LCMXO2-4000ZE-2FTG256I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 206 94208 4320 256-LBGA |
|---|---|
| Quantity | 1,502 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 206 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 540 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO2-4000ZE-2FTG256I – MachXO2 FPGA IC, 256‑LBGA
The LCMXO2-4000ZE-2FTG256I is a MachXO2 family field programmable gate array (FPGA) in a 256-ball BGA package. It provides an integrated, low-power logic fabric with abundant I/O and embedded memory for control, glue-logic and interface applications in industrial environments.
With 4,320 logic elements, approximately 92 kbits of embedded RAM and 206 I/Os, this industrial-grade device targets designs that require dense I/O, flexible on-chip resources and non-volatile configuration options while operating across an extended temperature range.
Key Features
- Core Logic — 4,320 logic elements (LUT-based architecture) suitable for glue logic, control state machines and moderate-density programmable functions.
- Embedded Memory — Approximately 92 kbits of on-chip RAM (total RAM bits: 94,208) plus family-level support for on-chip user flash memory (family supports up to 256 kbits UFM) for configuration and small data storage.
- I/O and Interfaces — 206 general-purpose I/Os available for diverse interface needs; family-level programmable sysIO buffer supports a wide range of standards and on-chip differential termination as described in the MachXO2 family data.
- Power — Low-power architecture with advanced 65 nm process characteristics and family-level standby modes; datasheet notes standby currents as low as 22 µW in minimal-power states.
- Clocking and PLLs — Family supports flexible on-chip clocking including multiple primary clocks and up to two analog PLLs; XO2-4000 devices include two PLLs for frequency synthesis and clock management.
- Non-volatile and Reconfiguration — Instant-on, single-chip non-volatile reconfiguration with background programming capability and TransFR™ reconfiguration for in-field logic updates while the system operates (family-level features).
- Package & Mounting — 256-ball LBGA / 256-FTBGA (17 × 17 mm) surface-mount package for compact board integration.
- Supply & Temperature — Operating supply range of 1.14 V to 1.26 V and industrial operating temperature range of −40 °C to 100 °C.
- System Integration — Hardened on-chip peripherals at the family level (SPI, I²C, timer/counter, oscillator) and IEEE boundary-scan support to simplify system-level integration and test.
- Regulatory Status — RoHS compliant.
Typical Applications
- Industrial Control — Replace fixed glue logic for motor control, sensor aggregation and real-time control tasks where extended temperature range and industrial-grade components are required.
- Interface Bridging and Protocol Conversion — Use the large I/O count and flexible sysIO buffering to implement protocol translation, bus bridging and front-end interface logic.
- System Glue and Utility Functions — Implement timers, counters, SPI/I²C masters or peripherals, and small embedded state machines to reduce external components and streamline BOM.
- Field Upgradeable Systems — Leverage non-volatile configuration and in-field reconfiguration to perform firmware updates and incremental feature upgrades without hardware replacement.
Unique Advantages
- High I/O Density in a Compact Package: 206 I/Os in a 256-ball BGA footprint enable dense interface routing without a larger board area.
- Integrated Memory and Flash Options: On-chip RAM (≈92 kbits) and family support for user flash simplify small-data buffering and non-volatile storage for configuration and parameters.
- Industrial Temperature Rating: Rated for −40 °C to 100 °C operation to support demanding environmental conditions common in industrial deployments.
- Low-Power Operation: Low standby power modes and a 65 nm low-power process reduce system power consumption when full logic activity is not required.
- Flexible Clocking and PLLs: Multiple primary clocks and two PLLs on XO2-4000 devices provide clock synthesis and distribution for assorted timing domains.
- In-Field Reconfigurability: TransFR™ reconfiguration and background programming capabilities allow updates and feature evolution without taking the system offline.
Why Choose LCMXO2-4000ZE-2FTG256I?
This MachXO2 device balances a mid-range logic fabric (4,320 logic elements) with substantial I/O (206 pins) and embedded memory (≈92 kbits) in a compact 256-ball BGA package. Its industrial temperature rating and low-power family characteristics make it well suited for control, interface and system glue logic in industrial applications that demand reliable, field-updatable hardware.
Designers benefit from the MachXO2 family ecosystem of on-chip peripherals, flexible I/O options and reconfiguration features, delivering a scalable platform for products that require long-term maintainability and in-field updates.
Request a quote or submit an RFQ to evaluate the LCMXO2-4000ZE-2FTG256I for your next design.