LCMXO2-2000ZE-3BG256C
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 206 75776 2112 256-LFBGA |
|---|---|
| Quantity | 451 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 206 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 264 | Number of Logic Elements/Cells | 2112 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 75776 |
Overview of LCMXO2-2000ZE-3BG256C – MachXO2 FPGA, 2,112 logic elements, 206 I/Os
The LCMXO2-2000ZE-3BG256C is a MachXO2 family field programmable gate array (FPGA) IC optimized for low-power, reconfigurable system control and I/O-intensive applications. Built on the MachXO2 architecture, this device combines 2,112 logic elements with on-chip RAM and a broad set of family-level system features to address glue logic, interface bridging, and low-power control tasks in commercial designs.
Key value propositions include high I/O density (206 I/Os), integrated on-chip memory (75,776 bits), and single-supply operation in the 1.14 V–1.26 V range, all packaged in a 256-ball LFBGA footprint suitable for surface-mount assembly.
Key Features
- Logic Capacity — 2,112 logic elements for implementing glue logic, protocol adapters, and moderate-complexity finite state machines.
- On-Chip Memory — 75,776 bits of total on-chip RAM (approximately 74 kbits) for buffering, FIFOs and small data stores directly in the FPGA.
- I/O Density & Flexibility — 206 user I/Os to support extensive peripheral connectivity, sensor interfaces, and board-level signal routing.
- Power and Supply — Single-supply operation supported from 1.14 V to 1.26 V, enabling integration into low-voltage system rails.
- Packaging & Mounting — 256-ball LFBGA package (supplier device package listed as 256-CABGA, 14×14); surface-mount mounting type for compact board integration.
- Operating Range & Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
- MachXO2 Family System Features — Family-level capabilities include ultra-low-power modes, on-chip user flash memory options, pre-engineered source-synchronous I/O, programmable sysIO buffers, on-chip SPI/I²C and timers, and support for in-system reconfiguration and instant-on operation.
- Standards & Compliance — RoHS compliant, supporting environmentally conscious design and assembly.
Typical Applications
- System Glue Logic — Replace discrete glue components with a compact FPGA to consolidate bus bridging, address decoding, and protocol conversion.
- Interface & I/O Expansion — Use the high I/O count for aggregating sensors, peripherals, or legacy interfaces on space-constrained PCBs.
- Display and Synchronous I/O — Leverage MachXO2 family source-synchronous I/O and DDR-friendly features for display gearing and timing-critical I/O paths.
- Embedded Control & Peripherals — Integrate timers, SPI and I²C functions alongside custom logic for board-level control and sequencing.
- Low-Power Standby Systems — Take advantage of MachXO2 family low-power modes for systems that require minimal standby consumption and quick wake-up.
Unique Advantages
- High I/O Count in a Compact Package: 206 I/Os in a 256-ball LFBGA footprint provide dense connectivity without increasing board area.
- Integrated Memory for Buffering: Approximately 75,776 bits of on-chip RAM reduce the need for external SRAM in many buffering and FIFO applications.
- Low-Voltage Single-Supply Operation: Narrow 1.14 V–1.26 V supply range simplifies power-rail design in low-voltage systems.
- Family-Level System Support: MachXO2 family features such as on-chip flash, programmable I/O buffers, and in-system reconfiguration provide a flexible platform for evolving designs.
- Commercial Temperature Range: Rated 0 °C to 85 °C for typical commercial deployments and environments.
- RoHS Compliant: Meets common environmental and assembly requirements for modern electronics manufacturing.
Why Choose LCMXO2-2000ZE-3BG256C?
The LCMXO2-2000ZE-3BG256C positions itself as a practical, reconfigurable building block for commercial embedded systems that require a balance of logic capacity, high I/O count, and on-chip memory in a compact, surface-mount package. Its MachXO2 family heritage brings system-level features—such as programmable I/O buffers, embedded control peripherals, and low-power modes—that help reduce BOM complexity while retaining in-field flexibility through reconfiguration.
This device is well suited to engineers designing board-level controllers, interface bridges, display and timing logic, or peripheral aggregation hubs who need a predictable commercial-grade FPGA with integrated memory and broad I/O options.
Request a quote or submit an inquiry for pricing and availability to start integrating the LCMXO2-2000ZE-3BG256C into your next design.