LCMXO2-4000HE-6FG484C
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 278 94208 4320 484-BBGA |
|---|---|
| Quantity | 1,065 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 278 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 540 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO2-4000HE-6FG484C – MachXO2 Field Programmable Gate Array (FPGA) IC, 484‑BBGA
The LCMXO2-4000HE-6FG484C is a MachXO2 family field programmable gate array (FPGA) offered in a 484‑ball BGA package. It delivers a mid-density, non-volatile programmable fabric with a high I/O count and on-chip memory, suitable for control, interface and glue-logic roles in commercial electronic systems.
Designed for low-power operation and fast, single-chip configuration, this device targets applications that require flexible I/O, embedded memory and in-field reconfiguration while operating from a 1.14 V to 1.26 V supply and a commercial temperature range.
Key Features
- Logic Capacity Approximately 4,320 logic elements for implementing glue logic, state machines and custom finite-state control.
- Embedded RAM Approximately 94,208 bits of on-chip RAM to support FIFOs, small buffers and distributed memory functions.
- High I/O Count 278 I/Os to support wide bus interfaces and multiple peripheral connections in a single device.
- Non-volatile, Instant-on On-chip user Flash memory and instant-on capability for single-chip boot and background programming options (family-level feature).
- Low Power Family-level low-power architecture with standby modes; datasheet cites standby power as low as 22 μW (family-level).
- Flexible I/O Standards Programmable I/O buffer support across a range of standards including LVCMOS and differential signaling options (family-level).
- Clocking and PLLs Up to eight primary clocks with up to two analog PLLs per device offering fractional‑n frequency synthesis (family-level).
- Package & Mounting 484‑BBGA package; supplier device package listed as 484‑FBGA (23 mm × 23 mm). Surface-mount mounting type.
- Voltage & Temperature Specified supply range of 1.14 V to 1.26 V and commercial operating temperature from 0 °C to 85 °C.
- Regulatory RoHS compliant.
Typical Applications
- Peripheral and Interface Bridging Use the device's high I/O count and flexible I/O buffer support to translate and aggregate multiple serial and parallel interfaces.
- Display and Video I/O Family features such as gearing for display I/Os and programmable DDR registers enable display timing and source-synchronous interface support.
- Memory Interface Support Built-in DDR registers and dedicated gearing logic (family-level) can be used to implement memory buffering and custom memory interfaces.
- In-field Logic Updates On-chip user Flash and TransFR reconfiguration support allow logic updates and dual-boot strategies without removing the device from the system.
Unique Advantages
- High integration with abundant I/O: 278 I/Os combined with 4,320 logic elements reduce external glue logic and simplify board-level design.
- Embedded memory resources: Approximately 94,208 bits of on-chip RAM support FIFOs, buffers and small data stores without external SRAM.
- Compact BGA package: 484‑BBGA (supplier: 484‑FBGA, 23 mm × 23 mm) provides a dense footprint for space-constrained boards while supporting large I/O counts.
- Low-voltage operation: Narrow supply range (1.14 V–1.26 V) suitable for systems using low-voltage core domains.
- Non-volatile instant-on capability: On-chip user Flash enables secure, single-chip configuration and background programming for firmware flexibility (family-level).
- Commercial-grade reliability: Specified for 0 °C to 85 °C operation and RoHS compliance for mainstream commercial deployments.
Why Choose LCMXO2-4000HE-6FG484C?
The LCMXO2-4000HE-6FG484C positions itself as a flexible, mid-density FPGA solution that balances logic capacity, extensive I/O and embedded memory in a single, non-volatile device. Its package and interface capabilities make it well suited for designers implementing interface bridging, display I/O, and in-field programmable control functions in commercial electronic products.
Engineers looking for a compact, low-power programmable fabric with on-chip Flash, substantial on-chip RAM and a high I/O count can use this device to reduce BOM complexity and enable in-field updates while operating within standard commercial temperature and voltage envelopes.
Request a quote or submit an inquiry to get pricing and availability for the LCMXO2-4000HE-6FG484C. Technical sales and product specialists can provide lead-time and volume pricing information.