LCMXO2-256HC-4SG32C

The LCMXO2-256HC-4SG32C is a MachXO2 family FPGA from Lattice Semiconductor Corporation in a compact 32‑UFQFN exposed‑pad package. It provides a low-pin-count, surface‑mount solution with 256 logic elements and 21 general-purpose I/Os for control, glue‑logic and interface tasks in commercial electronic products.

Designed for space‑constrained, low to moderate complexity designs, this device combines MachXO2 family architecture with a small 5 mm × 5 mm QFN footprint, a wide single-supply voltage range, and commercial temperature grading to simplify integration into consumer and communications equipment.

Key Features

• Logic Capacity — 256 logic elements: compact logic resource suitable for glue logic, state machines and interface functions.
• I/O — 21 general-purpose I/Os: flexible signal routing in a small package for peripheral interfacing and signal conditioning.
• Power and Supply — 2.375 V to 3.465 V supply range: accommodates common single‑supply systems and board-level power rails.
• Package & Mounting — 32‑UFQFN exposed pad (Supplier Device Package: 32‑QFN 5×5): surface-mount package with exposed pad for thermal performance in compact PCBs.
• Operating Range & Grade — Commercial grade with operating temperature 0 °C to 85 °C: appropriate for consumer and general-purpose electronic products.
• On‑chip Memory — No embedded SRAM in this density (Total RAM bits: 0): optimizes the device for logic and I/O functions rather than large data buffering.
• Integrated System Functions (MachXO2 family) — The MachXO2 family includes on-chip peripherals such as SPI, I2C and timer/counter functionality for system integration and control.
• Environmental — RoHS compliant: meets common lead‑free manufacturing requirements.

Typical Applications

• Consumer Electronics — Board-level glue logic, user interface control and peripheral multiplexing where a small, surface‑mount FPGA reduces component count.
• Communications & Peripherals — Protocol bridging, signal translation and small I/O expansion tasks using the 21 available I/Os and flexible MachXO2 family I/O options.
• Embedded Control — State machines, control sequencing and system supervisory functions that require modest logic capacity and compact packaging.
• Instrumentation & Test — Custom logic for measurement front-ends, test adapters and small form‑factor controller boards where a 5×5 mm QFN package is advantageous.

Unique Advantages

• Compact, Surface‑Mount Footprint: 32‑UFQFN (5×5 mm) package minimizes PCB area while providing an exposed pad for thermal management.
• Right‑Sized Logic for Glue‑Logic Tasks: 256 logic elements deliver adequate capacity for control, interfacing and low-to-moderate complexity designs without excess cost or area.
• Flexible I/O Count: 21 I/Os enable multiple peripheral connections and signal routing options for small systems.
• Single‑Supply Flexibility: Broad supply range (2.375–3.465 V) fits common board power rails and simplifies power design.
• Commercial Temperature Rating: 0 °C to 85 °C aligns with consumer and general-purpose electronics deployment.
• RoHS Compliance: Supports lead‑free manufacturing processes and environmental requirements.

Why Choose LCMXO2-256HC-4SG32C?

The LCMXO2-256HC-4SG32C positions itself as a compact, cost‑effective MachXO2 family member for designers needing a small FPGA to handle glue logic, protocol adaptation and simple control functions. Its 256 logic elements, 21 I/Os and small 32‑UFQFN exposed‑pad package make it well suited to space‑constrained commercial designs where integration and board area matter.

Backing from the MachXO2 family architecture provides access to family-level integration features and density migration options for future design scaling, helping teams standardize on a familiar FPGA platform while maintaining a compact bill of materials and straightforward PCB integration.

Request a quote or submit a pricing inquiry to receive availability and ordering information for the LCMXO2-256HC-4SG32C.