LCMXO2-4000HE-6FTG256C

The LCMXO2-4000HE-6FTG256C is a MachXO2 family FPGA offering a compact, non-volatile programmable fabric with a high I/O count and embedded memory. It combines approximately 4,320 logic elements with roughly 94 kbits of on-chip RAM and 206 I/Os in a 256-ball FT BGA package, suited for commercial-temperature embedded designs.

Designed for low-power, instant-on applications, this MachXO2 device is targeted at control, interface, and system glue logic roles where dense I/O, reconfigurability, and field update capability are required.

Key Features

• Core Logic  Approximately 4,320 logic elements provide flexible LUT4-based logic resources for glue-logic, protocol bridging, and custom control functions.
• Embedded Memory  Approximately 94,208 bits of on-chip RAM for distributed storage and small FIFOs; MachXO2 family also includes embedded block RAM options at the family level.
• I/O Density & Flexibility  206 general-purpose I/Os in a 256-ball package provide broad signal connectivity and port density for multi-interface designs.
• Power  Single-supply operation with a nominal voltage range of 1.14 V to 1.26 V and family-level ultra low-power design options (family datasheet notes standby power as low as 22 μW).
• Non‑Volatile Configuration & In‑field Updates  MachXO2 family supports on-chip user flash memory and TransFR reconfiguration for in-field logic updates while systems operate.
• Programmable I/O Standards  Family-level programmable sysIO buffer supports a wide range of interfaces (LVCMOS, LVTTL, LVDS, Bus-LVDS, SSTL, HSTL and others), enabling mixed-signal and multi-voltage I/O designs.
• Clocking and PLLs  Flexible clocking resources with multiple primary clocks and up to two analog PLLs per device (fractional‑n synthesis) for system timing and interface requirements.
• Package & Mounting  256-FTBGA (17 × 17 mm) package, surface-mount mounting type, commercial-grade temperature range of 0 °C to 85 °C.
• System Integration  MachXO2 family provides hardened peripherals and system features at the family level, including SPI, I²C, timers/counters, on-chip oscillator, JTAG and IEEE 1149.1 boundary scan capability.
• Compliance  RoHS-compliant.

Typical Applications

• Interface Bridging  Use the device for protocol conversion and multi-standard interface glue logic, leveraging flexible I/O standards and high pin count.
• Display and Memory Interfaces  Family-level pre‑engineered source-synchronous I/O and DDR support make it suitable for display I/O gearing and memory-interface control tasks.
• Field‑Upgradeable Control Logic  On-chip user flash and TransFR reconfiguration enable in-field updates to control and feature logic without removing the device.
• Embedded System Glue  High I/O density and ~4,320 logic elements are well suited for sensor aggregation, board-level glue logic, and peripheral control in commercial embedded systems.

Unique Advantages

• High I/O Capacity:  206 I/Os in a compact 256-ball FT BGA deliver board-level connectivity without large package footprints.
• Reconfigurable, Non‑Volatile Operation:  On-chip flash and TransFR reconfiguration allow secure, repeatable boot and in-field logic updates.
• Low Standby Power (Family-Level):  MachXO2 family includes ultra-low-power architecture options with standby power reported as low as 22 μW, supporting power-sensitive designs.
• Integrated System Functions:  Hardened SPI/I²C and timer/counter functions reduce external component count and simplify system design.
• Compact, Surface‑Mount Package:  256‑FTBGA (17×17 mm) balances thermal and board-space needs for dense commercial designs.

Why Choose LCMXO2-4000HE-6FTG256C?

LCMXO2-4000HE-6FTG256C positions itself as a versatile, commercially graded FPGA for embedded designs that require a balance of logic capacity, extensive I/O, and reconfigurability. With approximately 4,320 logic elements, around 94 kbits of on-chip RAM, and 206 I/Os in a 256-FTBGA package, it is suited to system glue, interface bridging, and field-updateable control tasks.

Backed by MachXO2 family system-level features—non-volatile configuration, programmable I/O standards, on-chip peripherals (SPI, I²C, timers), and flexible clocking—this device offers long-term design flexibility and simplified BOM for commercial embedded products operating across 0 °C to 85 °C.

Request a quote or submit a purchase inquiry for LCMXO2-4000HE-6FTG256C to evaluate this MachXO2 FPGA for your next embedded design.