LCMXO2-4000HE-6MG184C

The LCMXO2-4000HE-6MG184C is a MachXO2 family FPGA offering a flexible logic architecture with 4,320 logic elements and 150 user I/Os in a 184-LFBGA (csBGA) package. Built for low-power, non-volatile system control and interface applications, the device integrates on-chip flash, embedded RAM, and a programmable I/O fabric to support a wide range of configurable I/O standards and memory interfaces.

Key value propositions include low standby power operation, instant-on non-volatile configuration, embedded memory resources, and field reconfiguration capability—delivering compact, reprogrammable logic and I/O control in a commercial-grade device (0 °C to 85 °C).

Key Features

• Core Logic  4,320 logic elements provide the programmable fabric for glue logic, protocol bridging, and control functions.
• Embedded Memory  Approximately 94 kbits of on-chip RAM (94,208 bits) for distributed memory and buffering.
• On-Chip Non-Volatile Flash  Integrated user flash memory (series-level capability) supports single-chip, instant-on configuration and background programming.
• Flexible I/O  150 user I/Os with programmable sysIO buffer support for multiple interfaces and on-chip differential termination (series-level feature set).
• High-Speed I/O and Memory Support  Pre-engineered source-synchronous I/O with DDR registers and dedicated gearing logic for display and memory interfaces (series-level capability).
• Low Power Operation  Advanced 65 nm low-power process and standby modes; series documentation cites standby power as low as 22 μW.
• Clocking and PLLs  Flexible on-chip clocking with multiple primary clocks and up to two analog PLLs per device (series-level).
• Reconfiguration and System Features  Non-volatile, infinitely reconfigurable logic with TransFR in-field reconfiguration, on-chip oscillator, and hardened peripherals such as SPI and I²C (series-level).
• Commercial Grade, Surface Mount Package  184-LFBGA (csBGA, 8×8) surface-mount package; RoHS compliant; operating range 0 °C to 85 °C.
• Supply Voltage  Core voltage range specified at 1.14 V to 1.26 V.

Typical Applications

• Display and Video I/O  Use the device’s gearing and pre-engineered source-synchronous I/O to implement display interfaces and register-based timing logic.
• Memory Interface and Buffering  On-chip RAM and DDR/DDRx support (series-level) enable data buffering, FIFO control and memory interface glue logic.
• Field-Upgradeable Systems  TransFR reconfiguration and on-chip flash make the device suitable for systems that require in-field logic updates without external programming hardware.
• Low-Power Control and Standby Management  Low standby power and power-saving options are suitable for controller tasks where minimizing idle power is important.

Unique Advantages

• Highly Integrated Logic and Memory: 4,320 logic elements and approximately 94 kbits of on-chip RAM reduce external component count for control and buffering functions.
• Non-Volatile Instant-On: Embedded user flash enables single-chip, secure instant-on systems and background programming without external configuration PROMs (series-level).
• Extensive I/O Flexibility: 150 programmable I/Os with differential termination and multi-standard support provide broad interfacing options in a compact package.
• Field Reconfiguration: TransFR allows in-field logic updates while the system operates, simplifying maintenance and feature upgrades.
• Low-Power Operation: Advanced low-power process and standby modes lower system power consumption during idle periods.
• Compact, Surface-Mount Packaging: 184-LFBGA (csBGA) package delivers high I/O density and a small board footprint for space-constrained designs.

Why Choose LCMXO2-4000HE-6MG184C?

The LCMXO2-4000HE-6MG184C positions itself as a compact, low-power, non-volatile FPGA suited for designers needing reprogrammable logic with rich I/O and embedded memory. Its combination of 4,320 logic elements, approximately 94 kbits of RAM, and 150 I/Os in a 184-LFBGA package enables integration of interface, control and buffering functions while minimizing external components.

With instant-on configuration, field reconfiguration capability, and commercial-grade operating range, the device supports scalable design approaches where reprogrammability, low standby power and flexible I/O are priorities.

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