LCMXO2-4000ZE-1BG332I

IC FPGA 274 I/O 332CABGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 274 94208 4320 332-FBGA

Quantity 1,518 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package332-CABGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case332-FBGANumber of I/O274Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs540Number of Logic Elements/Cells4320
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO2-4000ZE-1BG332I – MachXO2 FPGA, 4,320 logic elements, 274 I/Os, 332-CABGA (17×17)

The LCMXO2-4000ZE-1BG332I is a MachXO2 family field programmable gate array (FPGA) offered in a 332-ball caBGA package (17×17). It provides flexible logic resources and dense I/O for industrial designs that require configurable glue logic, interface bridging, and system control functions.

Designed on an advanced 65 nm low-power process, this industrial-grade device delivers approximately 4,320 logic elements and roughly 94 kbits of on-chip RAM, with a wide I/O count and instant-on, non-volatile configuration capabilities suitable for embedded and system-level integration.

Key Features

  • Core Logic  Approximately 4,320 logic elements (cells) suitable for glue logic, sequencing, and custom control functions.
  • Embedded Memory  Approximately 94 kbits of total on-chip RAM (94,208 bits) for FIFOs, small buffers, and distributed storage.
  • I/O Density  Up to 274 user I/Os to support wide peripheral connectivity and multi-channel interfaces.
  • Low‑Power Process  Built on an advanced 65 nm low-power process; family features include ultra low standby power and programmable low-swing differential I/Os.
  • On‑Chip Non‑Volatile & Reconfiguration  MachXO2 family supports on-chip user flash and instant-on single-chip, secure configuration with background programming and in-field reconfiguration.
  • Clocking and PLLs  Family-level support includes multiple primary clocks and up to two analog PLLs for flexible clock generation and fractional-N synthesis.
  • Hardened System Functions  MachXO2 family offers on-chip SPI, I2C, timer/counter and IEEE 1149.1 boundary scan for system-level integration and testability.
  • Package and Temperature  332-ball caBGA (17×17) package with industrial operating temperature range from −40 °C to 100 °C and surface-mount mounting.
  • Supply Voltage  Single-core supply range specified from 1.14 V to 1.26 V for the core power domain.

Typical Applications

  • Industrial Control  Use the device for interface glue logic, sequencing, and peripheral aggregation in industrial automation where an industrial temperature range is required.
  • Interface Bridging  Leverage the high I/O count and programmable I/O buffers to bridge between multiple serial and parallel interfaces in embedded systems.
  • System Management & Security  On-chip non-volatile configuration and hardened SPI/I2C functions enable secure boot, configuration management, and system monitoring tasks.
  • Display and Memory Interfaces  Family features for source-synchronous I/O and dedicated DDR/DDR2 support can be applied to display IO gearing and memory interface control in complex boards.

Unique Advantages

  • High I/O Count:  274 I/Os provide the pin density needed for multi-sensor, multi-peripheral, or mixed-signal interface designs without external multiplexing.
  • Compact, Industry‑rated Packaging:  332-ball caBGA (17×17) offers a compact footprint with an operating range of −40 °C to 100 °C for industrial deployments.
  • Non‑Volatile Instant‑On:  MachXO2 family instant-on and on-chip non-volatile configuration simplify system startup and eliminate external boot memory requirements for many designs.
  • Embedded Memory for System Logic:  Approximately 94 kbits of on-chip RAM supports FIFOs and buffering—reducing the need for small external SRAM in many applications.
  • Low-Power Architecture:  Advanced 65 nm low-power process and family standby options reduce system idle power for battery-assisted or energy-conscious designs.

Why Choose LCMXO2-4000ZE-1BG332I?

This MachXO2 device balances substantial logic capacity (approximately 4,320 logic elements) with a high I/O count and on-chip memory in a compact 332-ball caBGA package, making it well suited for industrial and embedded system designs that require flexible interfacing, instant-on configuration, and robust operating temperature range. The device leverages MachXO2 family-level system functions—including SPI, I2C, timers, and secure configuration features—helping reduce board-level complexity and parts count.

For engineers and procurement teams building scalable, reconfigurable systems, the LCMXO2-4000ZE-1BG332I offers an integrated solution that simplifies integration while providing the configurability and reliability expected from industrial-grade FPGA components.

Request a quote or submit an inquiry to receive pricing and availability for the LCMXO2-4000ZE-1BG332I. Our team can provide lead-time, packaging, and ordering details to support your design and procurement needs.

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