LCMXO2-2000ZE-3TG144I

IC FPGA 111 I/O 144TQFP
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 111 75776 2112 144-LQFP

Quantity 918 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LQFPNumber of I/O111Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs264Number of Logic Elements/Cells2112
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits75776

Overview of LCMXO2-2000ZE-3TG144I – MachXO2 FPGA, 2,112 Logic Elements, 144‑LQFP

The LCMXO2-2000ZE-3TG144I is a MachXO2 family Field Programmable Gate Array (FPGA) supplied in a 144‑pin LQFP surface‑mount package. It provides 2,112 logic elements, approximately 75.8 kbits of on‑chip RAM, and 111 programmable I/Os for compact, reconfigurable system designs.

Designed for industrial applications, the device combines flexible logic, embedded memory, and family-level system features such as non‑volatile on‑chip flash and reconfiguration support to address control, interface and system‑level glue logic functions where integration and low standby power matter.

Key Features

  • Logic Capacity — 2,112 logic elements (LUT4-class resources) for implementing custom combinational and sequential logic.
  • Embedded Memory — Total on‑chip RAM of 75,776 bits (approximately 75.8 kbits) for small FIFOs, buffers and state storage.
  • I/O and Interface Flexibility — 111 I/Os supporting a wide range of system interfacing requirements in a single 144‑LQFP package.
  • Power Supply Range — Core voltage supply specified from 1.14 V to 1.26 V, aligning with low‑voltage system designs.
  • Industrial Temperature Grade — Rated for operation from −40°C to 100°C for reliable performance in industrial environments.
  • On‑chip Non‑volatile and Reconfiguration (Family Feature) — MachXO2 family supports on‑chip user flash, instant‑on behavior and in‑field reconfiguration, enabling secure, single‑chip configurations and background programming.
  • System Support Functions (Family Feature) — Hardened on‑chip functions such as SPI, I2C and timer/counter, plus JTAG and boundary‑scan support for system integration and debug.
  • Package and Mounting — 144‑LQFP (supplier device package listed as 144‑TQFP 20×20) in a surface‑mount form factor for straightforward PCB assembly.

Typical Applications

  • Display and Source‑Synchronous I/O — Use the device’s family support for pre‑engineered source‑synchronous I/Os and gearing features to manage display interfaces and high‑speed parallel data paths.
  • Memory Interface Support — Deploy as a bridging or control device where family DDR/DDR2/LPDDR support and dedicated FIFO control logic aid external memory interfacing tasks.
  • Embedded System Control — Leverage on‑chip SPI, I2C and timers for system management, sensor aggregation, and peripheral control in industrial equipment.
  • Field‑Upgradable Logic — Implement in applications requiring in‑field logic updates or secure instant‑on operation using the family’s non‑volatile configuration and TransFR™ reconfiguration capabilities.

Unique Advantages

  • Compact, Integrated FPGA — 2,112 logic elements and ~75.8 kbits of RAM plus 111 I/Os in a 144‑pin LQFP package reduce board area and component count for many system functions.
  • Industrial Temperature Range — −40°C to 100°C rating supports deployment in harsh or temperature‑variable industrial environments.
  • Flexible System Interfaces — Family features include programmable I/O buffers and on‑chip peripheral functions (SPI, I2C) that simplify interfacing and reduce external glue logic.
  • Non‑volatile, Reconfigurable Operation — Family‑level instant‑on and background programming enable secure single‑chip configuration and in‑field updates without external boot ROMs.
  • Low‑Power Family Options — MachXO2 family offers ultra‑low standby power modes (family data cites standby as low as 22 μW) for designs where idle energy consumption is critical.
  • Design Migration Path — The MachXO2 family supports density migration across devices, allowing designers to scale logic capacity within the same series.

Why Choose LCMXO2-2000ZE-3TG144I?

The LCMXO2-2000ZE-3TG144I positions itself as a flexible, industrial‑grade FPGA option for designs that require a balance of logic capacity, on‑chip RAM and a substantial number of I/Os in a compact LQFP package. Its supported core voltage range and extended operating temperature make it suitable for robust embedded and industrial control applications.

By combining on‑chip non‑volatile reconfiguration, hardened system peripherals and family support for low‑power and source‑synchronous I/O, this device offers a practical platform for engineers seeking integration, reprogrammability and a migration path within the MachXO2 series.

Request a quote or submit a purchase inquiry to receive pricing and availability for the LCMXO2-2000ZE-3TG144I.

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