LCMXO2-2000ZE-2FTG256I

The LCMXO2-2000ZE-2FTG256I is a MachXO2 family FPGA offering 2,112 logic elements and 206 I/Os in a 256‑ball ftBGA (17×17) surface‑mount package. Designed for low‑power, instant‑on applications, the device combines configurable logic, embedded RAM and the MachXO2 family’s on‑chip nonvolatile capabilities to address industrial and embedded system use cases.

This industrial‑grade device supports a single low‑voltage supply (1.14 V to 1.26 V) and an extended operating temperature range (−40 °C to 100 °C), making it suitable for robust control, interface and I/O expansion roles where compact integration and low standby power are important.

Key Features

• Configurable Logic  2,112 logic elements provide flexible, application‑specific logic capacity for glue‑logic, protocol bridging and control tasks.
• Embedded Memory  Approximately 75,776 bits (≈75.8 kbits) of total on‑chip RAM for FIFOs, small buffers and state storage; the MachXO2 family also offers larger embedded BRAM options across device variants.
• High‑Density I/O  206 user I/Os in a compact ftBGA footprint. The MachXO2 family’s programmable sysIO buffer supports a broad set of interface standards for flexible signal interfacing.
• Low‑Voltage Operation  Single supply operation from 1.14 V to 1.26 V suits low‑power designs and simplifies power distribution on compact boards.
• Ultra Low Power Family Features  MachXO2 family devices include low standby power modes and power‑saving options for energy‑sensitive applications.
• On‑Chip Nonvolatile Options  Family‑level support for on‑chip user flash memory and in‑system programming interfaces (JTAG, SPI, I2C) enables single‑chip, secure configuration and background programming.
• Clocking and PLLs  Family support for flexible on‑chip clocking, including analog PLLs and multiple primary clocks, for robust timing control in synchronous designs.
• System Integration and Reliability  Hardened functions available in the MachXO2 family include I2C, SPI, timers/counters, an on‑chip oscillator and IEEE 1149.1 boundary scan for enhanced system-level support.
• Package and Temperature  256‑LBGA (supplier package: 256‑FTBGA 17×17) surface‑mount package, industrial grade, and rated for −40 °C to 100 °C operation.

Typical Applications

• Industrial Control  Use for I/O expansion, protocol translation and compact control logic where industrial temperature range and low standby power are required.
• Embedded Systems  Ideal for housekeeping logic, glue modules, and custom peripheral interfaces in embedded products that need reconfigurability and nonvolatile configuration.
• Communications and Networking  Implement interface bridging, signal conditioning and small buffering/FIFO functions leveraging the device’s I/O density and on‑chip RAM.
• Display and Interface Control  Drive and manage display interfaces or front‑panel control logic using the device’s flexible I/O and clocking resources.

Unique Advantages

• Compact, high‑I/O density: 206 I/Os in a 256‑ball ftBGA deliver many external interfaces in a small footprint to reduce board area.
• Embedded memory for real tasks: Approximately 75.8 kbits of on‑chip RAM supports FIFOs, buffers and state machines without external SRAM.
• Low‑voltage, low‑power operation: Narrow 1.14 V–1.26 V supply and MachXO2 family low‑power features reduce power budget and simplify power rails.
• Nonvolatile, instant‑on capability: Family support for on‑chip user flash and multiple programming interfaces enables rapid, secure boot and field updates.
• Industrial temperature rating: −40 °C to 100 °C operating range suits designs deployed in demanding environments.
• System functions on chip: Integrated timers, SPI/I2C controllers and boundary scan reduce BOM and speed time to market.

Why Choose LCMXO2-2000ZE-2FTG256I?

The LCMXO2-2000ZE-2FTG256I positions itself as a compact, low‑power FPGA solution for industrial and embedded designs that require moderate logic capacity, extensive I/O and reliable nonvolatile configuration. With 2,112 logic elements, approximately 75.8 kbits of on‑chip RAM, and 206 I/Os in a 256‑LBGA package, it balances integration and scalability for glue logic, interface control and system management tasks.

Engineers designing space‑constrained or power‑sensitive systems will find the MachXO2 family features—instant‑on configuration, flexible I/O standards, and hardened system functions—helpful for reducing BOM complexity and accelerating development. The industrial temperature rating and surface‑mount ftBGA package make this device suitable for deployed systems that demand long‑term robustness and integration.

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