LCMXO2-4000HE-6FTG256I

IC FPGA 206 I/O 256FTBGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 206 94208 4320 256-LBGA

Quantity 1,097 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O206Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs540Number of Logic Elements/Cells4320
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO2-4000HE-6FTG256I – MachXO2 Field Programmable Gate Array (FPGA) IC 206 94208 4320 256-LBGA

The LCMXO2-4000HE-6FTG256I is a MachXO2 family FPGA from Lattice Semiconductor offering mid-density programmable logic with 4,320 logic elements, approximately 94,208 bits of on-chip RAM and 206 I/O pins in a 256-ball BGA package. Designed for industrial and embedded systems, it combines flexible logic, extensive I/O options and non-volatile configuration for system glue logic, interface bridging and in-field updates.

With an industrial operating range of −40 °C to 100 °C and a single low-voltage supply range of 1.14 V to 1.26 V, this device targets applications that require compact, reconfigurable logic with broad I/O support and low standby power.

Key Features

  • Core Logic  Approximately 4,320 logic elements to implement glue logic, protocol conversion and mid-density data-path functions.
  • On-Chip Memory  Approximately 94,208 bits of embedded and distributed RAM for FIFOs, small buffers and state storage.
  • On-Chip User Flash & Reconfiguration  MachXO2 family supports non-volatile user flash memory and TransFR reconfiguration for in-field updates; programmable through JTAG, SPI and I²C interfaces.
  • Flexible I/O  206 I/Os with programmable sysIO buffer support for a wide range of standards including multiple CMOS and differential interfaces as described in the MachXO2 family data.
  • Clocking and PLLs  Multiple primary clocks and up to two analog PLLs per device (family feature) to support flexible clocking and fractional‑N frequency synthesis.
  • Low Power Options  MachXO2 family devices include ultra low power modes and standby options; family data cites very low standby power states.
  • Package & Mounting  256-ball FTBGA footprint (17 × 17 mm supplier package), surface-mount mounting for compact board integration.
  • Industrial Temperature Rating  Rated for −40 °C to 100 °C operating temperature, suitable for industrial embedded deployments.
  • Standards & System Support  On-chip functions in the MachXO2 family include SPI, I²C, timer/counter, boundary scan (IEEE 1149.1) and background programming support.
  • RoHS Compliant  Device meets RoHS environmental compliance requirements.

Typical Applications

  • Industrial Control  Use the FPGA for I/O aggregation, protocol bridging and deterministic control logic within industrial automation systems operating across −40 °C to 100 °C.
  • Interface & Glue Logic  Implement protocol adaptation, bus bridging and system glue where dense I/O and reconfigurable logic are required.
  • Memory & Display Interfaces  Leverage on-chip RAM and family-level DDR/gear logic features for buffering, display gearing and source-synchronous I/O tasks.
  • Field Upgradeable Systems  Take advantage of non-volatile configuration and in-field TransFR updates to deliver firmware/logic upgrades without board changes.

Unique Advantages

  • High I/O Density in a Compact BGA  206 I/Os in a 256-ball ftBGA (17 × 17 mm) package reduces PCB real estate while supporting extensive peripheral connectivity.
  • Integrated Non-Volatile Configuration  On-chip user flash and background programming enable instant-on behavior and secure single-chip configuration without external PROMs.
  • Mid-Density Logic with On-Chip RAM  Approximately 4,320 logic elements and ~94 kbits of RAM provide a balanced mix of logic and memory for common embedded tasks.
  • Designed for Low-Power Operation  Family features include ultra low-power standby modes to help minimize system idle power.
  • Industrial Temperature Range  Rated −40 °C to 100 °C, supporting deployment in demanding environments.
  • Comprehensive System Functions  Built-in timers, SPI, I²C, PLLs and boundary-scan capabilities simplify system-level design and test integration.

Why Choose LCMXO2-4000HE-6FTG256I?

The LCMXO2-4000HE-6FTG256I delivers a mid-density programmable solution that combines roughly 4,320 logic elements, substantial on-chip RAM and 206 I/Os in a compact 256-ball BGA package with industrial temperature rating. It is well suited for designs that need flexible I/O standards, on-chip non-volatile configuration and the ability to perform in-field logic updates.

For teams building embedded or industrial systems that require reconfigurable logic, I/O programmability and low standby power within a single-chip solution, this MachXO2-family device offers a balanced platform with features targeted at system integration and lifecycle flexibility.

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