LCMXO2-4000HE-6BG256C

The LCMXO2-4000HE-6BG256C is a MachXO2 family Field Programmable Gate Array (FPGA) in a 256-ball LFBGA package. It combines a flexible logic architecture with embedded memory and broad I/O support to serve system glue logic, interface bridging, and low-power control functions in commercial applications.

This device provides 4,320 logic elements (540 CLBs), approximately 94 kbits of on-chip RAM (94,208 bits), and 206 I/Os, operating from 1.14 V to 1.26 V over a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core Logic  4,320 logic elements implemented across 540 CLBs, enabling mid-density programmable logic for control, glue, and timing functions.
• Embedded Memory  Approximately 94 kbits of on-chip RAM (94,208 total RAM bits) for FIFOs, small buffers, and state storage.
• I/O Capacity and Flexibility  206 general-purpose I/Os; MachXO2 family I/O architecture supports a wide range of standards including LVCMOS, LVTTL, LVDS, SSTL, HSTL and programmable differential/hot-socketing options.
• Power  Operates from a supply range of 1.14 V to 1.26 V and leverages the MachXO2 family’s low-power design optimizations for reduced standby consumption.
• On-Chip Configuration and Peripherals  Family-level features include non-volatile user flash memory options, background programming via JTAG/SPI/I²C, and hardened functions such as SPI, I²C and timer/counter for simplified system integration.
• Clocking and Timing  Flexible on-chip clocking with multiple primary clocks and PLL capability available in the MachXO2 family for source-synchronous and DDR-style I/O support.
• Package and Temperature  256-LFBGA package (supplier device package: 256-CABGA, 14 × 14 mm), surface-mount mounting; commercial-grade operating range 0 °C to 85 °C. RoHS compliant.

Typical Applications

• Interface Bridging and Glue Logic  Use the device’s programmable logic and abundant I/Os to consolidate discrete logic, translate protocols, and implement board-level bridging functions.
• Display and Source-Synchronous I/O  MachXO2 family pre-engineered source-synchronous I/O features make the device suited for display gearing and DDR/DDRx interface control in embedded systems.
• Embedded Control and Peripheral Management  On-chip flash and hardened peripherals (SPI, I²C, timers) allow the FPGA to host control firmware, handle sensor aggregation, and manage peripheral buses.
• Memory Interface Support  Dedicated gearing and DDR-friendly I/O capabilities support memory interface functions such as FIFO buffering and DQS-handled connections.

Unique Advantages

• Mid-density, production-ready logic: 4,320 logic elements in a compact 256-ball package balance capacity and footprint for many system designs.
• Integrated memory and peripherals: Approximately 94 kbits of embedded RAM plus family-level on-chip flash and hardened SPI/I²C/timer blocks reduce external component count.
• Flexible I/O ecosystem: 206 I/Os and a programmable sysIO buffer architecture enable wide protocol support and adaptability to diverse board-level interfaces.
• Low-voltage operation: Narrow supply range (1.14 V–1.26 V) supports low-power system architectures where single-supply integration is required.
• Commercial-grade and RoHS compliant: Surface-mount 256-LFBGA package and commercial temperature rating suit mainstream electronics production and compliance needs.

Why Choose LCMXO2-4000HE-6BG256C?

The LCMXO2-4000HE-6BG256C positions itself as a versatile mid-density MachXO2 FPGA for designers who need a compact, low-power programmable device with substantial I/O and embedded memory. Its combination of 4,320 logic elements, extensive I/O count, and on-chip RAM makes it well suited for system glue logic, interface translation, and embedded control in commercial products.

With family-level support for non-volatile configuration, flexible clocking and I/O standards, and RoHS-compliant packaging, this device offers scalability and integration that streamline BOMs and simplify board-level designs while leveraging Lattice MachXO2 architectural features.

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