LCMXO2-4000ZE-1BG332I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 274 94208 4320 332-FBGA |
|---|---|
| Quantity | 1,518 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 332-CABGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 332-FBGA | Number of I/O | 274 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 540 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO2-4000ZE-1BG332I – MachXO2 FPGA, 4,320 logic elements, 274 I/Os, 332-CABGA (17×17)
The LCMXO2-4000ZE-1BG332I is a MachXO2 family field programmable gate array (FPGA) offered in a 332-ball caBGA package (17×17). It provides flexible logic resources and dense I/O for industrial designs that require configurable glue logic, interface bridging, and system control functions.
Designed on an advanced 65 nm low-power process, this industrial-grade device delivers approximately 4,320 logic elements and roughly 94 kbits of on-chip RAM, with a wide I/O count and instant-on, non-volatile configuration capabilities suitable for embedded and system-level integration.
Key Features
- Core Logic Approximately 4,320 logic elements (cells) suitable for glue logic, sequencing, and custom control functions.
- Embedded Memory Approximately 94 kbits of total on-chip RAM (94,208 bits) for FIFOs, small buffers, and distributed storage.
- I/O Density Up to 274 user I/Os to support wide peripheral connectivity and multi-channel interfaces.
- Low‑Power Process Built on an advanced 65 nm low-power process; family features include ultra low standby power and programmable low-swing differential I/Os.
- On‑Chip Non‑Volatile & Reconfiguration MachXO2 family supports on-chip user flash and instant-on single-chip, secure configuration with background programming and in-field reconfiguration.
- Clocking and PLLs Family-level support includes multiple primary clocks and up to two analog PLLs for flexible clock generation and fractional-N synthesis.
- Hardened System Functions MachXO2 family offers on-chip SPI, I2C, timer/counter and IEEE 1149.1 boundary scan for system-level integration and testability.
- Package and Temperature 332-ball caBGA (17×17) package with industrial operating temperature range from −40 °C to 100 °C and surface-mount mounting.
- Supply Voltage Single-core supply range specified from 1.14 V to 1.26 V for the core power domain.
Typical Applications
- Industrial Control Use the device for interface glue logic, sequencing, and peripheral aggregation in industrial automation where an industrial temperature range is required.
- Interface Bridging Leverage the high I/O count and programmable I/O buffers to bridge between multiple serial and parallel interfaces in embedded systems.
- System Management & Security On-chip non-volatile configuration and hardened SPI/I2C functions enable secure boot, configuration management, and system monitoring tasks.
- Display and Memory Interfaces Family features for source-synchronous I/O and dedicated DDR/DDR2 support can be applied to display IO gearing and memory interface control in complex boards.
Unique Advantages
- High I/O Count: 274 I/Os provide the pin density needed for multi-sensor, multi-peripheral, or mixed-signal interface designs without external multiplexing.
- Compact, Industry‑rated Packaging: 332-ball caBGA (17×17) offers a compact footprint with an operating range of −40 °C to 100 °C for industrial deployments.
- Non‑Volatile Instant‑On: MachXO2 family instant-on and on-chip non-volatile configuration simplify system startup and eliminate external boot memory requirements for many designs.
- Embedded Memory for System Logic: Approximately 94 kbits of on-chip RAM supports FIFOs and buffering—reducing the need for small external SRAM in many applications.
- Low-Power Architecture: Advanced 65 nm low-power process and family standby options reduce system idle power for battery-assisted or energy-conscious designs.
Why Choose LCMXO2-4000ZE-1BG332I?
This MachXO2 device balances substantial logic capacity (approximately 4,320 logic elements) with a high I/O count and on-chip memory in a compact 332-ball caBGA package, making it well suited for industrial and embedded system designs that require flexible interfacing, instant-on configuration, and robust operating temperature range. The device leverages MachXO2 family-level system functions—including SPI, I2C, timers, and secure configuration features—helping reduce board-level complexity and parts count.
For engineers and procurement teams building scalable, reconfigurable systems, the LCMXO2-4000ZE-1BG332I offers an integrated solution that simplifies integration while providing the configurability and reliability expected from industrial-grade FPGA components.
Request a quote or submit an inquiry to receive pricing and availability for the LCMXO2-4000ZE-1BG332I. Our team can provide lead-time, packaging, and ordering details to support your design and procurement needs.