LCMXO2-4000ZE-2FTG256I

IC FPGA 206 I/O 256FTBGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 206 94208 4320 256-LBGA

Quantity 1,502 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O206Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs540Number of Logic Elements/Cells4320
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO2-4000ZE-2FTG256I – MachXO2 FPGA IC, 256‑LBGA

The LCMXO2-4000ZE-2FTG256I is a MachXO2 family field programmable gate array (FPGA) in a 256-ball BGA package. It provides an integrated, low-power logic fabric with abundant I/O and embedded memory for control, glue-logic and interface applications in industrial environments.

With 4,320 logic elements, approximately 92 kbits of embedded RAM and 206 I/Os, this industrial-grade device targets designs that require dense I/O, flexible on-chip resources and non-volatile configuration options while operating across an extended temperature range.

Key Features

  • Core Logic — 4,320 logic elements (LUT-based architecture) suitable for glue logic, control state machines and moderate-density programmable functions.
  • Embedded Memory — Approximately 92 kbits of on-chip RAM (total RAM bits: 94,208) plus family-level support for on-chip user flash memory (family supports up to 256 kbits UFM) for configuration and small data storage.
  • I/O and Interfaces — 206 general-purpose I/Os available for diverse interface needs; family-level programmable sysIO buffer supports a wide range of standards and on-chip differential termination as described in the MachXO2 family data.
  • Power — Low-power architecture with advanced 65 nm process characteristics and family-level standby modes; datasheet notes standby currents as low as 22 µW in minimal-power states.
  • Clocking and PLLs — Family supports flexible on-chip clocking including multiple primary clocks and up to two analog PLLs; XO2-4000 devices include two PLLs for frequency synthesis and clock management.
  • Non-volatile and Reconfiguration — Instant-on, single-chip non-volatile reconfiguration with background programming capability and TransFR™ reconfiguration for in-field logic updates while the system operates (family-level features).
  • Package & Mounting — 256-ball LBGA / 256-FTBGA (17 × 17 mm) surface-mount package for compact board integration.
  • Supply & Temperature — Operating supply range of 1.14 V to 1.26 V and industrial operating temperature range of −40 °C to 100 °C.
  • System Integration — Hardened on-chip peripherals at the family level (SPI, I²C, timer/counter, oscillator) and IEEE boundary-scan support to simplify system-level integration and test.
  • Regulatory Status — RoHS compliant.

Typical Applications

  • Industrial Control — Replace fixed glue logic for motor control, sensor aggregation and real-time control tasks where extended temperature range and industrial-grade components are required.
  • Interface Bridging and Protocol Conversion — Use the large I/O count and flexible sysIO buffering to implement protocol translation, bus bridging and front-end interface logic.
  • System Glue and Utility Functions — Implement timers, counters, SPI/I²C masters or peripherals, and small embedded state machines to reduce external components and streamline BOM.
  • Field Upgradeable Systems — Leverage non-volatile configuration and in-field reconfiguration to perform firmware updates and incremental feature upgrades without hardware replacement.

Unique Advantages

  • High I/O Density in a Compact Package: 206 I/Os in a 256-ball BGA footprint enable dense interface routing without a larger board area.
  • Integrated Memory and Flash Options: On-chip RAM (≈92 kbits) and family support for user flash simplify small-data buffering and non-volatile storage for configuration and parameters.
  • Industrial Temperature Rating: Rated for −40 °C to 100 °C operation to support demanding environmental conditions common in industrial deployments.
  • Low-Power Operation: Low standby power modes and a 65 nm low-power process reduce system power consumption when full logic activity is not required.
  • Flexible Clocking and PLLs: Multiple primary clocks and two PLLs on XO2-4000 devices provide clock synthesis and distribution for assorted timing domains.
  • In-Field Reconfigurability: TransFR™ reconfiguration and background programming capabilities allow updates and feature evolution without taking the system offline.

Why Choose LCMXO2-4000ZE-2FTG256I?

This MachXO2 device balances a mid-range logic fabric (4,320 logic elements) with substantial I/O (206 pins) and embedded memory (≈92 kbits) in a compact 256-ball BGA package. Its industrial temperature rating and low-power family characteristics make it well suited for control, interface and system glue logic in industrial applications that demand reliable, field-updatable hardware.

Designers benefit from the MachXO2 family ecosystem of on-chip peripherals, flexible I/O options and reconfiguration features, delivering a scalable platform for products that require long-term maintainability and in-field updates.

Request a quote or submit an RFQ to evaluate the LCMXO2-4000ZE-2FTG256I for your next design.

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