LCMXO2-4000HE-6FG484C

IC FPGA 278 I/O 484FBGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 278 94208 4320 484-BBGA

Quantity 1,065 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O278Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs540Number of Logic Elements/Cells4320
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO2-4000HE-6FG484C – MachXO2 Field Programmable Gate Array (FPGA) IC, 484‑BBGA

The LCMXO2-4000HE-6FG484C is a MachXO2 family field programmable gate array (FPGA) offered in a 484‑ball BGA package. It delivers a mid-density, non-volatile programmable fabric with a high I/O count and on-chip memory, suitable for control, interface and glue-logic roles in commercial electronic systems.

Designed for low-power operation and fast, single-chip configuration, this device targets applications that require flexible I/O, embedded memory and in-field reconfiguration while operating from a 1.14 V to 1.26 V supply and a commercial temperature range.

Key Features

  • Logic Capacity  Approximately 4,320 logic elements for implementing glue logic, state machines and custom finite-state control.
  • Embedded RAM  Approximately 94,208 bits of on-chip RAM to support FIFOs, small buffers and distributed memory functions.
  • High I/O Count  278 I/Os to support wide bus interfaces and multiple peripheral connections in a single device.
  • Non-volatile, Instant-on  On-chip user Flash memory and instant-on capability for single-chip boot and background programming options (family-level feature).
  • Low Power  Family-level low-power architecture with standby modes; datasheet cites standby power as low as 22 μW (family-level).
  • Flexible I/O Standards  Programmable I/O buffer support across a range of standards including LVCMOS and differential signaling options (family-level).
  • Clocking and PLLs  Up to eight primary clocks with up to two analog PLLs per device offering fractional‑n frequency synthesis (family-level).
  • Package & Mounting  484‑BBGA package; supplier device package listed as 484‑FBGA (23 mm × 23 mm). Surface-mount mounting type.
  • Voltage & Temperature  Specified supply range of 1.14 V to 1.26 V and commercial operating temperature from 0 °C to 85 °C.
  • Regulatory  RoHS compliant.

Typical Applications

  • Peripheral and Interface Bridging  Use the device's high I/O count and flexible I/O buffer support to translate and aggregate multiple serial and parallel interfaces.
  • Display and Video I/O  Family features such as gearing for display I/Os and programmable DDR registers enable display timing and source-synchronous interface support.
  • Memory Interface Support  Built-in DDR registers and dedicated gearing logic (family-level) can be used to implement memory buffering and custom memory interfaces.
  • In-field Logic Updates  On-chip user Flash and TransFR reconfiguration support allow logic updates and dual-boot strategies without removing the device from the system.

Unique Advantages

  • High integration with abundant I/O:  278 I/Os combined with 4,320 logic elements reduce external glue logic and simplify board-level design.
  • Embedded memory resources:  Approximately 94,208 bits of on-chip RAM support FIFOs, buffers and small data stores without external SRAM.
  • Compact BGA package:  484‑BBGA (supplier: 484‑FBGA, 23 mm × 23 mm) provides a dense footprint for space-constrained boards while supporting large I/O counts.
  • Low-voltage operation:  Narrow supply range (1.14 V–1.26 V) suitable for systems using low-voltage core domains.
  • Non-volatile instant-on capability:  On-chip user Flash enables secure, single-chip configuration and background programming for firmware flexibility (family-level).
  • Commercial-grade reliability:  Specified for 0 °C to 85 °C operation and RoHS compliance for mainstream commercial deployments.

Why Choose LCMXO2-4000HE-6FG484C?

The LCMXO2-4000HE-6FG484C positions itself as a flexible, mid-density FPGA solution that balances logic capacity, extensive I/O and embedded memory in a single, non-volatile device. Its package and interface capabilities make it well suited for designers implementing interface bridging, display I/O, and in-field programmable control functions in commercial electronic products.

Engineers looking for a compact, low-power programmable fabric with on-chip Flash, substantial on-chip RAM and a high I/O count can use this device to reduce BOM complexity and enable in-field updates while operating within standard commercial temperature and voltage envelopes.

Request a quote or submit an inquiry to get pricing and availability for the LCMXO2-4000HE-6FG484C. Technical sales and product specialists can provide lead-time and volume pricing information.

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