LCMXO2-4000HE-6FG484I

IC FPGA 278 I/O 484FBGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 278 94208 4320 484-BBGA

Quantity 1,656 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O278Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs540Number of Logic Elements/Cells4320
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO2-4000HE-6FG484I – MachXO2 FPGA, 4,320 logic elements, ~94,208 bits RAM, 278 I/Os, 484-BBGA

The LCMXO2-4000HE-6FG484I is a MachXO2 family field-programmable gate array (FPGA) optimized for industrial applications. It integrates approximately 4,320 logic elements, about 94,208 bits of on-chip RAM and 278 I/Os in a 484-ball BGA surface-mount package, providing dense logic and I/O capability in a compact footprint.

Designed for systems that require flexible logic, rich on-chip memory and a high I/O count, this device is suited to industrial control, interface bridging and system orchestration where low standby power, non-volatile configuration and extended temperature operation are required.

Key Features

  • Core Logic  Approximately 4,320 logic elements provide programmable combinational and sequential resources for glue logic, protocol adaptation and control functions.
  • On-chip Memory  Approximately 94,208 bits of on-chip RAM deliver embedded storage for FIFOs, small buffers and state machines. The MachXO2 family also includes embedded and distributed memory options at the series level.
  • High I/O Count & Flexible Interfaces  278 I/Os support a wide range of system connections. Family-level I/O buffer support includes LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL, PCI, LVDS and other differential and single-ended standards for versatile interfacing.
  • Non-volatile Configuration  MachXO2 family devices provide on-chip user flash memory and single-chip, secure instant-on configuration with background programming and multiple programming interfaces (JTAG, SPI, I²C).
  • Low Power Operation  Family-level low-power features include an advanced low-power process and extremely low standby currents (standby modes down to tens of microwatts at the series level), helping reduce system power draw.
  • Clocking and PLLs  Flexible on-chip clocking with multiple primary clocks and up to two analog PLLs per device for fractional-n frequency synthesis and wide input clock range (as described for the family).
  • Reconfiguration and System Functions  Supports TransFR™ in-field reconfiguration, on-chip hardened peripherals (SPI, I²C, timer/counter), an on-chip oscillator and IEEE-1149.1 boundary scan for system-level flexibility and diagnostics.
  • Package, Supply and Temperature  484-ball FBGA package (23 mm × 23 mm) in a surface-mount configuration; single-supply operating range of 1.14 V to 1.26 V and rated for industrial temperature operation from -40°C to 100°C. RoHS compliant.

Typical Applications

  • Industrial Control  Implement supervisory logic, I/O aggregation and protocol conversion in industrial systems that require operation across -40°C to 100°C and an industrial-grade component.
  • Interface Bridging  Bridge disparate interfaces and perform signal adaptation using the high I/O count and the family’s broad I/O standard support for mixed single-ended and differential signaling.
  • Memory and Display Interfaces  Use the device for source-synchronous and DDR-style interfaces and display gearing functions described at the MachXO2 family level for timing-critical front-end tasks.
  • System Management and Security  Leverage on-chip user flash, instant-on configuration and background programming to implement secure, non-volatile control and field-updatable logic.

Unique Advantages

  • High I/O Density: 278 I/Os enable extensive external connectivity without additional I/O expanders, simplifying board design.
  • Compact, Surface-Mount BGA: 484-ball FBGA (23 × 23 mm) package delivers high integration in a compact, surface-mount form factor.
  • Non-volatile Instant-on: On-chip user flash and single-chip configuration deliver instant-on capability and background programming options for field updates.
  • Industrial Temperature Range: Rated for -40°C to 100°C, supporting deployment in temperature-challenging environments.
  • Flexible Clocking and Reconfiguration: Multiple clocks, PLLs and TransFR™ reconfiguration enable complex timing architectures and in-field logic updates.
  • Low Standby Power: Family-level low-power design and standby modes reduce system-level energy consumption for always-on applications.

Why Choose LCMXO2-4000HE-6FG484I?

The LCMXO2-4000HE-6FG484I positions itself as a highly integrated, industrial-grade FPGA option for designs that need a balance of programmable logic, substantial I/O and embedded memory in a compact BGA package. Its combination of approximately 4,320 logic elements, ~94,208 bits of on-chip RAM and 278 I/Os supports complex interface and control tasks while enabling non-volatile instant-on operation and in-field updates.

This device is suitable for engineers and system designers building industrial control, interface bridging, display or system management solutions that require durable operation across a wide temperature range, a high degree of I/O flexibility and the ability to update logic in the field.

Request a quote or submit a purchase inquiry for the LCMXO2-4000HE-6FG484I to get pricing and availability information tailored to your project needs.

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