LCMXO2-4000ZE-2BG332I

The LCMXO2-4000ZE-2BG332I is a MachXO2 family field programmable gate array (FPGA) from Lattice Semiconductor designed for industrial-grade embedded applications. It combines a mid-range logic capacity with high I/O density, on-chip RAM, and low-voltage operation to address system control, interface bridging and I/O-intensive designs.

This device provides flexible, non-volatile configuration and system-level features from the MachXO2 family while meeting industrial temperature requirements and surface-mount packaging needs.

Key Features

• Logic Capacity — 4,320 logic elements organized across 540 CLBs, providing mid-range programmable logic for glue logic, control functions and state machines.
• On‑chip Memory — 94,208 bits of embedded RAM available for distributed and block memory needs; the MachXO2 family also supports up to 256 kbits of on‑chip user flash memory for non‑volatile configuration and data storage.
• I/O Density & Flexibility — 274 I/Os with programmable sysIO buffers supporting LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus‑LVDS, MLVDS, RSDS, LVPECL, SSTL 2.5/1.8, HSTL 1.8 and Schmitt trigger inputs; I/Os include features such as DDR registers, programmable differential termination and hot‑socketing support.
• Power & Voltage — Low-voltage operation with a specified supply range of 1.14 V to 1.26 V and family-level ultra-low standby power options as described in the MachXO2 family literature.
• Clocking & PLLs — Flexible on-chip clocking with up to two analog PLLs per device supporting fractional‑N synthesis and a wide input frequency range as provided by the MachXO2 family architecture.
• System Integration — Family features include pre‑engineered source synchronous I/O, dedicated FIFO control logic, on‑chip oscillator, hardened peripherals (SPI, I2C, timer/counter) and instant-on non‑volatile configuration, enabling compact single‑chip system solutions.
• Package & Mounting — 332-ball caBGA/FBGA package in a 17 × 17 mm footprint suitable for surface-mount applications; supplier package listed as 332‑CABGA (17×17).
• Industrial Temperature Grade — Rated for operation from -40 °C to 100 °C, matching industrial environment requirements.
• Standards & In-System Programming — Supports IEEE 1149.1 boundary scan and IEEE 1532 in-system programming methods as part of the MachXO2 family feature set.

Typical Applications

• Display and Video Interface Control — Use the device's source synchronous I/O, DDR registers and dedicated gearing for display I/O to implement timing, serialization and handler functions in display subsystems.
• Memory Interface Glue Logic — Leverage dedicated DDR/DDR2/LPDDR support and FIFO control logic for memory interface buffering, translation and timing alignment tasks.
• System Control and Configuration — On-chip user flash memory, SPI/I2C/JTAG access and timers enable boot control, configuration storage and peripheral supervision in embedded systems.
• High‑Density I/O and Protocol Bridging — The large I/O count and programmable sysIO buffers make the device suitable for protocol conversion, sensor aggregation and multi‑interface bridging.

Unique Advantages

• Balanced Logic and I/O — 4,320 logic elements with 274 I/Os provide a practical balance for designs requiring moderate logic plus high connectivity without additional external glue logic.
• Non‑volatile, Instant‑On Capability — MachXO2 family non‑volatile configuration enables rapid startup and in‑field reconfiguration options to simplify system boot and updates.
• Compact, Surface‑Mount Package — 332‑ball caBGA/FBGA in a 17×17 mm footprint supports dense PCB designs while maintaining high I/O count.
• Industrial Temperature Support — Rated operation from -40 °C to 100 °C supports deployment in industrial environments.
• Flexible I/O Standards — Wide range of supported I/O standards and on‑chip termination let you interface directly with many common signaling types, reducing external components.
• Single‑Chip System Features — Integrated peripherals (SPI, I2C, timers), oscillators and PLLs reduce BOM and ease system integration.

Why Choose LCMXO2-4000ZE-2BG332I?

The LCMXO2-4000ZE-2BG332I positions itself as a flexible, industrial‑grade FPGA option for designs that require a mid-level logic resource combined with very high I/O density and on‑chip memory. Its MachXO2 family features—non‑volatile configuration, programmable I/O buffers, PLLs and hardened peripherals—support compact system architectures that benefit from reduced external components and simplified power/boot management.

This device is well suited to engineers building interface controllers, memory bridges, display controllers and embedded control units where industrial temperature performance, surface‑mount packaging and extensive I/O support are required. The combination of 4,320 logic elements, 94,208 bits of embedded RAM and 274 I/Os delivers a robust platform for scalable, maintainable designs.

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