LCMXO2-2000ZE-3TG144C

The LCMXO2-2000ZE-3TG144C is a MachXO2 family FPGA offering a compact, low-power programmable fabric with 2,112 logic elements and 111 general-purpose I/Os in a 144-pin LQFP package. Designed for system control, glue logic and interface tasks, this commercial-grade device combines a flexible logic architecture, embedded memory and non-volatile configuration options to simplify board-level integration.

Key Features

• Logic Capacity — 2,112 logic elements with 264 LABs/CLBs provide the programmable fabric for control, glue logic and moderate-density processing tasks.
• On-chip Memory — Approximately 75,776 bits of total on-chip RAM for register files, FIFOs and small buffers directly within the device.
• I/O Resources — 111 I/Os in the 144-LQFP package for flexible system interfacing and peripheral connectivity.
• Low-Voltage Core — Core supply range of 1.14 V to 1.26 V supports the device’s low-power architecture.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation to suit standard commercial applications.
• Package and Mounting — 144-LQFP (supplier package 144-TQFP, 20 mm × 20 mm) surface-mount package for compact PCB implementations.
• Non-Volatile Configuration — MachXO2 family features on-chip user flash and instant-on capability with in-field reconfiguration and background programming (family-level functionality).
• Flexible I/O Standards (family-level) — Series supports a broad range of I/O options including single-ended and differential interfaces for interoperable system designs.
• RoHS Compliant — Device is RoHS compliant for regulatory and environmental considerations.

Typical Applications

• System Glue Logic — Implement board-level glue, protocol translation and control state machines to reduce discrete component count and simplify routing.
• Interface Bridging — Use the device’s I/O count and flexible interfacing to connect disparate peripherals and support custom I/O mapping.
• Display and Peripheral Control — Deploy as a controller for user interfaces, display timing and peripheral management using embedded memory for frame buffers or FIFOs.
• Boot and Security Functions — Leverage on-chip non-volatile configuration and background programming to manage secure boot sequences and field updates (family-level capability).

Unique Advantages

• Compact, Ready-to-Deploy Package: 144-LQFP surface-mount package provides a balance of I/O density and board-level simplicity for space-constrained designs.
• Integrated Memory and Logic: 2,112 logic elements combined with ~75,776 bits of on-chip RAM reduce the need for external memory in many control and buffering applications.
• Low-Voltage, Low-Power Operation: Operates from a 1.14 V to 1.26 V core supply, aligning with modern low-power system rails.
• Instant-On and In-Field Reconfiguration (family-level): Supports single-chip non-volatile configuration and field updates to enable fast startup and flexible maintenance strategies.
• High I/O Count: 111 available I/Os enable broad peripheral connectivity without migrating to larger or more complex devices.
• Regulatory-Friendly: RoHS compliance supports environmentally conscious product designs.

Why Choose LCMXO2-2000ZE-3TG144C?

The LCMXO2-2000ZE-3TG144C positions itself as a practical, low-power programmable solution for system designers needing a balance of logic capacity, embedded memory and I/O density in a compact 144-LQFP package. Its combination of 2,112 logic elements, substantial on-chip RAM and 111 I/Os makes it well suited to control, interface bridging and peripheral management roles in commercial applications.

Choose this device when you need scalable, non-volatile FPGA functionality with flexible I/O and low-voltage operation, backed by the MachXO2 family’s configuration and in-field update features.

Request a quote or submit a pricing inquiry to evaluate LCMXO2-2000ZE-3TG144C for your next design.