LCMXO2-4000ZE-1BG332C

The LCMXO2-4000ZE-1BG332C is a MachXO2 family field programmable gate array from Lattice Semiconductor Corporation. It delivers a flexible low-power logic fabric with abundant I/O and on-chip memory resources suitable for I/O‑intensive system tasks and embedded control functions.

Key attributes include 4,320 logic elements, 274 I/Os, and a compact 332-ball BGA package, combined with family-level features such as non-volatile user flash, programmable I/O standards and on-chip system support to simplify system integration.

Key Features

• Logic Capacity — 4,320 logic elements to implement glue logic, protocol bridging and control functions.
• On-chip Memory — 94,208 total RAM bits for distributed and block RAM usage; MachXO2 family also supports on-chip user Flash memory for configuration and non-volatile storage.
• High I/O Count — 274 I/Os for broad interface connectivity in compact designs.
• Flexible I/O Standards — Family supports a wide range of programmable I/O standards and programmable differential/hot‑socketing options to match many interface requirements.
• Power and Supply — Low-power family architecture with standby modes; device supply range specified as 1.14 V to 1.26 V for core operation.
• Clocking and PLLs — Flexible on-chip clocking with analog PLL support for frequency synthesis and high-speed I/O timing.
• Embedded System Support — Hardened on-chip functions in the family include SPI, I²C and timer/counter peripherals plus an on-chip oscillator to aid system design.
• Package and Mounting — Surface-mount 332‑FBGA package (supplier package: 332‑caBGA, 17×17 mm) for dense board integration.
• Operating Range and Grade — Commercial grade with operating temperature 0 °C to 85 °C; RoHS compliant.

Typical Applications

• Interface Bridging and Protocol Conversion — High I/O count and flexible I/O standards enable implementation of interface translators and glue logic between disparate subsystems.
• System Control and Supervision — On-chip flash and embedded peripherals (SPI, I²C, timers) support configuration, system management and supervisory functions.
• Display and Memory Interfaces — Pre‑engineered source-synchronous I/O and DDR gearing in the family facilitate drive and timing control for display and external memory interfaces.
• Low-Power Embedded Designs — Low standby power modes and configurable power options make the device suitable for energy-conscious embedded applications.

Unique Advantages

• High integration in a compact package: 4,320 logic elements and 274 I/Os in a 332‑ball BGA reduce external glue logic and simplify PCB routing.
• Non-volatile, instant-on capability: Family-level on-chip user Flash enables single-chip, secure configuration and in-field updates without external configuration devices.
• Broad I/O flexibility: Programmable I/O standards and on-chip differential termination support a wide array of interfaces, minimizing external components.
• Embedded system peripherals: Built-in SPI, I²C and timer/counter functionality reduce the need for discrete peripherals and lower BOM count.
• Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C operation and compliant with RoHS for standard commercial product deployments.

Why Choose LCMXO2-4000ZE-1BG332C?

This MachXO2 device combines a mid-range logic capacity with one of the family’s highest I/O counts, making it well suited for designs that require extensive external connectivity alongside non-volatile configuration and embedded system support. The device’s low-power family architecture, programmable I/O and on-chip peripherals help simplify board design and reduce overall system BOM.

Engineers designing compact, I/O‑heavy embedded systems or control logic will find this part useful for scalable designs that leverage the MachXO2 family’s configuration, clocking and power management capabilities backed by Lattice Semiconductor Corporation documentation and ecosystem support.

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