LCMXO2-4000ZE-1FG484I

IC FPGA 278 I/O 484FBGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 278 94208 4320 484-BBGA

Quantity 520 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O278Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs540Number of Logic Elements/Cells4320
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO2-4000ZE-1FG484I – MachXO2 FPGA, 4320 logic elements, 484‑BBGA

The LCMXO2-4000ZE-1FG484I is a MachXO2 family field programmable gate array (FPGA) offered in a 484-ball BGA package. It provides a mid-range programmable logic solution with 4,320 logic elements, approximately 94,208 bits of on‑chip RAM and up to 278 I/Os, targeting applications that require flexible I/O interfacing and reliable operation across industrial temperature ranges.

This device combines configurable logic, embedded memory and on‑chip nonvolatile features (family supports on‑chip user flash memory and background programming) with low power operation and extensive I/O programmability, making it suitable for designs needing system-level integration and robust in-field reconfiguration.

Key Features

  • Logic Capacity — 4,320 logic elements (cells) to implement custom combinational and sequential logic functions.
  • On‑chip Memory — Approximately 94,208 bits of total RAM for distributed and embedded storage needs.
  • Rich I/O — Up to 278 I/O pins for dense interfacing; programmable sysIO buffer supports a wide range of interface standards as described by the MachXO2 family.
  • Nonvolatile and Reconfigurable — Family-level on‑chip user flash memory and support for background programming and in-field reconfiguration (TransFR) for updates while the system operates.
  • Low Power Architecture — Built on an advanced low‑power process with standby modes and power-saving options documented for the MachXO2 family.
  • Flexible Clocking and PLLs — Multiple primary clocks and on‑chip PLL options for common clocking needs (family supports up to two analog PLLs and multiple primary clocks).
  • Industrial Temperature Grade — Specified operating range from −40 °C to 100 °C for deployment in industrial environments.
  • Supply and Packaging — Single supply operation in the range of 1.14 V to 1.26 V; surface-mount 484-ball package (product lists 484‑BBGA and supplier package 484‑FBGA, 23 × 23 mm).
  • Standards & Reliability — RoHS compliant; family-level features include IEEE 1149.1 boundary scan and IEEE 1532 in-system programming support.

Typical Applications

  • Industrial Control and Automation — Industrial-grade temperature range and flexible I/O make this FPGA suitable for sensor interfacing, control logic and protocol bridging in industrial systems.
  • Interface Bridging & Protocol Conversion — High I/O count and programmable I/O standards enable bridging between diverse digital interfaces and custom protocol implementations.
  • User Interface and Display Control — On‑chip gearing and DDR/register features in the family support display and user-interface timing requirements.
  • Embedded System Glue Logic — Use as a compact, single-chip solution for system glue logic, timing control and peripheral aggregation with nonvolatile configuration.

Unique Advantages

  • High Logic Density: 4,320 logic elements provide substantial capacity for mid-range custom logic without excessive board area.
  • Large I/O Count: 278 I/Os allow direct connection to multiple peripherals and buses, reducing the need for external multiplexers or IO expanders.
  • Nonvolatile, Field‑Updatable: On‑chip user flash and TransFR reconfiguration enable secure, in-field firmware and logic updates without external memory.
  • Industrial Robustness: Operation from −40 °C to 100 °C and surface‑mount BGA packaging support reliable deployment in industrial environments.
  • Power‑Efficient Operation: Low-power family design and standby modes lower system power draw during idle conditions.
  • System Integration: Family-level peripherals (SPI, I2C, timers, oscillator and boundary-scan support) simplify board-level design and reduce BOM count.

Why Choose LCMXO2-4000ZE-1FG484I?

The LCMXO2-4000ZE-1FG484I positions itself as a versatile mid-range FPGA offering a balance of logic capacity, abundant I/O and on‑chip memory, combined with industrial temperature support and low power characteristics. It is well suited to engineers seeking a compact, single-chip programmable solution for control, interfacing, and system-level glue logic in industrial and embedded designs.

With family-provided features such as nonvolatile configuration, background programming, flexible I/O standards and system-level peripherals, this device delivers long‑term value through field updateability, simplified hardware integration and reduced component count.

Request a quote or submit a pricing inquiry to check availability and delivery for the LCMXO2-4000ZE-1FG484I. Our team will provide lead time and ordering information tailored to your project needs.

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