LCMXO2-4000HE-6FTG256I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 206 94208 4320 256-LBGA |
|---|---|
| Quantity | 1,097 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 206 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 540 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO2-4000HE-6FTG256I – MachXO2 Field Programmable Gate Array (FPGA) IC 206 94208 4320 256-LBGA
The LCMXO2-4000HE-6FTG256I is a MachXO2 family FPGA from Lattice Semiconductor offering mid-density programmable logic with 4,320 logic elements, approximately 94,208 bits of on-chip RAM and 206 I/O pins in a 256-ball BGA package. Designed for industrial and embedded systems, it combines flexible logic, extensive I/O options and non-volatile configuration for system glue logic, interface bridging and in-field updates.
With an industrial operating range of −40 °C to 100 °C and a single low-voltage supply range of 1.14 V to 1.26 V, this device targets applications that require compact, reconfigurable logic with broad I/O support and low standby power.
Key Features
- Core Logic Approximately 4,320 logic elements to implement glue logic, protocol conversion and mid-density data-path functions.
- On-Chip Memory Approximately 94,208 bits of embedded and distributed RAM for FIFOs, small buffers and state storage.
- On-Chip User Flash & Reconfiguration MachXO2 family supports non-volatile user flash memory and TransFR reconfiguration for in-field updates; programmable through JTAG, SPI and I²C interfaces.
- Flexible I/O 206 I/Os with programmable sysIO buffer support for a wide range of standards including multiple CMOS and differential interfaces as described in the MachXO2 family data.
- Clocking and PLLs Multiple primary clocks and up to two analog PLLs per device (family feature) to support flexible clocking and fractional‑N frequency synthesis.
- Low Power Options MachXO2 family devices include ultra low power modes and standby options; family data cites very low standby power states.
- Package & Mounting 256-ball FTBGA footprint (17 × 17 mm supplier package), surface-mount mounting for compact board integration.
- Industrial Temperature Rating Rated for −40 °C to 100 °C operating temperature, suitable for industrial embedded deployments.
- Standards & System Support On-chip functions in the MachXO2 family include SPI, I²C, timer/counter, boundary scan (IEEE 1149.1) and background programming support.
- RoHS Compliant Device meets RoHS environmental compliance requirements.
Typical Applications
- Industrial Control Use the FPGA for I/O aggregation, protocol bridging and deterministic control logic within industrial automation systems operating across −40 °C to 100 °C.
- Interface & Glue Logic Implement protocol adaptation, bus bridging and system glue where dense I/O and reconfigurable logic are required.
- Memory & Display Interfaces Leverage on-chip RAM and family-level DDR/gear logic features for buffering, display gearing and source-synchronous I/O tasks.
- Field Upgradeable Systems Take advantage of non-volatile configuration and in-field TransFR updates to deliver firmware/logic upgrades without board changes.
Unique Advantages
- High I/O Density in a Compact BGA 206 I/Os in a 256-ball ftBGA (17 × 17 mm) package reduces PCB real estate while supporting extensive peripheral connectivity.
- Integrated Non-Volatile Configuration On-chip user flash and background programming enable instant-on behavior and secure single-chip configuration without external PROMs.
- Mid-Density Logic with On-Chip RAM Approximately 4,320 logic elements and ~94 kbits of RAM provide a balanced mix of logic and memory for common embedded tasks.
- Designed for Low-Power Operation Family features include ultra low-power standby modes to help minimize system idle power.
- Industrial Temperature Range Rated −40 °C to 100 °C, supporting deployment in demanding environments.
- Comprehensive System Functions Built-in timers, SPI, I²C, PLLs and boundary-scan capabilities simplify system-level design and test integration.
Why Choose LCMXO2-4000HE-6FTG256I?
The LCMXO2-4000HE-6FTG256I delivers a mid-density programmable solution that combines roughly 4,320 logic elements, substantial on-chip RAM and 206 I/Os in a compact 256-ball BGA package with industrial temperature rating. It is well suited for designs that need flexible I/O standards, on-chip non-volatile configuration and the ability to perform in-field logic updates.
For teams building embedded or industrial systems that require reconfigurable logic, I/O programmability and low standby power within a single-chip solution, this MachXO2-family device offers a balanced platform with features targeted at system integration and lifecycle flexibility.
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