LCMXO2-4000ZE-1BG256I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 206 94208 4320 256-LFBGA |
|---|---|
| Quantity | 1,158 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 206 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 540 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO2-4000ZE-1BG256I – MachXO2 FPGA, 4,320 Logic Elements, 206 I/Os
The LCMXO2-4000ZE-1BG256I is a MachXO2 family field-programmable gate array (FPGA) from Lattice Semiconductor, provided in a 256-ball BGA package. It combines a flexible logic architecture with on-chip memory and high I/O density to address control, glue-logic, and interface tasks in industrial systems.
Designed for low-power operation and instant-on capability, this part targets applications that require integrated flash-based configuration, a broad set of programmable I/O options, and reliable operation across an extended industrial temperature range.
Key Features
- Core Logic — 4,320 logic elements that support flexible LUT-based implementations for glue logic, state machines, and control functions.
- On-Chip Memory — Approximately 94 kbits (94,208 bits) of embedded RAM for FIFOs, small buffers, and distributed memory requirements; family devices can include larger embedded block RAM options.
- User Flash & Reconfiguration — On-chip user flash memory (family devices support up to 256 kbits) enabling non-volatile configuration, background programming and in-field logic updates.
- High I/O Density — 206 user I/Os available in the 256-ball caBGA footprint to support rich peripheral and bus interfaces.
- Programmable I/O Standards — Family-level programmable sysIO buffer options support a wide range of interfaces including multiple CMOS/TTL standards and differential I/O types for flexible system integration.
- Clocking and PLLs — Family features include flexible on-chip clocking with multiple primary clocks and up to two analog PLLs for fractional-n frequency synthesis and clock conditioning.
- Low Power — MachXO2 family devices include ultra-low-power operation modes and standby options; the family cites micro-watt class standby capability.
- Package & Temperature — Supplied in a 256-LFBGA (256-CABGA, 14 × 14 mm) package rated for industrial operation from −40 °C to 100 °C.
- Single Supply Voltage — Operates from 1.14 V to 1.26 V, consistent with low-voltage system designs.
- System Integration — Family-level hardened peripherals include SPI, I2C and timer/counter functions, plus JTAG boundary-scan and other system-oriented features.
- RoHS Compliant — Meets RoHS environmental requirements.
Typical Applications
- Industrial Control — Deterministic glue logic, sensor interfacing and motor control supervisory functions, leveraging the industrial temperature rating and broad I/O count.
- Interface and Protocol Bridging — Implement protocol conversion, bus bridging and I/O aggregation using the device’s high I/O density and on-chip RAM for buffering.
- Display and Memory Interfaces — Support for source-synchronous I/O and dedicated DDR gearing features at the family level makes the device suitable for display timing and memory interface logic.
- System Management and Security — Use on-chip flash for secure, non-volatile configuration and in-field updates without external configuration memory.
Unique Advantages
- High Integration: Combines thousands of logic elements, embedded RAM and user flash on a single chip to reduce BOM and simplify board design.
- Extended Operating Range: Industrial temperature rating (−40 °C to 100 °C) supports deployments in demanding environments.
- Flexible I/O Options: 206 programmable I/Os and family-level support for multiple interface standards enable broad peripheral compatibility.
- Low-Voltage Operation: Narrow supply range (1.14 V to 1.26 V) for integration into low-voltage rails and power-constrained designs.
- Non-Volatile, Reconfigurable: On-chip user flash enables instant-on behavior and in-field reconfiguration to adapt to evolving system requirements.
- Package Density: 256-ball caBGA (14 × 14 mm) package delivers a compact footprint while maintaining high I/O count.
Why Choose LCMXO2-4000ZE-1BG256I?
The LCMXO2-4000ZE-1BG256I positions itself as a compact, industrial-grade FPGA option within the MachXO2 family, offering 4,320 logic elements, substantial on-chip RAM, and 206 I/Os in a 256-ball BGA package. Its low-voltage operation, embedded flash configuration and family-level features such as programmable I/O and PLLs make it well suited for industrial control, interface bridging and system management tasks.
This device is a practical choice for engineers seeking a single-chip solution that balances logic density, non-volatile configuration and robust I/O capability, while supporting in-field updates and reduced external component count.
Request a quote or submit your procurement inquiry to get pricing and availability for the LCMXO2-4000ZE-1BG256I.

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