LCMXO2-4000ZE-2FG484C

IC FPGA 278 I/O 484FBGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 278 94208 4320 484-BBGA

Quantity 1,479 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O278Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs540Number of Logic Elements/Cells4320
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO2-4000ZE-2FG484C – MachXO2 FPGA, 4,320 Logic Elements, 484-BBGA

The LCMXO2-4000ZE-2FG484C is a MachXO2 field-programmable gate array (FPGA) IC from Lattice Semiconductor Corporation. It pairs a mid-density logic fabric of 4,320 logic elements with extensive I/O capability and low-power operation for embedded control, interface bridging and system glue logic.

Designed for commercial applications, this device integrates on-chip RAM and flexible I/O standards while supporting instant-on, non-volatile configuration and in-field reconfiguration to simplify system designs that require rapid boot, configurable logic and broad interface support.

Key Features

  • Core Logic — 4,320 logic elements (LUT4-based architecture) providing mid-range density for glue logic, protocol adaptation and control functions.
  • Embedded Memory — Total on-chip RAM of 94,208 bits (approximately 94 kbits) for distributed and block RAM requirements, plus family-level embedded memory features for buffering and small data storage.
  • I/O Capacity and Flexibility — 278 user I/Os in a 484-ball BGA package supporting a wide range of interface standards and programmable I/O buffer options as described in MachXO2 family data.
  • Power and Supply — Single-core supply range specified at 1.14 V to 1.26 V and family-level ultra-low-power design options, including very low standby power modes.
  • Clocking and PLLs — Family-level flexible on-chip clocking with eight primary clocks and support for up to two analog PLLs for frequency synthesis and high-speed IO timing.
  • Non-volatile Configuration and Reconfiguration — Instant-on, single-chip non-volatile configuration with support for background programming and in-field logic update (TransFR™) as part of MachXO2 family features.
  • Packaging and Temperature — 484-ball FBGA package (23 mm × 23 mm) in surface-mount form; commercial operating temperature range 0 °C to 85 °C.
  • Standards and Compliance — RoHS compliant; supports industry-standard programming and debug interfaces referenced in MachXO2 family documentation.

Typical Applications

  • Interface Bridging and Glue Logic — Use this FPGA to consolidate and implement custom protocol translation, timing adaptation and glue logic between system components.
  • Memory and Display Interfaces — Suitable for designs requiring source-synchronous or DDR-style I/O and gearing for display or memory interface handling, leveraging the MachXO2 I/O and DDR-friendly features.
  • Instant-On Control — Ideal for systems that need secure, non-volatile instant-on configuration and background updates to field-upgrade logic while the system operates.
  • Low-Power Embedded Systems — Beneficial in battery-conscious or always-on devices where standby power and configurable power-saving modes are important.

Unique Advantages

  • High I/O Count with Mid-Density Logic: 278 I/Os paired with 4,320 logic elements lets you consolidate multiple functions into a single device and reduce PCB BOM.
  • On-Chip Memory Resources: Approximately 94 kbits of on-chip RAM provides local buffering and state storage for control and interface tasks without external SRAM.
  • Non-Volatile, Instant-On Operation: Single-chip non-volatile configuration enables fast power-up and secure boot scenarios without external configuration PROM.
  • Flexible, High-Performance I/O: MachXO2 family programmable sysIO buffers and DDR-capable I/O cells support diverse interface standards and high-speed signaling needs.
  • Low Standby Power and Power-Saving Modes: Family-level low-power features reduce energy consumption for always-on or power-sensitive applications.
  • Scalable Family Migration: Density migration is supported across the MachXO2 family, helping designs scale up or down within the same architecture.

Why Choose LCMXO2-4000ZE-2FG484C?

This MachXO2 device delivers a balanced combination of mid-range logic density, extensive I/O, embedded memory and non-volatile configuration—making it well suited for designers who need flexible interface support, instant-on operation and in-field reprogrammability in a commercial-temperature, surface-mount package. The 484-ball FBGA package and 1.14–1.26 V supply range provide a compact, integrated solution for embedded systems, control logic and interface bridging.

Built on MachXO2 family capabilities, the LCMXO2-4000ZE-2FG484C offers a clear upgrade path across device densities, enabling scalability and longevity for product lines that may evolve over time.

Request a quote or submit an inquiry to receive pricing and availability for the LCMXO2-4000ZE-2FG484C.

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