LCMXO2-2000ZE-3FTG256I

The LCMXO2-2000ZE-3FTG256I is a MachXO2 family field programmable gate array in a 256-ball BGA package, designed for industrial applications. It provides a flexible logic architecture with 2112 logic elements, approximately 75.8 kbits of on-chip RAM, and up to 206 I/Os for system-level integration and interface consolidation.

Built for low-voltage systems, the device operates from 1.14 V to 1.26 V and supports an extended operating temperature range of −40 °C to 100 °C. The package is surface-mount and RoHS compliant for standard manufacturing flows.

Key Features

• Core Logic  2112 logic elements provide programmable fabric for glue logic, control functions, and custom combinational/sequential logic implementations.
• Embedded Memory  Approximately 75.8 kbits of on-chip RAM for small data buffers, state storage, and FIFO implementations.
• I/O Density & Flexibility  Up to 206 I/Os in the 256-LBGA footprint (supplier package: 256-FTBGA, 17 × 17 mm) to support multiple external interfaces and board-level routing options.
• Power and Supply  Single-supply operation in the 1.14 V to 1.26 V range suitable for low-voltage system domains.
• Industrial Operating Range  Rated for −40 °C to 100 °C operation to meet demanding environmental conditions.
• On-board Configuration & System Support (family-level)  MachXO2 family features include non-volatile, infinitely reconfigurable user flash memory, background programming support, and secure instant-on behavior.
• Package & Assembly  Surface-mount 256-LBGA/256-FTBGA (17 × 17 mm) packaging for compact board designs with high I/O count.
• Compliance  RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• Interface Bridging and Signal Aggregation  Use the 206 I/Os and programmable I/O buffers to consolidate and translate signals between subsystems on a single device.
• Control and Glue Logic  Implement system control, sequencers, and glue logic using the 2112 logic elements and embedded RAM for compact, board-level integration.
• Peripheral and Sensor Integration  Small embedded memory and flexible I/O enable reliable interfacing with sensors, timers, and peripheral devices in industrial systems.

Unique Advantages

• High I/O Count in a Compact Package: 206 I/Os in a 256-ball BGA gives significant connectivity without expanding PCB footprint.
• Deterministic Low-Voltage Operation: Narrow supply range (1.14 V–1.26 V) simplifies power-rail design for low-voltage systems.
• Industrial Temperature Rating: −40 °C to 100 °C operating range supports deployment in temperature-challenging environments.
• On-Chip Memory for System Tasks: Approximately 75.8 kbits of RAM enables local buffering, FIFOs, and small state machines without external memory.
• RoHS Compliance: Meets environmental regulations for modern manufacturing and product distribution.
• Surface-Mount, Standard BGA Footprint: 256-FTBGA (17 × 17 mm) supplier package streamlines assembly and supports dense board layouts.

Why Choose LCMXO2-2000ZE-3FTG256I?

The LCMXO2-2000ZE-3FTG256I positions itself as a flexible, low-voltage FPGA option for industrial designs that require moderate logic density, substantial I/O, and on-chip memory in a compact BGA package. Its combination of 2112 logic elements, roughly 75.8 kbits of embedded RAM, and 206 I/Os makes it suitable for applications that need interface consolidation, control logic, and local buffering without adding external components.

With RoHS compliance, surface-mount 256-FTBGA packaging, and an operating range from −40 °C to 100 °C, this device delivers practical integration benefits for engineers seeking a field-programmable solution with family-level features such as non-volatile configuration and in-field reconfiguration capabilities.

Request a quote or submit an inquiry to check pricing and availability for the LCMXO2-2000ZE-3FTG256I and to discuss how it fits your design requirements.