LCMXO2-4000HE-6BG332C

The LCMXO2-4000HE-6BG332C is a MachXO2 family FPGA from Lattice Semiconductor Corporation delivering a balanced mix of reconfigurable logic, on-chip memory, and high I/O density in a compact 332-ball CA/FBGA package. This surface-mount, commercial-grade device targets applications that require instant-on non-volatile logic, extensive I/O connectivity and low-voltage operation.

With 4,320 logic elements, approximately 94,208 bits of embedded RAM and 274 I/O pins, the device is suited to system glue logic, interface bridging and control functions where integration, low standby power and flexible I/O are important design drivers.

Key Features

• Logic Capacity: Provides 4,320 logic elements to implement combinational and sequential logic for glue logic, protocol bridging and control tasks.
• Embedded Memory: Approximately 94,208 bits of on-chip RAM for FIFOs, small buffers and state storage.
• High I/O Density: 274 user I/Os exposed in the 332-ball package to support wide parallel interfaces and multiple peripheral connections.
• Package & Mounting: 332-ball CA/FBGA (332-CABGA, 17 × 17 mm) surface-mount package for compact board integration.
• Voltage & Temperature: Single-supply low-voltage operation from 1.14 V to 1.26 V and commercial operating temperature range of 0 °C to 85 °C.
• Non-volatile, In-field Reconfiguration: MachXO2 family features include on-chip user flash and TransFR reconfiguration for in-field logic updates and instant-on behavior.
• On-chip Peripherals (family capabilities): Hardened SPI, I²C and timer/counter functions, programmable oscillator and background programming support for flexible system integration.
• Low Power Architecture (family capabilities): Built on a low-power process with standby and power-saving options suitable for designs that prioritize energy efficiency.
• Clocking & PLLs (family capabilities): Multiple primary clocks and up to two analog PLLs in the family enabling a range of clocking and frequency synthesis options.
• Compliance: RoHS compliant.

Typical Applications

• Consumer Electronics: Instant-on reconfigurable logic and high I/O count for display interfaces, peripheral control and user interface management.
• Interface Bridging: Protocol translation and board-level glue logic where many I/Os and embedded RAM are used to buffer and route signals between subsystems.
• Communication Peripherals: Local control functions and data buffering leveraging the device’s on-chip memory and programmable I/Os.
• Embedded Control: System control, sequencing and small state machines using the device’s logic elements, timers and on-chip non-volatile configuration.

Unique Advantages

• High I/O Count: 274 I/Os support complex multi-channel interfaces without external multiplexing, simplifying board design.
• Compact, High-Density Package: 332-ball CA/FBGA (17 × 17 mm) saves PCB space while delivering significant I/O and logic capacity.
• Low-Voltage Operation: Operates from 1.14 V to 1.26 V to match modern low-voltage power domains and help reduce system power draw.
• On-chip Memory and Logic: 4,320 logic elements combined with ~94 kbits of embedded RAM allow local buffering and processing without added external memory.
• Reconfigurable Non-volatile Logic: Family features include on-chip user flash and in-field reconfiguration to enable firmware updates and flexible feature upgrades.
• Commercial Temperature Range: Rated for 0 °C to 85 °C for standard commercial applications.

Why Choose LCMXO2-4000HE-6BG332C?

The LCMXO2-4000HE-6BG332C positions itself as a compact, highly connected FPGA option for designs that need significant I/O, moderate logic capacity and embedded RAM in a single surface-mount package. Its low-voltage operation, non-volatile configuration and family-provided peripherals make it a practical choice for system-level integration tasks, control functions and interface-heavy applications.

Designed for commercial applications, this MachXO2 device offers scalability within the family and access to on-chip programming and system support features that simplify board-level design and field updates, helping reduce BOM complexity and support long-term product maintenance.

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