LCMXO2-4000HE-6MG184I

The LCMXO2-4000HE-6MG184I is a MachXO2 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor designed for industrial applications. It delivers a flexible logic architecture with 4,320 logic elements, approximately 94 kbits of on‑chip RAM (94,208 bits) and 150 I/Os, enabling interface bridging, control and glue‑logic functions in space‑constrained systems.

Built for low power operation and non‑volatile, reconfigurable designs, this surface‑mount, RoHS‑compliant device supports single‑supply operation at 1.14 V to 1.26 V and an industrial operating temperature range of −40 °C to 100 °C.

Key Features

• Core Logic 4,320 logic elements provide ample programmable fabric for glue logic, protocol adaptation and custom control functions.
• Embedded Memory Approximately 94 kbits of on‑chip RAM (94,208 bits) for distributed storage, FIFOs and small buffers.
• I/O Flexibility 150 I/Os with programmable sysIO™ buffer support for a wide range of standards including multiple LVCMOS voltage levels and differential interfaces, enabling diverse front‑end connections.
• Non‑Volatile Configuration On‑chip user flash and single‑chip instant‑on capability provide secure, infinitely reconfigurable logic that powers up quickly and supports background programming and in‑field updates.
• Low Power Advanced low‑power process and standby options reduce idle power consumption (family‑level standby down to 22 μW as documented in the MachXO2 family data).
• Clocking and PLLs Multiple primary clocks and up to two analog PLLs with wide input frequency support (family documentation cites 7 MHz to 400 MHz) for flexible timing and clock generation.
• Packages & Mounting 184‑LFBGA (CSPBGA) package; supplier device package listed as 184‑CSBGA (8×8). Surface‑mount mounting type for compact PCB footprints.
• Industrial Grade & Environmental Rated for operation from −40 °C to 100 °C and RoHS‑compliant to meet industrial deployment requirements.
• System Integration Hardened peripherals at the family level include SPI, I2C and timers/counters; programming and configuration supported via JTAG, SPI and I2C interfaces.

Typical Applications

• Interface Bridging and Protocol Conversion Use the device’s flexible I/O standards and programmable fabric to implement protocol translation and signal conditioning between subsystems.
• Display and Video I/O Pre‑engineered source synchronous I/O and DDR register support in I/O cells make it suitable for display interface buffering and timing gear applications.
• System Control and Glue Logic The combination of logic elements, embedded RAM and on‑chip peripherals supports board‑level control, reset/state management and peripheral aggregation.
• Field‑Updatable Embedded Functions Non‑volatile, reconfigurable flash memory and in‑field reconfiguration enable remote updates to logic and system behavior without hardware changes.

Unique Advantages

• Compact, Surface‑Mount Package: 184‑LFBGA (CSPBGA) footprint provides a high I/O count in a small board area for space‑constrained designs.
• Industrial Temperature Range: −40 °C to 100 °C rating supports robust operation in industrial environments.
• Non‑Volatile Instant‑On Configuration: On‑chip user flash enables secure configuration that powers up quickly and supports background programming.
• Broad I/O Support: Programmable sysIO buffers accommodate multiple single‑ended and differential I/O standards to minimize external level‑shifting components.
• Low Standby Power Options: Advanced low‑power process and standby modes reduce system idle power draw, suitable for energy‑sensitive applications.
• Flexible Clocking and PLLs: Multiple clocks and analog PLL support enable a wide range of timing architectures and high‑speed I/O use cases.

Why Choose LCMXO2-4000HE-6MG184I?

The LCMXO2-4000HE-6MG184I positions itself as a versatile, industrial‑grade FPGA option for designs that require a balance of programmable logic, embedded memory and a high I/O count in a compact package. Its non‑volatile configuration, flexible I/O standards and clocking capabilities make it well suited for interface bridging, system control and field‑updateable embedded functions.

For engineers targeting reliable, reconfigurable solutions with constrained board area and industrial temperature needs, this MachXO2 device offers a practical combination of integration, low‑power options and configuration flexibility aligned with long‑term product updates and in‑field reconfiguration strategies.

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