LCMXO2-4000ZE-1BG256C

IC FPGA 206 I/O 256CABGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 206 94208 4320 256-LFBGA

Quantity 726 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGANumber of I/O206Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs540Number of Logic Elements/Cells4320
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO2-4000ZE-1BG256C – MachXO2 FPGA IC, 256-LFBGA, 4320 logic elements

The LCMXO2-4000ZE-1BG256C is a MachXO2 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It provides a flexible logic architecture with 4,320 logic elements and broad I/O capability, packaged in a 256-ball LFBGA (supplier package listed as 256-CABGA, 14×14).

Designed for commercial applications, this device targets system control, interface bridging and configuration functions that benefit from low-power operation, embedded non-volatile memory and a high-density I/O complement.

Key Features

  • Logic Capacity — 4,320 logic elements suitable for glue logic, control and medium-density FPGA tasks.
  • Embedded RAM — Approximately 94 kbits of on-chip RAM (total RAM bits: 94,208) for distributed and block memory needs.
  • I/O Density — 206 I/Os to support broad peripheral and bus interfacing on a single device.
  • On-chip Non-volatile Memory — Family supports on-chip user flash for configuration and in-field updates (see MachXO2 family documentation for UFM details).
  • Flexible I/O Buffering — Programmable sysIO buffering options and programmable differential I/O modes described in the MachXO2 family datasheet enable multiple interface standards.
  • Power — Low-voltage core operation with a supply range of 1.14 V to 1.26 V to support low-power system designs.
  • Clocking and PLLs — Family clocking features include multiple primary clocks and analog PLL support for flexible timing architectures (refer to family datasheet for details).
  • Non-volatile, Reconfigurable — Instant-on, single-chip non-volatile configuration with background programming and in-field reconfiguration options described in the MachXO2 family data.
  • Package and Temperature — 256-LFBGA package case with commercial operating temperature range of 0 °C to 85 °C.
  • RoHS Compliant — Device meets RoHS environmental compliance as supplied.

Typical Applications

  • Interface Bridging: Use the 206 I/Os and programmable I/O buffers to implement protocol translation and board-level interface logic.
  • System Control and Glue Logic: Deploy the 4,320 logic elements and on-chip RAM for power sequencing, reset control, and peripheral orchestration.
  • Configuration and Security Functions: Leverage the MachXO2 family’s non-volatile on-chip flash and background programming for secure, single-chip configuration and in-field updates.
  • Display and Memory Support: Take advantage of family-level pre-engineered source-synchronous I/O and DDR gearing options for display or external memory interface tasks (see family datasheet for supported modes).

Unique Advantages

  • High I/O Count in a Compact Package: 206 I/Os in a 256-ball LFBGA footprint enable dense connectivity without requiring larger packages.
  • Integrated Non-volatile Configuration: On-chip user flash and instant-on capability simplify board design by removing the need for external configuration PROMs.
  • Low-Voltage Operation: Narrow core supply range (1.14 V–1.26 V) supports low-power system designs and consistent power management.
  • Embedded Memory Resources: Approximately 94 kbits of on-chip RAM provides local buffering and state storage for control logic and interfaces.
  • Commercial Temperature Range: Rated 0 °C to 85 °C for standard commercial deployments where extended temperature ranges are not required.

Why Choose LCMXO2-4000ZE-1BG256C?

The LCMXO2-4000ZE-1BG256C combines a balance of logic capacity, significant I/O density and on-chip configuration memory in a compact 256-ball LFBGA package. Its MachXO2 family capabilities—low-power operation, non-volatile instant-on configuration and flexible I/O options—make it well suited to designs that require reliable board-level control, interface bridging and in-field reconfiguration without adding external configuration components.

This device is a fit for commercial embedded systems and electronic products that need medium-density FPGA resources, robust on-chip memory, and high I/O counts while maintaining a small footprint and low-voltage core operation. For designs that may scale across the MachXO2 family, the device aligns with family-level options for memory, I/O and clocking described in the MachXO2 data materials.

Request a quote or submit a sales inquiry to learn about availability, pricing and lead time for the LCMXO2-4000ZE-1BG256C.

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