LCMXO2-4000ZE-1FTG256C

The LCMXO2-4000ZE-1FTG256C is a MachXO2 family field-programmable gate array (FPGA) in a 256-ball fine-pitch BGA package. It provides 4,320 logic elements, 206 programmable I/Os, and on-chip memory resources suitable for mid-density integration tasks in commercial embedded systems.

Designed for flexible logic integration, this device targets system control, interface bridging and I/O-rich applications that require low-voltage operation (1.14 V to 1.26 V), surface-mount packaging, and commercial temperature range operation (0 °C to 85 °C).

Key Features

• Core Logic – 4,320 logic elements for implementing mid-density FPGA designs and glue-logic functions.
• Memory – Total on-chip RAM of 94,208 bits (approximately 92 kbits) for distributed and embedded memory needs in data buffering and state storage.
• I/O Density – 206 programmable I/Os, supporting a wide range of interface and connectivity options for peripherals and external devices.
• Power – Single-supply low-voltage operation with VCC range of 1.14 V to 1.26 V to match modern system rails.
• Package & Mounting – 256-ball fine-pitch BGA (256-FTBGA, 17 mm × 17 mm) in a surface-mount form factor for compact board-level integration.
• Operating Range & Grade – Commercial grade device rated for 0 °C to 85 °C operation and RoHS compliant.
• Family Capabilities – As a MachXO2 device, the family offers features such as on-chip non-volatile user Flash memory, programmable I/O buffer support, pre-engineered source-synchronous I/O and embedded system functions (SPI, I2C, timers) that enhance integration and system-level flexibility.

Typical Applications

• Interface Bridging and Glue Logic – Use the device to consolidate multiple peripheral interfaces and implement protocol conversion between system components.
• Embedded System Control – Leverage on-chip logic and memory for control tasks, timers and peripheral management using available SPI and I2C functions.
• Display and High-Speed I/O Support – The device’s source-synchronous and DDR-oriented I/O capabilities from the MachXO2 family make it suited for display controllers and high-speed interface buffering.
• Peripheral Aggregation – High I/O count enables aggregation of sensors, switches and communications interfaces into a single programmable device.

Unique Advantages

• Mid-Density Integration – 4,320 logic elements and ~92 kbits of on-chip RAM enable consolidation of multiple discrete components into a single FPGA, reducing BOM and board complexity.
• High I/O Count – 206 I/Os provide flexible connectivity for complex board-level designs without external expander chips.
• Compact BGA Package – 256-ball 17 mm × 17 mm ftBGA package supports high-density PCB layouts while maintaining surface-mount assembly compatibility.
• Low-Voltage Operation – Narrow supply range (1.14 V to 1.26 V) aligns with modern low-voltage system rails for streamlined power design.
• Commercial Temperature Suitability – Rated for 0 °C to 85 °C, appropriate for a wide range of commercial embedded applications.
• RoHS Compliant – Meets environmental regulatory requirements for lead-free assembly.

Why Choose LCMXO2-4000ZE-1FTG256C?

The LCMXO2-4000ZE-1FTG256C provides a balanced combination of logic capacity, on-chip memory and high I/O density in a compact ftBGA package, making it well-suited for commercial embedded designs that require flexible interface integration and programmable control. Its low-voltage operation, family-level features (non-volatile configuration, programmable I/O options and embedded system peripherals) and RoHS compliance deliver practical system-level benefits—reduced component count, simplified power design and straightforward integration.

This device is ideal for engineers building mid-density, I/O-intensive systems who need a programmable, surface-mount solution with verified operating ranges and package options backed by the MachXO2 family feature set.

Request a quote or submit a quotation request today to begin procurement for the LCMXO2-4000ZE-1FTG256C.