LCMXO2-256HC-4SG32I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 21 256 32-UFQFN Exposed Pad |
|---|---|
| Quantity | 1,062 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 32-QFN (5x5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 32-UFQFN Exposed Pad | Number of I/O | 21 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 32 | Number of Logic Elements/Cells | 256 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of LCMXO2-256HC-4SG32I – MachXO2 Field Programmable Gate Array (FPGA) IC, 256 logic elements, 21 I/O, 32‑UFQFN Exposed Pad
The LCMXO2-256HC-4SG32I is a MachXO2 family FPGA offering a compact, low-power programmable logic solution with 256 logic elements and 21 general-purpose I/Os in a 32‑UFQFN exposed‑pad package. Designed for space‑constrained and industrial applications, it provides single‑chip configurability and flexible I/O for interface bridging, glue logic, and control tasks.
Key hardware attributes include a 2.375 V to 3.465 V supply range, industrial operating temperature from −40 °C to 100 °C, surface‑mount 32‑UFQFN (5 mm × 5 mm) packaging with exposed pad, and RoHS compliance—making it suited for robust embedded designs that require a small, programmable device footprint.
Key Features
- Programmable Logic Core — Contains 256 logic elements suitable for small-to-medium glue logic, protocol translation, and control implementations.
- I/O Capacity and Flexibility — 21 I/Os available for signal interfacing; family-level MachXO2 I/O architecture supports a wide range of interface standards and configurable buffer options.
- Power and Supply — Operates from 2.375 V to 3.465 V single supply, enabling compatibility with a variety of system rail voltages.
- Package and Mounting — Surface‑mount 32‑UFQFN exposed‑pad package (supplier device package: 32‑QFN, 5 mm × 5 mm) for compact board layouts and improved thermal dissipation through the exposed pad.
- Industrial Temperature Grade — Rated for −40 °C to 100 °C operation, supporting industrial environments and extended temperature systems.
- Regulatory Status — RoHS compliant for environmental and manufacturing consistency.
- On‑chip/Family System Features — As part of the MachXO2 family, benefits include instant-on nonvolatile configuration, in-field reconfiguration capability, and on-chip system support functions such as SPI, I2C and timers (family-level features).
- Memory Characteristics — This part reports 0 total RAM bits; designers should plan external memory if runtime embedded RAM is required.
Typical Applications
- Interface Bridging — Use the FPGA to translate or bridge between modest peripheral interfaces and system buses using available I/Os and programmable logic.
- Embedded Control and Glue Logic — Implement custom control state machines, hardware sequencers, and glue logic to reduce BOM and minimize latency in embedded systems.
- Industrial Instrumentation — Deploy in sensors, measurement instruments, and factory automation where industrial temperature range and compact packaging are required.
- Human‑Machine Interfaces — Manage keypad, LED, and display control tasks with programmable I/O and small logic designs.
Unique Advantages
- Compact, thermally aware package: 32‑UFQFN exposed pad (5 mm × 5 mm) provides small footprint with improved board‑level thermal conduction for dense designs.
- Industrial temperature rating: −40 °C to 100 °C operation supports deployment in harsh or temperature‑variable environments.
- Flexible supply range: Wide operating voltage (2.375 V to 3.465 V) enables direct integration with common 2.5 V and 3.3 V systems.
- Low part count solution: 256 logic elements and 21 I/Os allow consolidation of discrete glue logic and small controllers into a single programmable device.
- RoHS compliant: Aligns with environmental and manufacturing requirements for lead‑free assembly.
- Family ecosystem benefits: Access to MachXO2 family features such as instant-on nonvolatile configuration and on-chip system functions (SPI, I2C, timers) streamlines system design and in-field updates.
Why Choose LCMXO2-256HC-4SG32I?
LCMXO2-256HC-4SG32I positions itself as a compact, industrial‑grade programmable logic device for applications that need modest logic capacity, flexible I/O, and a small board footprint. Its packaged exposed pad and extended temperature range make it appropriate for embedded and industrial designs that prioritize reliability and space efficiency.
Engineers seeking a single-chip, configurable solution to replace discrete logic, implement protocol glue, or add flexible control functionality will find this MachXO2 member aligns with streamlined BOM goals and provides family‑level system features to support development and in-field reconfiguration.
Request a quote or submit a purchase inquiry to evaluate LCMXO2-256HC-4SG32I for your next embedded or industrial project.

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