LCMXO2-2000ZE-3BG256C

IC FPGA 206 I/O 256CABGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 206 75776 2112 256-LFBGA

Quantity 451 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGANumber of I/O206Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs264Number of Logic Elements/Cells2112
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits75776

Overview of LCMXO2-2000ZE-3BG256C – MachXO2 FPGA, 2,112 logic elements, 206 I/Os

The LCMXO2-2000ZE-3BG256C is a MachXO2 family field programmable gate array (FPGA) IC optimized for low-power, reconfigurable system control and I/O-intensive applications. Built on the MachXO2 architecture, this device combines 2,112 logic elements with on-chip RAM and a broad set of family-level system features to address glue logic, interface bridging, and low-power control tasks in commercial designs.

Key value propositions include high I/O density (206 I/Os), integrated on-chip memory (75,776 bits), and single-supply operation in the 1.14 V–1.26 V range, all packaged in a 256-ball LFBGA footprint suitable for surface-mount assembly.

Key Features

  • Logic Capacity — 2,112 logic elements for implementing glue logic, protocol adapters, and moderate-complexity finite state machines.
  • On-Chip Memory — 75,776 bits of total on-chip RAM (approximately 74 kbits) for buffering, FIFOs and small data stores directly in the FPGA.
  • I/O Density & Flexibility — 206 user I/Os to support extensive peripheral connectivity, sensor interfaces, and board-level signal routing.
  • Power and Supply — Single-supply operation supported from 1.14 V to 1.26 V, enabling integration into low-voltage system rails.
  • Packaging & Mounting — 256-ball LFBGA package (supplier device package listed as 256-CABGA, 14×14); surface-mount mounting type for compact board integration.
  • Operating Range & Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • MachXO2 Family System Features — Family-level capabilities include ultra-low-power modes, on-chip user flash memory options, pre-engineered source-synchronous I/O, programmable sysIO buffers, on-chip SPI/I²C and timers, and support for in-system reconfiguration and instant-on operation.
  • Standards & Compliance — RoHS compliant, supporting environmentally conscious design and assembly.

Typical Applications

  • System Glue Logic — Replace discrete glue components with a compact FPGA to consolidate bus bridging, address decoding, and protocol conversion.
  • Interface & I/O Expansion — Use the high I/O count for aggregating sensors, peripherals, or legacy interfaces on space-constrained PCBs.
  • Display and Synchronous I/O — Leverage MachXO2 family source-synchronous I/O and DDR-friendly features for display gearing and timing-critical I/O paths.
  • Embedded Control & Peripherals — Integrate timers, SPI and I²C functions alongside custom logic for board-level control and sequencing.
  • Low-Power Standby Systems — Take advantage of MachXO2 family low-power modes for systems that require minimal standby consumption and quick wake-up.

Unique Advantages

  • High I/O Count in a Compact Package: 206 I/Os in a 256-ball LFBGA footprint provide dense connectivity without increasing board area.
  • Integrated Memory for Buffering: Approximately 75,776 bits of on-chip RAM reduce the need for external SRAM in many buffering and FIFO applications.
  • Low-Voltage Single-Supply Operation: Narrow 1.14 V–1.26 V supply range simplifies power-rail design in low-voltage systems.
  • Family-Level System Support: MachXO2 family features such as on-chip flash, programmable I/O buffers, and in-system reconfiguration provide a flexible platform for evolving designs.
  • Commercial Temperature Range: Rated 0 °C to 85 °C for typical commercial deployments and environments.
  • RoHS Compliant: Meets common environmental and assembly requirements for modern electronics manufacturing.

Why Choose LCMXO2-2000ZE-3BG256C?

The LCMXO2-2000ZE-3BG256C positions itself as a practical, reconfigurable building block for commercial embedded systems that require a balance of logic capacity, high I/O count, and on-chip memory in a compact, surface-mount package. Its MachXO2 family heritage brings system-level features—such as programmable I/O buffers, embedded control peripherals, and low-power modes—that help reduce BOM complexity while retaining in-field flexibility through reconfiguration.

This device is well suited to engineers designing board-level controllers, interface bridges, display and timing logic, or peripheral aggregation hubs who need a predictable commercial-grade FPGA with integrated memory and broad I/O options.

Request a quote or submit an inquiry for pricing and availability to start integrating the LCMXO2-2000ZE-3BG256C into your next design.

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