LCMXO2-2000ZE-2TG100C

IC FPGA 79 I/O 100TQFP
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 79 75776 2112 100-LQFP

Quantity 753 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case100-LQFPNumber of I/O79Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs264Number of Logic Elements/Cells2112
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits75776

Overview of LCMXO2-2000ZE-2TG100C – MachXO2 FPGA, 2112 logic elements, 100‑LQFP

The LCMXO2-2000ZE-2TG100C is a MachXO2 family Field Programmable Gate Array (FPGA) in a 100‑pin LQFP/TQFP package. It combines 2112 logic elements with approximately 75.8 kbits of on‑chip RAM and 79 general‑purpose I/O to address system control, glue logic, and I/O interfacing requirements in commercial applications.

Designed for low‑power, non‑volatile FPGA use, this device supports flexible I/O and embedded memory to simplify integration and reduce board-level complexity for mid-density programmable logic needs.

Key Features

  • Core Logic  2112 logic elements (cells) for implementing combinational and sequential logic functions in mid-density designs.
  • Embedded Memory  Approximately 75.8 kbits of total on‑chip RAM, providing embedded and distributed memory resources for buffering and state storage.
  • I/O Capacity  79 I/O pins to support a variety of peripheral interfaces and board-level signal routing.
  • Power  Single supply operating range of 1.14 V to 1.26 V, optimized for low‑power operation consistent with the MachXO2 family low‑power process.
  • Package & Mounting  100‑pin LQFP (supplier listing: 100‑TQFP, 14×14) in a surface‑mount package for standard PCB assembly flows.
  • Operating Range & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • Non‑volatile, Reconfigurable Family Features  MachXO2 family capabilities include non‑volatile, instant‑on configuration and support for in‑field reconfiguration (family datasheet listed features).
  • System‑Level Functions  On‑chip support for common functions (family datasheet lists SPI, I²C, timers/counters and oscillator) to help reduce external components.
  • Standards & Packaging  RoHS compliant, halogen‑free packaging options available across the MachXO2 family (device is RoHS compliant).

Typical Applications

  • System Glue Logic  Use the 2112 logic elements to replace discrete glue logic and ASICs for board-level control and signal routing.
  • I/O Bridging and Protocol Adaptation  Leverage 79 I/Os and the MachXO2 family’s flexible I/O capabilities to implement protocol conversions and interface bridging.
  • Display and Memory Interfaces  Embedded memory and family I/O features support buffering and timing control for display or external memory interfaces.
  • Embedded Control  On‑chip timers, counters and non‑volatile configuration make the device suitable for user interface control and system management tasks.

Unique Advantages

  • Mid‑density integration: 2112 logic elements and ~75.8 kbits of RAM bring significant on‑chip capability to reduce external parts and PCB area.
  • Flexible I/O count: 79 I/Os provide ample connectivity for mixed‑signal systems, peripheral interfaces, and board-level routing requirements.
  • Low‑power family design: MachXO2 family features emphasize low standby and operational power, helping designs meet power budgets.
  • Non‑volatile configuration: Family‑level instant‑on and in‑field reconfiguration enable secure, single‑chip programmable solutions without external FPGA configuration memory.
  • Commercial temperature and RoHS compliance: Designed for commercial applications with an operating range of 0 °C to 85 °C and RoHS compliance for global manufacturing.
  • Standard surface‑mount package: 100‑pin LQFP/TQFP surface‑mount packaging supports conventional PCB assembly and reduces BOM complexity relative to multi‑chip solutions.

Why Choose LCMXO2-2000ZE-2TG100C?

This MachXO2 device balances integration, I/O flexibility, and on‑chip memory for commercial‑grade embedded systems that require reliable mid‑density programmable logic. Its combination of 2112 logic elements, substantial embedded RAM, and 79 I/Os makes it well suited for system glue logic, interface bridging, and control applications where reducing external components and achieving quick startup behavior are important.

Selecting the LCMXO2-2000ZE-2TG100C delivers a scalable, reconfigurable building block from the MachXO2 family that simplifies design iterations and supports in‑field updates while maintaining standard package and assembly compatibility.

Request a quote or submit a procurement inquiry to obtain pricing, lead‑time, and availability for LCMXO2-2000ZE-2TG100C.

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