LCMXO2-4000HE-6FG484I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 278 94208 4320 484-BBGA |
|---|---|
| Quantity | 1,656 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 278 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 540 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO2-4000HE-6FG484I – MachXO2 FPGA, 4,320 logic elements, ~94,208 bits RAM, 278 I/Os, 484-BBGA
The LCMXO2-4000HE-6FG484I is a MachXO2 family field-programmable gate array (FPGA) optimized for industrial applications. It integrates approximately 4,320 logic elements, about 94,208 bits of on-chip RAM and 278 I/Os in a 484-ball BGA surface-mount package, providing dense logic and I/O capability in a compact footprint.
Designed for systems that require flexible logic, rich on-chip memory and a high I/O count, this device is suited to industrial control, interface bridging and system orchestration where low standby power, non-volatile configuration and extended temperature operation are required.
Key Features
- Core Logic Approximately 4,320 logic elements provide programmable combinational and sequential resources for glue logic, protocol adaptation and control functions.
- On-chip Memory Approximately 94,208 bits of on-chip RAM deliver embedded storage for FIFOs, small buffers and state machines. The MachXO2 family also includes embedded and distributed memory options at the series level.
- High I/O Count & Flexible Interfaces 278 I/Os support a wide range of system connections. Family-level I/O buffer support includes LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL, PCI, LVDS and other differential and single-ended standards for versatile interfacing.
- Non-volatile Configuration MachXO2 family devices provide on-chip user flash memory and single-chip, secure instant-on configuration with background programming and multiple programming interfaces (JTAG, SPI, I²C).
- Low Power Operation Family-level low-power features include an advanced low-power process and extremely low standby currents (standby modes down to tens of microwatts at the series level), helping reduce system power draw.
- Clocking and PLLs Flexible on-chip clocking with multiple primary clocks and up to two analog PLLs per device for fractional-n frequency synthesis and wide input clock range (as described for the family).
- Reconfiguration and System Functions Supports TransFR™ in-field reconfiguration, on-chip hardened peripherals (SPI, I²C, timer/counter), an on-chip oscillator and IEEE-1149.1 boundary scan for system-level flexibility and diagnostics.
- Package, Supply and Temperature 484-ball FBGA package (23 mm × 23 mm) in a surface-mount configuration; single-supply operating range of 1.14 V to 1.26 V and rated for industrial temperature operation from -40°C to 100°C. RoHS compliant.
Typical Applications
- Industrial Control Implement supervisory logic, I/O aggregation and protocol conversion in industrial systems that require operation across -40°C to 100°C and an industrial-grade component.
- Interface Bridging Bridge disparate interfaces and perform signal adaptation using the high I/O count and the family’s broad I/O standard support for mixed single-ended and differential signaling.
- Memory and Display Interfaces Use the device for source-synchronous and DDR-style interfaces and display gearing functions described at the MachXO2 family level for timing-critical front-end tasks.
- System Management and Security Leverage on-chip user flash, instant-on configuration and background programming to implement secure, non-volatile control and field-updatable logic.
Unique Advantages
- High I/O Density: 278 I/Os enable extensive external connectivity without additional I/O expanders, simplifying board design.
- Compact, Surface-Mount BGA: 484-ball FBGA (23 × 23 mm) package delivers high integration in a compact, surface-mount form factor.
- Non-volatile Instant-on: On-chip user flash and single-chip configuration deliver instant-on capability and background programming options for field updates.
- Industrial Temperature Range: Rated for -40°C to 100°C, supporting deployment in temperature-challenging environments.
- Flexible Clocking and Reconfiguration: Multiple clocks, PLLs and TransFR™ reconfiguration enable complex timing architectures and in-field logic updates.
- Low Standby Power: Family-level low-power design and standby modes reduce system-level energy consumption for always-on applications.
Why Choose LCMXO2-4000HE-6FG484I?
The LCMXO2-4000HE-6FG484I positions itself as a highly integrated, industrial-grade FPGA option for designs that need a balance of programmable logic, substantial I/O and embedded memory in a compact BGA package. Its combination of approximately 4,320 logic elements, ~94,208 bits of on-chip RAM and 278 I/Os supports complex interface and control tasks while enabling non-volatile instant-on operation and in-field updates.
This device is suitable for engineers and system designers building industrial control, interface bridging, display or system management solutions that require durable operation across a wide temperature range, a high degree of I/O flexibility and the ability to update logic in the field.
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