LCMXO2-4000ZE-2FG484C
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 278 94208 4320 484-BBGA |
|---|---|
| Quantity | 1,479 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 278 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 540 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO2-4000ZE-2FG484C – MachXO2 FPGA, 4,320 Logic Elements, 484-BBGA
The LCMXO2-4000ZE-2FG484C is a MachXO2 field-programmable gate array (FPGA) IC from Lattice Semiconductor Corporation. It pairs a mid-density logic fabric of 4,320 logic elements with extensive I/O capability and low-power operation for embedded control, interface bridging and system glue logic.
Designed for commercial applications, this device integrates on-chip RAM and flexible I/O standards while supporting instant-on, non-volatile configuration and in-field reconfiguration to simplify system designs that require rapid boot, configurable logic and broad interface support.
Key Features
- Core Logic — 4,320 logic elements (LUT4-based architecture) providing mid-range density for glue logic, protocol adaptation and control functions.
- Embedded Memory — Total on-chip RAM of 94,208 bits (approximately 94 kbits) for distributed and block RAM requirements, plus family-level embedded memory features for buffering and small data storage.
- I/O Capacity and Flexibility — 278 user I/Os in a 484-ball BGA package supporting a wide range of interface standards and programmable I/O buffer options as described in MachXO2 family data.
- Power and Supply — Single-core supply range specified at 1.14 V to 1.26 V and family-level ultra-low-power design options, including very low standby power modes.
- Clocking and PLLs — Family-level flexible on-chip clocking with eight primary clocks and support for up to two analog PLLs for frequency synthesis and high-speed IO timing.
- Non-volatile Configuration and Reconfiguration — Instant-on, single-chip non-volatile configuration with support for background programming and in-field logic update (TransFR™) as part of MachXO2 family features.
- Packaging and Temperature — 484-ball FBGA package (23 mm × 23 mm) in surface-mount form; commercial operating temperature range 0 °C to 85 °C.
- Standards and Compliance — RoHS compliant; supports industry-standard programming and debug interfaces referenced in MachXO2 family documentation.
Typical Applications
- Interface Bridging and Glue Logic — Use this FPGA to consolidate and implement custom protocol translation, timing adaptation and glue logic between system components.
- Memory and Display Interfaces — Suitable for designs requiring source-synchronous or DDR-style I/O and gearing for display or memory interface handling, leveraging the MachXO2 I/O and DDR-friendly features.
- Instant-On Control — Ideal for systems that need secure, non-volatile instant-on configuration and background updates to field-upgrade logic while the system operates.
- Low-Power Embedded Systems — Beneficial in battery-conscious or always-on devices where standby power and configurable power-saving modes are important.
Unique Advantages
- High I/O Count with Mid-Density Logic: 278 I/Os paired with 4,320 logic elements lets you consolidate multiple functions into a single device and reduce PCB BOM.
- On-Chip Memory Resources: Approximately 94 kbits of on-chip RAM provides local buffering and state storage for control and interface tasks without external SRAM.
- Non-Volatile, Instant-On Operation: Single-chip non-volatile configuration enables fast power-up and secure boot scenarios without external configuration PROM.
- Flexible, High-Performance I/O: MachXO2 family programmable sysIO buffers and DDR-capable I/O cells support diverse interface standards and high-speed signaling needs.
- Low Standby Power and Power-Saving Modes: Family-level low-power features reduce energy consumption for always-on or power-sensitive applications.
- Scalable Family Migration: Density migration is supported across the MachXO2 family, helping designs scale up or down within the same architecture.
Why Choose LCMXO2-4000ZE-2FG484C?
This MachXO2 device delivers a balanced combination of mid-range logic density, extensive I/O, embedded memory and non-volatile configuration—making it well suited for designers who need flexible interface support, instant-on operation and in-field reprogrammability in a commercial-temperature, surface-mount package. The 484-ball FBGA package and 1.14–1.26 V supply range provide a compact, integrated solution for embedded systems, control logic and interface bridging.
Built on MachXO2 family capabilities, the LCMXO2-4000ZE-2FG484C offers a clear upgrade path across device densities, enabling scalability and longevity for product lines that may evolve over time.
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