LCMXO2-4000ZE-2BG332C

The LCMXO2-4000ZE-2BG332C is a MachXO2 family field programmable gate array (FPGA) offered by Lattice Semiconductor. It delivers flexible, non-volatile programmable logic with 4,320 logic elements and a rich I/O complement, optimized for low-power system logic and interface tasks.

Built for applications that require high I/O density, embedded memory and low standby power, this device combines on-chip memory, configurable I/O standards and single-supply operation to simplify system design and reduce board-level components.

Key Features

• Logic Capacity — 4,320 logic elements (cells) for implementing glue logic, control functions and custom peripherals.
• Embedded Memory — Approximately 94,208 bits of on-chip RAM to support FIFOs, small buffers and local data storage.
• High I/O Count — 274 user I/Os to support wide bus interfaces, multiple peripherals and high pin-count connectivity.
• Low-Voltage Operation — Single-supply voltage range of 1.14 V to 1.26 V to support low-power system architectures.
• Low Power Family Features — MachXO2 family characteristics such as ultra-low standby power and programmable low-swing differential I/Os help minimize overall system power.
• On-Chip Configuration and System Functions — Family-level capabilities include on-chip user flash memory, instant-on configuration, in-system programming via standard interfaces, and hardened functions such as SPI and I²C.
• Flexible Clocking — Family-level clock features include multiple primary clocks and up to two analog PLLs for flexible clock generation and distribution.
• Package and Mounting — 332-ball FBGA package; supplier device package listed as 332-caBGA (17 × 17 mm). Surface-mount mounting type for compact PCB integration.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature.
• RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

• Interface and Glue Logic — Implement bus bridging, protocol translation and custom interface logic where high I/O count and reprogrammability are required.
• Embedded Control — Replace multiple discrete devices with configurable logic and on-chip memory for timers, counters and control state machines.
• Display and High-Speed I/O — Use the device’s high I/O density and family-level source-synchronous I/O features for display interfaces and wide-parallel data paths.
• System Monitoring and Peripheral Aggregation — Centralize peripheral interfacing (SPI, I²C) and local buffering while keeping a small BOM.

Unique Advantages

• Highly Integrated I/O — 274 I/Os reduce the need for external multiplexers and interface chips, simplifying board layout and lowering component count.
• Compact, Surface-Mount Package — 332-ball caBGA (17 × 17 mm) package provides high pin density in a compact footprint for space-constrained designs.
• Low-Voltage, Low-Power Operation — Narrow supply range and MachXO2 family low-power features help reduce system power consumption and thermal requirements.
• On-Board Memory for Local Data Handling — Approximately 94 kbits of embedded RAM supports FIFOs and buffering without external SRAM, improving performance and reducing BOM.
• Non-Volatile, Reconfigurable — Family-level instant-on and in-system programming simplify deployment and enable field updates without external configuration devices.
• Commercial Temperature Fit — 0 °C to 85 °C rating suited to a wide range of consumer and industrial-adjacent applications where commercial grade is appropriate.

Why Choose LCMXO2-4000ZE-2BG332C?

This MachXO2 device is positioned for designs that need a balance of reprogrammable logic, abundant I/Os and embedded memory while keeping power and board area under control. With 4,320 logic elements, roughly 94 kbits of on-chip RAM and 274 I/Os in a 332-ball caBGA package, it is well suited for system glue logic, interface consolidation and embedded control functions.

Choosing this part provides designers with a scalable, non-volatile FPGA option from the MachXO2 family, backed by family-level features such as instant-on configuration, integrated system functions and low-power operation to support long-term design flexibility and reduced system complexity.

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