LCMXO2-2000ZE-2TG100C
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 79 75776 2112 100-LQFP |
|---|---|
| Quantity | 753 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TQFP (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-LQFP | Number of I/O | 79 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 264 | Number of Logic Elements/Cells | 2112 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 75776 |
Overview of LCMXO2-2000ZE-2TG100C – MachXO2 FPGA, 2112 logic elements, 100‑LQFP
The LCMXO2-2000ZE-2TG100C is a MachXO2 family Field Programmable Gate Array (FPGA) in a 100‑pin LQFP/TQFP package. It combines 2112 logic elements with approximately 75.8 kbits of on‑chip RAM and 79 general‑purpose I/O to address system control, glue logic, and I/O interfacing requirements in commercial applications.
Designed for low‑power, non‑volatile FPGA use, this device supports flexible I/O and embedded memory to simplify integration and reduce board-level complexity for mid-density programmable logic needs.
Key Features
- Core Logic 2112 logic elements (cells) for implementing combinational and sequential logic functions in mid-density designs.
- Embedded Memory Approximately 75.8 kbits of total on‑chip RAM, providing embedded and distributed memory resources for buffering and state storage.
- I/O Capacity 79 I/O pins to support a variety of peripheral interfaces and board-level signal routing.
- Power Single supply operating range of 1.14 V to 1.26 V, optimized for low‑power operation consistent with the MachXO2 family low‑power process.
- Package & Mounting 100‑pin LQFP (supplier listing: 100‑TQFP, 14×14) in a surface‑mount package for standard PCB assembly flows.
- Operating Range & Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C.
- Non‑volatile, Reconfigurable Family Features MachXO2 family capabilities include non‑volatile, instant‑on configuration and support for in‑field reconfiguration (family datasheet listed features).
- System‑Level Functions On‑chip support for common functions (family datasheet lists SPI, I²C, timers/counters and oscillator) to help reduce external components.
- Standards & Packaging RoHS compliant, halogen‑free packaging options available across the MachXO2 family (device is RoHS compliant).
Typical Applications
- System Glue Logic Use the 2112 logic elements to replace discrete glue logic and ASICs for board-level control and signal routing.
- I/O Bridging and Protocol Adaptation Leverage 79 I/Os and the MachXO2 family’s flexible I/O capabilities to implement protocol conversions and interface bridging.
- Display and Memory Interfaces Embedded memory and family I/O features support buffering and timing control for display or external memory interfaces.
- Embedded Control On‑chip timers, counters and non‑volatile configuration make the device suitable for user interface control and system management tasks.
Unique Advantages
- Mid‑density integration: 2112 logic elements and ~75.8 kbits of RAM bring significant on‑chip capability to reduce external parts and PCB area.
- Flexible I/O count: 79 I/Os provide ample connectivity for mixed‑signal systems, peripheral interfaces, and board-level routing requirements.
- Low‑power family design: MachXO2 family features emphasize low standby and operational power, helping designs meet power budgets.
- Non‑volatile configuration: Family‑level instant‑on and in‑field reconfiguration enable secure, single‑chip programmable solutions without external FPGA configuration memory.
- Commercial temperature and RoHS compliance: Designed for commercial applications with an operating range of 0 °C to 85 °C and RoHS compliance for global manufacturing.
- Standard surface‑mount package: 100‑pin LQFP/TQFP surface‑mount packaging supports conventional PCB assembly and reduces BOM complexity relative to multi‑chip solutions.
Why Choose LCMXO2-2000ZE-2TG100C?
This MachXO2 device balances integration, I/O flexibility, and on‑chip memory for commercial‑grade embedded systems that require reliable mid‑density programmable logic. Its combination of 2112 logic elements, substantial embedded RAM, and 79 I/Os makes it well suited for system glue logic, interface bridging, and control applications where reducing external components and achieving quick startup behavior are important.
Selecting the LCMXO2-2000ZE-2TG100C delivers a scalable, reconfigurable building block from the MachXO2 family that simplifies design iterations and supports in‑field updates while maintaining standard package and assembly compatibility.
Request a quote or submit a procurement inquiry to obtain pricing, lead‑time, and availability for LCMXO2-2000ZE-2TG100C.