configuration devices, reducing BOM and board complexity.
• Low Power Operation: MachXO2 family low-power design reduces standby consumption, supporting energy-efficient industrial applications.
• Embedded Memory and Peripherals: Built-in RAM and on-chip peripherals (SPI, I²C, timers, oscillator) reduce the need for external support components and accelerate system integration.
• Industrial-Grade Reliability: Specified for −40 °C to 100 °C operability and RoHS compliance, suitable for long-life industrial deployments.
• Field Serviceability: In-field reconfiguration and background programming simplify updates and feature rollouts after deployment.

Why Choose LCMXO2-2000ZE-3BG256I?

The LCMXO2-2000ZE-3BG256I combines a balanced logic capacity of 2112 logic elements, substantial on-chip RAM (75,776 bits) and a high I/O count in a single, industrial-grade package. It is a practical choice for designers seeking a low-power, non-volatile FPGA to handle board-level control, I/O interfacing and system configuration without adding complex external components.

This device is well suited for industrial embedded systems that require durable operation across a wide temperature range, flexible I/O options and the ability to deploy in-field updates. The MachXO2 family features and on-chip system support help reduce BOM, simplify design cycles and provide a stable platform for production deployments.

Request a quote or submit an inquiry to obtain pricing, availability and lead-time information for the LCMXO2-2000ZE-3BG256I. Our team can help with ordering and volume options to support your project timeline.