LCMXO2-4000ZE-1BG256C
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 206 94208 4320 256-LFBGA |
|---|---|
| Quantity | 726 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 206 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 540 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO2-4000ZE-1BG256C – MachXO2 FPGA IC, 256-LFBGA, 4320 logic elements
The LCMXO2-4000ZE-1BG256C is a MachXO2 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It provides a flexible logic architecture with 4,320 logic elements and broad I/O capability, packaged in a 256-ball LFBGA (supplier package listed as 256-CABGA, 14×14).
Designed for commercial applications, this device targets system control, interface bridging and configuration functions that benefit from low-power operation, embedded non-volatile memory and a high-density I/O complement.
Key Features
- Logic Capacity — 4,320 logic elements suitable for glue logic, control and medium-density FPGA tasks.
- Embedded RAM — Approximately 94 kbits of on-chip RAM (total RAM bits: 94,208) for distributed and block memory needs.
- I/O Density — 206 I/Os to support broad peripheral and bus interfacing on a single device.
- On-chip Non-volatile Memory — Family supports on-chip user flash for configuration and in-field updates (see MachXO2 family documentation for UFM details).
- Flexible I/O Buffering — Programmable sysIO buffering options and programmable differential I/O modes described in the MachXO2 family datasheet enable multiple interface standards.
- Power — Low-voltage core operation with a supply range of 1.14 V to 1.26 V to support low-power system designs.
- Clocking and PLLs — Family clocking features include multiple primary clocks and analog PLL support for flexible timing architectures (refer to family datasheet for details).
- Non-volatile, Reconfigurable — Instant-on, single-chip non-volatile configuration with background programming and in-field reconfiguration options described in the MachXO2 family data.
- Package and Temperature — 256-LFBGA package case with commercial operating temperature range of 0 °C to 85 °C.
- RoHS Compliant — Device meets RoHS environmental compliance as supplied.
Typical Applications
- Interface Bridging: Use the 206 I/Os and programmable I/O buffers to implement protocol translation and board-level interface logic.
- System Control and Glue Logic: Deploy the 4,320 logic elements and on-chip RAM for power sequencing, reset control, and peripheral orchestration.
- Configuration and Security Functions: Leverage the MachXO2 family’s non-volatile on-chip flash and background programming for secure, single-chip configuration and in-field updates.
- Display and Memory Support: Take advantage of family-level pre-engineered source-synchronous I/O and DDR gearing options for display or external memory interface tasks (see family datasheet for supported modes).
Unique Advantages
- High I/O Count in a Compact Package: 206 I/Os in a 256-ball LFBGA footprint enable dense connectivity without requiring larger packages.
- Integrated Non-volatile Configuration: On-chip user flash and instant-on capability simplify board design by removing the need for external configuration PROMs.
- Low-Voltage Operation: Narrow core supply range (1.14 V–1.26 V) supports low-power system designs and consistent power management.
- Embedded Memory Resources: Approximately 94 kbits of on-chip RAM provides local buffering and state storage for control logic and interfaces.
- Commercial Temperature Range: Rated 0 °C to 85 °C for standard commercial deployments where extended temperature ranges are not required.
Why Choose LCMXO2-4000ZE-1BG256C?
The LCMXO2-4000ZE-1BG256C combines a balance of logic capacity, significant I/O density and on-chip configuration memory in a compact 256-ball LFBGA package. Its MachXO2 family capabilities—low-power operation, non-volatile instant-on configuration and flexible I/O options—make it well suited to designs that require reliable board-level control, interface bridging and in-field reconfiguration without adding external configuration components.
This device is a fit for commercial embedded systems and electronic products that need medium-density FPGA resources, robust on-chip memory, and high I/O counts while maintaining a small footprint and low-voltage core operation. For designs that may scale across the MachXO2 family, the device aligns with family-level options for memory, I/O and clocking described in the MachXO2 data materials.
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