LCMXO2-4000ZE-2FTG256C
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 206 94208 4320 256-LBGA |
|---|---|
| Quantity | 1,813 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 206 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 540 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO2-4000ZE-2FTG256C – MachXO2 FPGA, 4,320 logic elements, 206 I/Os, 256-LBGA
The LCMXO2-4000ZE-2FTG256C is a MachXO2 family field programmable gate array (FPGA) in a 256-ball ftBGA package. It provides a flexible, low-power programmable logic fabric with 4,320 logic elements and 206 user I/Os, suitable for commercial embedded designs requiring non-volatile configuration and comprehensive I/O support.
Designed for system control, interface consolidation and in-field reconfiguration, this device pairs a compact surface-mount 256‑LBGA package with on-chip memory and family-level features such as low-power operation, programmable I/O buffers and flexible clocking to simplify integration in space-constrained boards.
Key Features
- Core Logic — 4,320 logic elements (LUT4-based architecture from the MachXO2 family) for glue logic, control and small-to-medium FPGA functions.
- On-chip Memory — Approximately 94,208 bits of total RAM on this device; MachXO2 family also offers embedded block and distributed RAM options for FIFO and buffering needs.
- I/O and Interface Flexibility — 206 user I/Os in a 256-LBGA footprint. The MachXO2 sysIO buffer architecture supports a wide range of interface standards at the family level to accommodate varied signaling requirements.
- Low Voltage Supply — Device supply range specified from 1.14 V to 1.26 V for core operation.
- Low-Power Architecture — Built on an advanced 65 nm low-power process; family features include ultra-low standby power (as low as 22 μW) and programmable power-saving modes.
- Non-volatile Configuration & Reconfiguration — MachXO2 family offers on-chip user flash memory and instant-on capability, with programming and background updates supported via JTAG, SPI and I²C interfaces; TransFR™ enables in-field logic updates.
- Clocking and PLLs — Device supports multiple primary clocks and includes up to two analog PLLs (family-level fractional‑N synthesis with broad input range) for flexible clock management.
- Package and Mounting — 256-ball ftBGA (17 × 17 mm) surface-mount package; commercial-grade device with an operating temperature range of 0 °C to 85 °C.
- Compliance — RoHS compliant.
Typical Applications
- Interface Bridging and Protocol Conversion — High I/O count and flexible sysIO buffering make this device suitable for consolidating interfaces and implementing protocol adapters.
- System Control and Glue Logic — Non-volatile configuration and on-chip flash support instant-on control functions, configuration storage and background updates for system glue logic.
- Display and Memory Interfaces — Family-level pre-engineered source synchronous I/O and DDR gearing features enable implementation of display controllers and DDR interface logic.
- Embedded Peripheral Integration — Hardened functions in the MachXO2 family (SPI, I²C, timers/counters) simplify the integration of peripheral control and housekeeping functions.
Unique Advantages
- Highly integrated solution: 4,320 logic elements and 206 I/Os in a compact 256-LBGA reduce external glue logic and board-level complexity.
- Non-volatile, instant-on capability: On-chip flash and family-level instant-on configuration enable rapid system startup and secure single-chip configuration.
- Flexible I/O support: Programmable sysIO buffers and extensive I/O count provide versatility across signaling standards and board-level roles.
- Low-power operation: Advanced 65 nm low-power process and family power-saving modes reduce standby and runtime power for energy-sensitive designs.
- Field reconfigurability: TransFR™ reconfiguration and background programming let you update logic while the system is operating, minimizing downtime.
- Commercial-grade reliability and compliance: Surface-mount ftBGA packaging, 0 °C to 85 °C operating range and RoHS compliance support mainstream embedded product requirements.
Why Choose LCMXO2-4000ZE-2FTG256C?
This MachXO2 device balances a moderate logic capacity with a high I/O count and embedded memory in a compact 256-LBGA footprint—making it a practical choice for designs that need non-volatile FPGA functionality, flexible I/O and low-power operation without large form-factor impact. Its family-level features—non-volatile configuration, programmable I/O buffers, PLL-based clocking and in-field reconfiguration—provide a versatile platform for control, interface and system-integration tasks in commercial products.
Ideal for engineers needing a reliable, reconfigurable component to consolidate logic, manage interfaces and enable field updates, the LCMXO2-4000ZE-2FTG256C offers a clear, verifiable feature set and compatibility with MachXO2 family tools and workflows.
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