LCMXO2-4000HE-6BG332I

IC FPGA 274 I/O 332CABGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 274 94208 4320 332-FBGA

Quantity 409 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package332-CABGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case332-FBGANumber of I/O274Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs540Number of Logic Elements/Cells4320
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO2-4000HE-6BG332I – MachXO2 FPGA, 4320 logic elements, 274 I/Os

The LCMXO2-4000HE-6BG332I is a MachXO2 family Field Programmable Gate Array (FPGA) IC designed for industrial-grade system control, interface bridging and board-level logic integration. It combines a flexible logic architecture with a high I/O count and on-chip RAM to address glue-logic, protocol adaptation and peripheral interfacing tasks.

This device delivers a balance of integration and low-power operation with instant-on capability, making it suitable for applications that require fast boot, reconfiguration and reliable operation across an extended temperature range.

Key Features

  • Core Logic — 4,320 logic elements (cells) for implementing glue logic, state machines and control functions.
  • On-chip Memory — 94,208 bits of embedded RAM (approximately 94 kbits) for buffering and small data storage needs.
  • I/O Density — 274 general-purpose I/Os to support high pin-count interfaces and multiple peripherals.
  • Power — Single-supply operation with a specified voltage range of 1.14 V to 1.26 V and family-level ultra-low-power modes (including low-μW standby options) described in the MachXO2 data sheet.
  • Package & Mounting — 332-ball FBGA package case; supplier device package listed as 332-CABGA (17×17); surface-mount mounting type.
  • Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for reliable performance in industrial environments.
  • Family-Level System Features — MachXO2 family capabilities include instant-on non-volatile configuration, background programming, on-chip user flash memory, hardened functions (I²C, SPI, timer/counter), and system trace ID for tracking.
  • Flexible I/O & Clocking — Family-level support for multiple I/O standards, programmable differential I/Os, DDR/I/O gearing and flexible on-chip clocking including PLLs and multiple primary clocks as described in the MachXO2 data sheet.

Typical Applications

  • Board-level Glue Logic — Replace discrete glue components by consolidating address decoding, bus bridging and glue functions into a single reconfigurable device.
  • Interface Bridging — Implement protocol conversion, level translation and multi-interface aggregation using the high I/O count and flexible I/O options.
  • Peripheral & Control Logic — Host peripheral control, sensor interfacing and custom state machines leveraging on-chip RAM and logic elements.
  • System Monitoring & Management — Use on-chip timers, counters and serial interfaces (I²C/SPI) for system supervision and service functions.

Unique Advantages

  • High I/O Integration: 274 I/Os reduce external glue logic and simplify board routing for complex interface designs.
  • Compact, High-density Packaging: 332-ball FBGA / 332-CABGA (17×17) packaging enables a small footprint while supporting a large pin count.
  • Industrial Reliability: −40 °C to 100 °C operating range and surface-mount packaging support deployment in industrial applications.
  • Non-volatile, Instant-on Operation: MachXO2 family non-volatile configuration enables fast power-up and in-field updates without external configuration devices.
  • Embedded System Functions: Built-in I²C, SPI and timer/counter primitives simplify common system tasks and reduce BOM complexity.
  • On-chip Embedded Memory: Approximately 94 kbits of RAM provides local buffering and storage for control tasks and data staging.

Why Choose LCMXO2-4000HE-6BG332I?

The LCMXO2-4000HE-6BG332I positions itself as a versatile FPGA for designers needing substantial I/O, moderate logic density and industrial temperature performance. Its MachXO2 family capabilities—non-volatile instant-on configuration, low-power modes and integrated system functions—help streamline designs that require reliable boot, flexible interfacing and in-field reprogrammability.

This part is well suited for engineering teams seeking a compact, reconfigurable solution to consolidate board logic, implement protocol bridging and manage peripheral control while keeping board area and component count low.

Request a quote or submit an inquiry to evaluate the LCMXO2-4000HE-6BG332I for your next design and get detailed pricing and availability information.

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