LCMXO2-4000ZE-1BG256I

IC FPGA 206 I/O 256CABGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 206 94208 4320 256-LFBGA

Quantity 1,158 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LFBGANumber of I/O206Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs540Number of Logic Elements/Cells4320
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO2-4000ZE-1BG256I – MachXO2 FPGA, 4,320 Logic Elements, 206 I/Os

The LCMXO2-4000ZE-1BG256I is a MachXO2 family field-programmable gate array (FPGA) from Lattice Semiconductor, provided in a 256-ball BGA package. It combines a flexible logic architecture with on-chip memory and high I/O density to address control, glue-logic, and interface tasks in industrial systems.

Designed for low-power operation and instant-on capability, this part targets applications that require integrated flash-based configuration, a broad set of programmable I/O options, and reliable operation across an extended industrial temperature range.

Key Features

  • Core Logic — 4,320 logic elements that support flexible LUT-based implementations for glue logic, state machines, and control functions.
  • On-Chip Memory — Approximately 94 kbits (94,208 bits) of embedded RAM for FIFOs, small buffers, and distributed memory requirements; family devices can include larger embedded block RAM options.
  • User Flash & Reconfiguration — On-chip user flash memory (family devices support up to 256 kbits) enabling non-volatile configuration, background programming and in-field logic updates.
  • High I/O Density — 206 user I/Os available in the 256-ball caBGA footprint to support rich peripheral and bus interfaces.
  • Programmable I/O Standards — Family-level programmable sysIO buffer options support a wide range of interfaces including multiple CMOS/TTL standards and differential I/O types for flexible system integration.
  • Clocking and PLLs — Family features include flexible on-chip clocking with multiple primary clocks and up to two analog PLLs for fractional-n frequency synthesis and clock conditioning.
  • Low Power — MachXO2 family devices include ultra-low-power operation modes and standby options; the family cites micro-watt class standby capability.
  • Package & Temperature — Supplied in a 256-LFBGA (256-CABGA, 14 × 14 mm) package rated for industrial operation from −40 °C to 100 °C.
  • Single Supply Voltage — Operates from 1.14 V to 1.26 V, consistent with low-voltage system designs.
  • System Integration — Family-level hardened peripherals include SPI, I2C and timer/counter functions, plus JTAG boundary-scan and other system-oriented features.
  • RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

  • Industrial Control — Deterministic glue logic, sensor interfacing and motor control supervisory functions, leveraging the industrial temperature rating and broad I/O count.
  • Interface and Protocol Bridging — Implement protocol conversion, bus bridging and I/O aggregation using the device’s high I/O density and on-chip RAM for buffering.
  • Display and Memory Interfaces — Support for source-synchronous I/O and dedicated DDR gearing features at the family level makes the device suitable for display timing and memory interface logic.
  • System Management and Security — Use on-chip flash for secure, non-volatile configuration and in-field updates without external configuration memory.

Unique Advantages

  • High Integration: Combines thousands of logic elements, embedded RAM and user flash on a single chip to reduce BOM and simplify board design.
  • Extended Operating Range: Industrial temperature rating (−40 °C to 100 °C) supports deployments in demanding environments.
  • Flexible I/O Options: 206 programmable I/Os and family-level support for multiple interface standards enable broad peripheral compatibility.
  • Low-Voltage Operation: Narrow supply range (1.14 V to 1.26 V) for integration into low-voltage rails and power-constrained designs.
  • Non-Volatile, Reconfigurable: On-chip user flash enables instant-on behavior and in-field reconfiguration to adapt to evolving system requirements.
  • Package Density: 256-ball caBGA (14 × 14 mm) package delivers a compact footprint while maintaining high I/O count.

Why Choose LCMXO2-4000ZE-1BG256I?

The LCMXO2-4000ZE-1BG256I positions itself as a compact, industrial-grade FPGA option within the MachXO2 family, offering 4,320 logic elements, substantial on-chip RAM, and 206 I/Os in a 256-ball BGA package. Its low-voltage operation, embedded flash configuration and family-level features such as programmable I/O and PLLs make it well suited for industrial control, interface bridging and system management tasks.

This device is a practical choice for engineers seeking a single-chip solution that balances logic density, non-volatile configuration and robust I/O capability, while supporting in-field updates and reduced external component count.

Request a quote or submit your procurement inquiry to get pricing and availability for the LCMXO2-4000ZE-1BG256I.

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